Laser Soldering System

Patent metadata

Field	Value
Publication number	US-2016346858-A1
Application number	US-201615234091-A
Country	US
Kind code	A1
Filing date	Aug 11, 2016
Priority date	Feb 13, 2014
Publication date	Dec 1, 2016
Grant date	—

Abstract

A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

First claim

What is claimed is:

1 . A laser soldering system, comprising:
a moving system; a gripper mounted on the moving system, the gripper gripping an object and placing the object at a target location on a product to be soldered; a presser mounted on the moving system and having a transparent member, the transparent member pressing the object against the product; and a laser emitting a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

2 . The laser soldering system of claim 1 , further comprising a vision system guiding the gripper to place the object at the target location.

3 . The laser soldering system of claim 1 , wherein the transparent member presses a top surface of the object.

4 . The laser soldering system of claim 1 , wherein the laser heats a soldering flux on the product.

5 . The laser soldering system of claim 4 , wherein the soldering flux is a conductive paste pre-printed on the product, an alloy solder pre-melted or fused on the product, or a welding wire applied to the product during soldering.

6 . The laser soldering system of claim 1 , wherein the object is a wire, the product is a circuit board, and the target location is a pad on the circuit board.

7 . The laser soldering system of claim 6 , wherein gripper positions the wire such that a center line of the wire is aligned with a center line of the pad.

8 . The laser soldering system of claim 6 , wherein the transparent member protrudes from the presser and has an arc recess surface.

9 . The laser soldering system of claim 8 , wherein the arc recess surface directly presses on a top surface of the wire.

10 . The laser soldering system of claim 6 , wherein the wire is arranged on the pad before being gripped by the gripper.

11 . The laser soldering system of claim 3 , wherein the presser forms a slot between opposite sidewalls.

12 . The laser soldering system of claim 11 , wherein the transparent member and the object are disposed in the slot.

13 . The laser soldering system of claim 12 , wherein the sidewalls are made of thermal insulation material.

14 . The laser soldering system of claim 1 , wherein the moving system is a multi-degree of freedom robot arm.

15 . The laser soldering system of claim 1 , wherein the gripper and the presser are removably mounted to the robot.

16 . The laser soldering system of claim 1 , wherein the transparent member is formed of an elastic material.

17 . The laser soldering system of claim 1 , wherein the gripper automatically places the object at the target location, the presser automatically presses the object against the product, and the laser automatically solders the object to the target location.

18 . A laser soldering system, comprising:
a moving system; a gripper mounted on the moving system and having a transparent member, the gripper gripping an object and placing the object at a target location on a product to be soldered, the transparent member pressing the object against the product; and a laser emitting a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.

19 . The laser soldering system of claim 18 , further comprising a vision system guiding the gripper to place the object at the target location.

20 . The laser soldering system of claim 18 , wherein the transparent member presses a top surface of the object.

21 . The laser soldering system of claim 18 , wherein the laser heats a soldering flux on the product.

22 . The laser soldering system of claim 21 , wherein the soldering flux is a conductive paste pre-printed on the product, an alloy solder pre-melted or fused on the product, or a welding wire applied to the product during soldering.

23 . The laser soldering system of claim 18 , wherein the object is a wire, the product is a circuit board, and the target location is a pad on the circuit board.

24 . The laser soldering system of claim 23 , wherein gripper positions the wire such that a center line of the wire is aligned with a center line of the pad.

25 . The laser soldering system of claim 23 , wherein the wire is arranged on the pad before being gripped by the gripper.

26 . The laser soldering system of claim 18 , wherein the moving system is a multi-degree of freedom robot arm.

27 . The laser soldering system of claim 18 , wherein the gripper is removably mounted to the robot.

28 . The laser soldering system of claim 18 , wherein the transparent member is formed of an elastic material.

Assignees

• Tyco Electronics Shanghai Co Ltd
• Tyco Electronics Corp
• Tyco Electronics (Dongguan) Ltd

Inventors

• Shen Hongzhou
• Zhang Dandan
• Lu Roberto Francisco-Yi
• Dubniczki George J
• Zeng Qinglong

Classifications

• H10W72/0711

  Apparatus therefor · CPC title

• B23K26/0884

  in at least three axial directions, e.g. manipulators, robots · CPC title

• B23K26/20 Primary

  Bonding (soldering by means of radiant energy B23K1/005) · CPC title

• H05K3/3421

  Leaded components · CPC title

• H05K2203/107

  Using laser light · CPC title