Apparatus for advanced packaging applications

Patent metadata

Field	Value
Publication number	US-2016343582-A1
Application number	US-201615231623-A
Country	US
Kind code	A1
Filing date	Aug 8, 2016
Priority date	May 29, 2013
Publication date	Nov 24, 2016
Grant date	—

Abstract

The embodiments disclosed herein pertain to novel methods and apparatus for removing material from a substrate. In certain embodiments, the method and apparatus are used to remove negative photoresist, though the disclosed techniques may be implemented to remove a variety of materials. In practicing the disclosed embodiments, a stripping solution may be introduced from an inlet to an internal manifold, sometimes referred to as a cross flow manifold. The solution flows laterally through a relatively narrow cavity between the substrate and the base plate. Fluid exits the narrow cavity at an outlet, which is positioned on the other side of the substrate, opposite the inlet and internal manifold. The substrate spins while in contact with the stripping solution to achieve a more uniform flow over the face of the substrate. In some embodiments, the base plate includes protuberances which operate to increase the flow rate (and thereby increase the local Re) near the face of the substrate.

First claim

What is claimed is:

1 . A method of removing material from a substrate, comprising:
(a) receiving a substrate having material for removal thereon; (b) positioning and sealing the substrate in a substrate holder such that the material for removal is exposed; (c) positioning the substrate holder in a removal position, thereby forming a cavity defined on one side by the substrate, defined on the opposite side by a base plate, and defined around the edges by a flow distributor,
wherein the cavity has a dimension between about 2-10 mm as measured in a direction perpendicular to a face of the substrate
wherein the flow distributor comprises:
(i) an internal manifold spanning between about 90-180° around the flow distributor, wherein the internal manifold is a cavity in the flow distributor through which fluid may flow,
(ii) one or more inlets for delivering fluid from one or more fluid supply lines to the internal manifold, and
(iii) an outlet manifold spanning between about 90-180° around the flow distributor, and positioned opposite the internal manifold;

(d) rotating the substrate in the substrate holder; and (e) flowing stripping solution from the one or more inlets, through the internal manifold, into the cavity and over the face of the substrate, and out through the outlet manifold, to thereby remove from the substrate at least some of the material for removal.

2 . The method of claim 1 , wherein sealing the substrate in the substrate holder forms a fluid tight seal between the substrate and the substrate holder.

3 . The method of claim 1 , further comprising: positioning the substrate holder in an open position such that the substrate may be removed from the substrate holder and removing the substrate.

4 . The method of claim 1 , wherein the material for removal comprises photoresist material.

5 . The method of claim 4 , wherein the photoresist material comprises negative photoresist material.

6 . The method of claim 1 , wherein the stripping solution is flowed at a rate between about 20-40 LPM.

7 . The method of claim 1 , wherein the stripping solution comprises a DMSO- and/or TMAH-based solution.

8 . The method of claim 1 , wherein the substrate has features thereon, and wherein the features have a principal dimension between about 5-120 μm.

9 . The method of claim 1 , wherein the material for removal is substantially completely removed within about 4 minutes after beginning to flow stripping solution over the face of the substrate.

Assignees

• Novellus Systems Inc

Inventors

• Buckalew Bryan L
• Mayer Steven T
• Porter David
• Ponnuswamy Thomas A

Classifications

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P50/287 Primary

  by chemical means · CPC title