Manufacturing method of semiconductor device

US2016343733A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016343733-A1
Application numberUS-201615226008-A
CountryUS
Kind codeA1
Filing dateAug 2, 2016
Priority dateNov 29, 2013
Publication dateNov 24, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To provide a method for manufacturing a semiconductor device including an oxide semiconductor film having conductivity, or a method for manufacturing a semiconductor device including an oxide semiconductor film having a light-transmitting property and conductivity. The method for manufacturing a semiconductor device includes the steps of forming an oxide semiconductor film over a first insulating film, performing first heat treatment in an atmosphere where oxygen contained in the oxide semiconductor film is released, and performing second heat treatment in a hydrogen-containing atmosphere, so that an oxide semiconductor film having conductivity is formed.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for manufacturing an oxide semiconductor film having conductivity, comprising the steps of: forming an oxide semiconductor film over a substrate; applying a first heat treatment to the oxide semiconductor film to make the oxide semiconductor film including defects; exposing a surface of the oxide semiconductor film to a solution containing boron, phosphorus, an alkali metal, or an alkaline earth metal; and applying a second heat treatment to the oxide semiconductor film to form the oxide semiconductor film having conductivity after the first heat treatment. 2 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein a hydrogen concentration in the oxide semiconductor film having conductivity is increased to higher than or equal to 5×10 20 atoms/cm 3 . 3 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein a resistivity of the oxide semiconductor film having conductivity is greater than or equal to 1×10 −3 Ω·cm and less than 1×10 4 Ω·cm. 4 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein the oxide semiconductor film having conductivity includes a crystal part, and an angle formed between a c-axis of the crystal part and a normal vector of a surface over which the oxide semiconductor film is formed is greater than or equal to −30° and less than or equal to 30°. 5 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein the oxide semiconductor film having conductivity includes at least one of an In—Ga oxide, an In—Zn oxide, and an In-M-Zn oxide (M is Al, Ga, Y, Zr, Sn, La, Ce, or Nd). 6 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , further comprising forming a resistor, the resistor comprising the oxide semiconductor film having conductivity. 7 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , further comprising forming a capacitor, the capacitor comprising the oxide semiconductor film having conductivity as an electrode. 8 . A method for manufacturing an oxide semiconductor film having conductivity, comprising the steps of: forming an oxide semiconductor film over a substrate; adding a rare gas to the oxide semiconductor film by a doping method or an ion implantation method; exposing a surface of the oxide semiconductor film to a solution containing boron, phosphorus, an alkali metal, or an alkaline earth metal; applying a heat treatment to the oxide semiconductor film to form the oxide semiconductor film having conductivity after the first heat treatment. 9 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein a hydrogen concentration in the oxide semiconductor film having conductivity is increased to higher than or equal to 5×10 20 atoms/cm 3 . 10 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the rare gas is at least one of helium, neon, argon, krypton, and xenon. 11 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein a resistivity of the oxide semiconductor film having conductivity is greater than or equal to 1×10 −3 Ω·cm and less than 1×10 4 Ω·cm. 12 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the oxide semiconductor film having conductivity includes a crystal part, and an angle formed between a c-axis of the crystal part and a normal vector of a surface over which the oxide semiconductor film is formed is greater than or equal to −30° and less than or equal to 30°. 13 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the oxide semiconductor film having conductivity includes at least one of an In—Ga oxide, an In—Zn oxide, and an In-M-Zn oxide (M is Al, Ga, Y, Zr, Sn, La, Ce, or Nd). 14 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , further comprising forming a resistor, the resistor comprising the oxide semiconductor film having conductivity. 15 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , further comprising forming a capacitor, the capacitor comprising the oxide semiconductor film having conductivity as an electrode.

Assignees

Inventors

Classifications

  • Thermal treatments, e.g. annealing or sintering · CPC title

  • characterised by the semiconductor materials · CPC title

  • being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title

  • Oxides · CPC title

  • being non-crystalline insulating materials, e.g. glass or polymers · CPC title

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What does patent US2016343733A1 cover?
To provide a method for manufacturing a semiconductor device including an oxide semiconductor film having conductivity, or a method for manufacturing a semiconductor device including an oxide semiconductor film having a light-transmitting property and conductivity. The method for manufacturing a semiconductor device includes the steps of forming an oxide semiconductor film over a first insulati…
Who is the assignee on this patent?
Semiconductor Energy Lab
What technology area does this patent fall under?
Primary CPC classification H10P14/2922. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Nov 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).