Tft substrate, method for producing same, organic el display device, and method for manufacturing organic el display device
US-2015076467-A1 · Mar 19, 2015 · US
US2016343733A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016343733-A1 |
| Application number | US-201615226008-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 2, 2016 |
| Priority date | Nov 29, 2013 |
| Publication date | Nov 24, 2016 |
| Grant date | — |
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To provide a method for manufacturing a semiconductor device including an oxide semiconductor film having conductivity, or a method for manufacturing a semiconductor device including an oxide semiconductor film having a light-transmitting property and conductivity. The method for manufacturing a semiconductor device includes the steps of forming an oxide semiconductor film over a first insulating film, performing first heat treatment in an atmosphere where oxygen contained in the oxide semiconductor film is released, and performing second heat treatment in a hydrogen-containing atmosphere, so that an oxide semiconductor film having conductivity is formed.
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What is claimed is: 1 . A method for manufacturing an oxide semiconductor film having conductivity, comprising the steps of: forming an oxide semiconductor film over a substrate; applying a first heat treatment to the oxide semiconductor film to make the oxide semiconductor film including defects; exposing a surface of the oxide semiconductor film to a solution containing boron, phosphorus, an alkali metal, or an alkaline earth metal; and applying a second heat treatment to the oxide semiconductor film to form the oxide semiconductor film having conductivity after the first heat treatment. 2 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein a hydrogen concentration in the oxide semiconductor film having conductivity is increased to higher than or equal to 5×10 20 atoms/cm 3 . 3 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein a resistivity of the oxide semiconductor film having conductivity is greater than or equal to 1×10 −3 Ω·cm and less than 1×10 4 Ω·cm. 4 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein the oxide semiconductor film having conductivity includes a crystal part, and an angle formed between a c-axis of the crystal part and a normal vector of a surface over which the oxide semiconductor film is formed is greater than or equal to −30° and less than or equal to 30°. 5 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , wherein the oxide semiconductor film having conductivity includes at least one of an In—Ga oxide, an In—Zn oxide, and an In-M-Zn oxide (M is Al, Ga, Y, Zr, Sn, La, Ce, or Nd). 6 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , further comprising forming a resistor, the resistor comprising the oxide semiconductor film having conductivity. 7 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 1 , further comprising forming a capacitor, the capacitor comprising the oxide semiconductor film having conductivity as an electrode. 8 . A method for manufacturing an oxide semiconductor film having conductivity, comprising the steps of: forming an oxide semiconductor film over a substrate; adding a rare gas to the oxide semiconductor film by a doping method or an ion implantation method; exposing a surface of the oxide semiconductor film to a solution containing boron, phosphorus, an alkali metal, or an alkaline earth metal; applying a heat treatment to the oxide semiconductor film to form the oxide semiconductor film having conductivity after the first heat treatment. 9 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein a hydrogen concentration in the oxide semiconductor film having conductivity is increased to higher than or equal to 5×10 20 atoms/cm 3 . 10 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the rare gas is at least one of helium, neon, argon, krypton, and xenon. 11 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein a resistivity of the oxide semiconductor film having conductivity is greater than or equal to 1×10 −3 Ω·cm and less than 1×10 4 Ω·cm. 12 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the oxide semiconductor film having conductivity includes a crystal part, and an angle formed between a c-axis of the crystal part and a normal vector of a surface over which the oxide semiconductor film is formed is greater than or equal to −30° and less than or equal to 30°. 13 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , wherein the oxide semiconductor film having conductivity includes at least one of an In—Ga oxide, an In—Zn oxide, and an In-M-Zn oxide (M is Al, Ga, Y, Zr, Sn, La, Ce, or Nd). 14 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , further comprising forming a resistor, the resistor comprising the oxide semiconductor film having conductivity. 15 . The method for manufacturing an oxide semiconductor film having conductivity according to claim 8 , further comprising forming a capacitor, the capacitor comprising the oxide semiconductor film having conductivity as an electrode.
Thermal treatments, e.g. annealing or sintering · CPC title
characterised by the semiconductor materials · CPC title
being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title
Oxides · CPC title
being non-crystalline insulating materials, e.g. glass or polymers · CPC title
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