Interposers for integrated circuits with multiple-time programming and methods for manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016343773-A1
Application number	US-201514719467-A
Country	US
Kind code	A1
Filing date	May 22, 2015
Priority date	May 22, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

An interposer for an integrated circuit includes a first side and a second side. The interposer includes a substrate and a via disposed in the substrate. A first electrical contact is disposed on the first side. A second electrical contact is disposed on the second side and electrically connected to the via. The interposer also includes a multiple-time programmable (“MTP”) element electrically connected to the first electrical contact and/or the via.

First claim

6 . The integrated circuit as set forth in claim 1 , wherein said MTP element is electrically connected between at least one of said first electrical contact and at least one of said plurality of vias.

7 . The integrated circuit as set forth in claim 1 , wherein said plurality of transistors comprises a plurality of metal-oxide-silicon field-effect transistors (MOSFETs) each having a source, a gate, and a drain.

8 . The integrated circuit as set forth in claim 7 , wherein said at least one MTP element is electrically connected to one of said source or said drain of one of said MOSFETs.

9 . The integrated circuit as set forth in claim 1 , further comprising a first chip comprising at least one of said plurality of transistors.

10 . The integrated circuit as set forth in claim 9 , further comprising a second chip electrically connected to at least one of said vias such that said first chip may control power to said second chip via said at least one MTP element.

11 . The integrated circuit as set forth in claim 10 , wherein said second chip comprises at least one of said plurality of transistors.

12 . A method of manufacturing an interposer having a first side and a second side disposed opposite the first side, said method comprising:
forming a first electrical contact on the first side of the interposer; forming a via in a substrate; forming a second electrical contact comprising solder balls on the second side of the interposer and electrically connected to the via; and forming a multiple-time programmable (“MTP”) element electrically connected to the via and/or the first contact.

13 . The method as set forth in claim 12 , wherein said forming the MTP element comprises forming the MTP element with a phase-change material.

14 . The method as set forth in claim 12 , wherein said forming the MTP element comprises forming the MTP element with a magnetic material.

15 . The method as set forth in claim 12 , wherein said forming the MTP element comprises forming a magnetic tunnel junction (“MTJ”) stack.

16 . The method as set forth in claim 12 , wherein forming the MTP element is performed during back-end-of-line (“BEOL”) processing.

17 . The method as set forth in claim 12 , further comprising forming at least one metal layer electrically connected to and disposed between the via and the MTP element.

18 . The method as set forth in claim 12 , further comprising forming an electrical connection between said MTP element and said first electrical contact.

19 . The method as set forth in claim 18 , where said forming an electrical connection between said MTP element and said first electrical contact comprises forming a plurality of metal layers and additional vias.

20 . An interposer for an integrated circuit, said integrated circuit comprising a plurality of transistors, said interposer defining a first side and a second side, comprising:
a substrate; a plurality of vias disposed in said substrate; a plurality of first electrical contacts disposed on said first side of said interposer, wherein at least one of said first electrical contacts is electrically connected to at least one of said-transistors; a plurality of second electrical contacts comprising solder balls disposed on said second side of said interposer, wherein each of said second electrical contacts are electrically connected to at least one of said plurality of vias; and at least one multiple-time programmable (“MTP”) element electrically connected to at least one of said first electrical contacts and at least one of said vias; said at least one MTP element comprising germanium-antimony-tellurium (“GST”).

Assignees

• Globalfoundries Sg Pte Ltd

Inventors

• Tan Juan Boon
• Jiang Yi
• Shum Danny
• Gong Shunqiang

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01L43/08

  Electricity · mapped topic

• H01L43/12

  Electricity · mapped topic

• H01L27/2436 Primary

  Electricity · mapped topic

• H01L45/16

  Electricity · mapped topic