Liquid filling method

Patent metadata

Field	Value
Publication number	US-2016336169-A1
Application number	US-201615148369-A
Country	US
Kind code	A1
Filing date	May 6, 2016
Priority date	May 15, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

A large number of pattern elements stands upright on an upper surface of a substrate. After the upper surface of the substrate has been processed using a processing liquid, liquid filling processing for filling the upper surface with a filler solution is performed, in which the filler solution having a viscosity of three centipoises or more is applied to a central part of the upper surface. Then, by rotating the substrate at 1000 revolutions per minute or less, the processing solution adhering to the entire upper surface is replaced by the filler solution, and a solution layer of a predetermined thickness is formed. In this way, making the viscosity of the filler solution relatively high and making the centrifugal force acting at the time of rotating the substrate relatively low suppresses deformation of the pattern elements at the time of filling with a filler that uses the filler solution.

First claim

1 . A liquid filling method for filling a main surface of a substrate having a pattern formed thereon with a filler solution after said main surface has been processed using a processing liquid, the method comprising:
a) applying a filler solution having a viscosity of three centipoises or more to a central part of a main surface of a substrate, said main surface having a large number of pattern elements that stand upright; and b) replacing a processing liquid that adheres to an entirety of said main surface with said filler solution and forming a solution layer of a predetermined thickness by rotating said substrate at V revolutions per minute or less, where V is a value obtained by multiplying a square root of (150/r) by 1000 and r is a radius of said substrate in millimeters.

2 . The liquid filling method according to claim 1 , wherein
said filler solution contains water as a solvent.

3 . The liquid filling method according to claim 1 , wherein
said filler solution contains a surface tension reducing agent.

4 . The liquid filling method according to claim 3 , wherein
said surface tension reducing agent is isopropyl alcohol.

5 . The liquid filling method according to claim 1 , wherein
said filler solution has a viscosity of 15 centipoises or less.

6 . The liquid filling method according to claim 1 , wherein
the number of revolutions of said substrate in said operation b) is 300 revolutions per minute or more.

7 . The liquid filling method according to claim 1 , wherein
tip ends of pattern elements that are adjacent to each other among said large number of pattern elements are coupled to each other by a bridge that extends along said main surface.

8 . A liquid filling method for filling a main surface of a substrate having a pattern formed thereon with a filler solution after said main surface has been processed using a processing liquid, the method comprising:
a) applying a filler solution to a central part of a main surface of a substrate, said main surface having a large number of patter elements that stand upright; and b) replacing a processing liquid that adheres to an entirety of said main surface with said filler solution and forming a solution layer of a predetermined thickness by rotating said substrate, wherein a viscosity of said filler solution applied in said operation a) and a number of revolutions of said substrate in said operation b) are set to conditions that suppress occurrence of a void in said solution layer that has been solidified.

9 . The liquid filling method according to claim 8 , wherein
said filler solution contains water as a solvent.

10 . The liquid filling method according to claim 8 , wherein
said filler solution contains a surface tension reducing agent.

11 . The liquid filling method according to claim 10 , wherein
said surface tension reducing agent is isopropyl alcohol.

12 . The liquid filling method according to claim 8 , wherein
said filler solution has a viscosity of 15 centipoises or less.

13 . The liquid filling method according to claim 8 , wherein
the number of revolutions of said substrate in said operation b) is 300 revolutions per minute or more.

14 . The liquid filling method according to claim 8 , wherein
tip ends of pattern elements that are adjacent to each other among said large number of pattern elements are coupled to each other by a bridge that extends along said main surface.

Assignees

• Screen Holdings Co Ltd

Inventors

• Fujiwara Naozumi
• Yamaguchi Naoko

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• B08B3/02

  Cleaning by the force of jets or sprays · CPC title

• H01L21/0206 Primary

  Electricity · mapped topic