Method of laser annealing a semiconductor wafer with localized control of ambient oxygen

Patent metadata

Field	Value
Publication number	US-2016343583-A1
Application number	US-201514714544-A
Country	US
Kind code	A1
Filing date	May 18, 2015
Priority date	Jun 24, 2014
Publication date	Nov 24, 2016
Grant date	—

Abstract

Laser annealing of a semiconductor wafers using a forming gas for localized control of ambient oxygen gas to reduce the amount of oxidization during laser annealing is disclosed. The forming gas includes hydrogen gas and an inert buffer gas such as nitrogen gas. The localized heating of the oxygen gas and the forming gas in the vicinity of the annealing location on the surface of the semiconductor wafer creates a localized region within which combustion of oxygen gas and hydrogen gas occurs to generate water vapor. This combustion reaction reduces the oxygen gas concentration within the localized region, thereby locally reducing the amount of ambient oxygen gas, which in turn reduces oxidation rate at the surface of the semiconductor wafer during the annealing process.

First claim

1 . A method of laser annealing a semiconductor wafer having a surface to reduce or prevent oxidizing the surface, comprising:
a) arranging the semiconductor wafer in an interior of a process chamber; b) pulling a vacuum in the interior of the process chamber such that the interior of the process chamber includes residual O 2 at an initial O 2 concentration, wherein the residual O 2 originates from air that resides in the chamber during act a); c) introducing a forming gas into the process chamber, the forming gas including H 2 and a buffer gas, and wherein no O 2 is added to the process chamber after act a); and d) directing a laser beam to pass through the interior of the process chamber to be incident upon the surface of the semiconductor wafer at an annealing location, thereby annealing the surface of the semiconductor wafer and also causing localized heating of the residual O 2 and the H 2 of the forming gas in a localized region surrounding the annealing location and within which combustion of the residual O 2 and the H 2 occurs to generate H 2 O vapor, thereby reducing the concentration of the residual O 2 in the localized region as compared to the initial concentration of the residual O 2 .

2 . The method according to claim 1 , wherein the forming gas includes 5 vol % H 2 and 95 vol % N 2 .

3 . The method according to claim 1 , wherein the localized region is defined by a combustion temperature T C in the range from 100° C. to 500° C.

4 . The method according to claim 1 , wherein the process chamber comprises a microchamber.

5 . The method according to claim 1 , further comprising moving the semiconductor wafer relative to the laser beam so that the annealing location moves relative to the surface of the semiconductor wafer but stays stationary relative to its initial position in the interior of the process chamber

6 . The method according to claim 1 , wherein the initial O 2 concentration is 50 ppm (vol.) or greater and wherein the reduced O 2 concentration is 10 ppm (vol.) or smaller.

7 . The method according to claim 1 , wherein the semiconductor wafer has a melt temperature T M , wherein the annealing of the surface of the semiconductor wafer is performed at an annealing temperature T A , and wherein T A <T M .

8 . A method of reducing residual oxygen gas in a localized region surrounding an annealing location during annealing of a semiconductor wafer having a surface, the method being directed to reducing or preventing oxidation of the surface and comprising:
introducing a forming gas of hydrogen gas (H 2 ) and a buffer gas into a process chamber under vacuum and that contains the semiconductor wafer and the residual oxygen gas (O 2 ) at an initial concentration, wherein the residual oxygen gas is from air that was originally present in the process chamber before the process chamber was under vacuum, and wherein no oxygen is added to the process chamber under vacuum; and laser annealing the surface of the semiconductor wafer, thereby causing localized heating of the residual oxygen gas and the hydrogen gas of the forming gas in a localized region surrounding the annealing location and within which combustion of the residual oxygen gas and the hydrogen gas occurs to generate water vapor, thereby reducing the concentration of the residual oxygen gas in the localized region as compared to the initial concentration of the residual oxygen gas.

9 . The method according to claim 8 , wherein the buffer gas includes 5 vol % hydrogen gas and 95 vol % nitrogen gas.

10 . The method according to claim 8 , wherein the localized region is defined by a combustion temperature T C in the range from 100° C. to 500° C.

11 . The method according to claim 8 , wherein the process chamber comprises a microchamber.

12 . (canceled)

13 . The method according to claim 8 , further comprising moving the semiconductor wafer relative to a laser beam so that the annealing location moves relative to the surface of the semiconductor wafer but stays stationary relative to its initial position in the interior of the process chamber.

14 . The method according to claim 8 , wherein the initial concentration of the residual oxygen gas is 50 ppm (vol.) or greater and wherein the reduced oxygen concentration is 10 ppm (vol.) or smaller.

15 . The method according to claim 8 , wherein the semiconductor wafer has a melt temperature T M , wherein the annealing of the surface of the semiconductor wafer is performed at an annealing temperature T A , and wherein T A <T M .

16 . A method of laser annealing a semiconductor wafer having a surface, comprising:
arranging the semiconductor wafer in an interior of a process chamber that includes residual O 2 at an initial O 2 concentration due to air originally present in the process chamber and substantially removed by pulling a vacuum; introducing into the process chamber a forming gas comprising H 2 and a buffer gas and wherein no oxygen is added to the process chamber after pulling the vacuum; and directing a laser beam to pass through the interior of the process chamber to be incident upon the surface of the semiconductor wafer at an annealing location, thereby annealing the surface of the semiconductor wafer and also causing localized heating of the residual O 2 and the H 2 of the forming gas in a localized region surrounding the annealing location and within which combustion of residual O 2 and the H 2 occurs to generate H 2 O vapor, thereby reducing the concentration of residual O 2 in the localized region as compared to the initial O 2 -concentration of the residual O 2 .

17 . The method according to claim 16 , wherein the forming gas has a partial pressure in the range from 1 millitorr to 1000 torr.

18 . The method according to claim 17 , wherein the initial O 2 concentration is 50 ppm (vol.) or greater and wherein the reduced O 2 concentration is 10 ppm (vol.) or smaller.

19 . The method according to claim 16 , wherein the process chamber comprises a microchamber.

20 . The method according to claim 16 , wherein the buffer gas consists of 5 vol % hydrogen gas and 95 vol % nitrogen gas.

21 . The method according to claim 1 , wherein the forming gas has a partial pressure in the range from 1 millitorr to 1000 torr.

Assignees

• Ultratech Inc

Inventors

• Mcwhirter James
• Zafiropoulo Arthur W

Classifications

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P95/90 Primary

  Thermal treatments, e.g. annealing or sintering · CPC title

• H01L21/268

  Electricity · mapped topic

• H01L21/324 Primary

  Electricity · mapped topic