Electronic component package and package-on-package structure including the same

Patent metadata

Field	Value
Publication number	US-2016336296-A1
Application number	US-201615151885-A
Country	US
Kind code	A1
Filing date	May 11, 2016
Priority date	May 15, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.

First claim

What is claimed is:

1 . An electronic component package comprising:
a frame containing a metal or ceramic based material and having a through-hole; an electronic component disposed in the through-hole; an insulating part at least covering upper portions of the frame and the electronic component; a bonding part at least partially disposed between the frame and the insulating part; and a redistribution part disposed below the frame and the electronic component.

2 . The electronic component package of claim 1 , wherein the metal based material is an Fe—Ni based alloy (Invar).

3 . The electronic component package of claim 1 , wherein the ceramic based material is at least one selected from the group consisting of a zirconia based (ZrO 2 ) material, an alumina based (Al 2 O 3 ) material, a silicon carbide based (SiC) material, and a silicon nitride based (Si 3 N 4 ) material.

4 . The electronic component package of claim 1 , wherein the metal or ceramic based material has thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.

5 . The electronic component package of claim 1 , wherein the frame includes any layer that is penetrated through by the through-hole in which the electronic component is disposed, and
any layer of the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.

6 . The electronic component package of claim 1 , wherein the bonding part is disposed on at least one surface of the frame.

7 . The electronic component package of claim 6 , wherein the bonding part extends to and is disposed on an inner wall of the through-hole.

8 . The electronic component package of claim 1 , wherein the bonding part includes a first bonding part and a second bonding part,
the first bonding part is disposed on both surfaces of the frame opposing each other, and the second bonding part is disposed on the first bonding part and extends to an inner wall of the through-hole.

9 . The electronic component package of claim 8 , wherein the first bonding part is not disposed on the inner wall of the through-hole.

10 . The electronic component package of claim 1 , wherein the bonding part contains a conductive material.

11 . The electronic component package of claim 10 , wherein the bonding part has a thermal conductivity greater than that of the metal or ceramic based material contained in the frame.

12 . The electronic component package of claim 1 , further comprising a through-wiring penetrating through the frame,
wherein an insulating material is disposed between the frame and the through-wiring or between the bonding part and the through-wiring.

13 . The electronic component package of claim 1 , wherein the insulating part encloses outer side portions of the frame, and
the frame is not externally exposed.

14 . The electronic component package of claim 1 , wherein the frame includes one or more heat dissipation layers disposed therein, and
the metal or ceramic based material is divided into a plurality of layers by the one or more the heat dissipation layers.

15 . The electronic component package of claim 14 , wherein the one or more heat dissipation layers have a thermal conductivity greater than that of the remaining portion of the frame.

16 . The electronic component package of claim 1 , further comprising:
an outer layer disposed below the redistribution part and having first opening parts; and first external connection terminals disposed in the first opening parts, wherein at least one of the first external connection terminals is disposed in a fan-out region.

17 . The electronic component package of claim 1 , further comprising:
a cover layer disposed above the insulating part and having second opening parts; and second external connection terminals disposed in the second opening parts, wherein the second external connection terminals are electrically connected to the electronic component.

18 . A package-on-package structure comprising:
a first electronic component package including a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, a through-wiring penetrating through the frame, a redistribution part disposed below the frame and the electronic component, first external connection terminals disposed below the redistribution part, and second external connection terminals disposed above the insulating part; and a second electronic component package disposed above the first electronic component package and connected to the first electronic component package through the second external connection terminals.

19 . The package-on-package structure of claim 18 , further comprising a third electronic component package disposed below the first electronic component package and connected to the first electronic component package through the first external connection terminals.

20 . The package-on-package structure of claim 18 , wherein the frame includes any layer that is penetrated through by the through-hole in which the electronic component is disposed, and
any layer of the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.

21 . An electronic component package comprising:
a frame having a through-hole; a bonding part disposed on at least one surface of the frame; an electronic component disposed in the through-hole of the frame; a redistribution part, on which the frame and the electronic component are disposed, electrically connected to electrode pads of the electronic component; and an insulating part at least filling a portion of a space of the through-hole confined by the redistribution part, the electronic component, and the frame, wherein the frame has a thermal conductivity of 1 W/mK or more, a coefficient of thermal expansion (CTE) of 10 ppm/° C. or less, and an elastic modulus of 100 GPa or more.

22 . The electronic component package of claim 21 , wherein a material for forming the frame is a metal or ceramic based material.

23 . The electronic component package of claim 21 , wherein the bonding part extends from the at least one surface of the frame to and is disposed on an inner wall of the through-hole.

24 . The electronic component package of claim 23 , wherein a thickness of the bonding part on the inner wall is less than a thickness of the bonding part on the at least one surface of the frame.

25 . The electronic component package of claim 24 , wherein the bonding part is an electrically conductive material.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Sung Won
• Ko Young Gwan
• Kang Myung Sam
• Min Tae Hong

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title