High resistivity soft magnetic material for miniaturized power converter

US2016336387A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016336387-A1
Application numberUS-201615224514-A
CountryUS
Kind codeA1
Filing dateJul 30, 2016
Priority dateMar 24, 2015
Publication dateNov 17, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An on-chip magnetic structure structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic material, and palladium substantially dispersed throughout the magnetic material.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for forming an on-chip magnetic structure, the method comprising: activating a magnetic seed layer with palladium to form a layer of palladium nanoparticles on a surface of the magnetic seed layer; forming a magnetic alloy layer on the layer of palladium nanoparticles, the magnetic alloy layer comprising cobalt in a range from about 80 to about 90 at. % based on the total number of atoms of the magnetic alloy layer, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic alloy layer, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic alloy layer, and palladium substantially dispersed throughout the magnetic alloy layer. 2 . The method of claim 1 , wherein the magnetic seed layer comprises nickel and iron. 3 . The method of claim 1 , wherein the on-chip magnetic structure is an inductor. 4 . The method of claim 1 , wherein the magnetic alloy layer is amorphous. 5 . The method of claim 1 , wherein the magnetic seed layer is at least 40 nm thick. 6 . The method of claim 1 , wherein the magnetic alloy layer is magnetically stable to at least 200° C. for at least 1 hour. 7 . The method of claim 1 , wherein the cobalt is in a range from about 81 to about 86 at. %. 8 . The method of claim 1 , wherein the magnetic seed layer comprises nickel and iron.

Assignees

Inventors

Classifications

  • Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

  • using a liquid · CPC title

  • Inductive arrangements or effects of, or between, wiring layers · CPC title

  • H10D1/20Primary

    Inductors · CPC title

  • Electricity · mapped topic

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016336387A1 cover?
An on-chip magnetic structure structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of a…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H10D1/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).