Disc comprising an electrical connection element

Patent metadata

Field	Value
Publication number	US-9385437-B2
Application number	US-201113695426-A
Country	US
Kind code	B2
Filing date	Jul 4, 2011
Priority date	Jul 13, 2010
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

A pane with an electrical connection element is described. The pane can have a glass substrate and an electrically conductive structure on the substrate. Solder material can be used to electrically connect a connection element to the electrically conductive structure.

First claim

The invention claimed is:

1. A pane comprising:
a glass substrate having a first coefficient of thermal expansion;
an electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate;
a connection element having a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is higher than 5×10 −6 /° C.;
a layer of a lead-free solder material electrically connecting the connection element to a portion of the electrically conductive structure,
wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon, wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and wherein the contact surface has no corners.

2. The pane according to claim 1 , wherein the contact surface has an oval, elliptical or a circular structure.

3. The pane according to claim 1 , wherein the contact surface has a convex polygonal shape with rounded corners, the rounded corners having a radius of greater than 0.5 mm.

4. The pane according to claim 1 , wherein the solder material flows out from an intermediate space between the connection element and the electrically conductive structure with an outflow width of less than 1 mm.

5. The pane according to claim 1 , wherein the solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

6. The pane according to claim 5 , wherein the tin in the solder composition is 3 wt.-% to 99.5 wt.-%, and the bismuth, indium, zinc, copper, silver, or compositions thereof are each 0.5 wt.-% to 97 wt.-%.

7. The pane according to claim 1 , wherein the connection element is coated with nickel, tin, copper, and/or silver.

8. The pane according to claim 7 , wherein the connection element is coated with 0.1 μm to 0.3 μm and/or 3 μm to 10 μm silver.

9. The pane according to claim 1 , wherein the solder material flows out from an intermediate space between the connection element and the electrically conductive structure with an outflow width of less than 0.5 mm.

10. The pane according to claim 1 , wherein the solder material flows out from an intermediate space between the connection element and the electrically conductive structure with an outflow width of about 0 mm.

11. A method for producing a pane, the method comprising:
disposing and applying lead-free solder material on a connection element as a platelet with a set layer thickness, volume, shape, and configuration;
applying an electrically conductive structure on a glass substrate;
disposing the connection element with the solder material on the electrically conductive structure;
soldering the connection element to the electrically conductive structure; and
obtaining the pane comprising:
the glass substrate having a first coefficient of thermal expansion,
the electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate,
the connection element having a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is higher than 5×10 −6 /° C., and
a layer of the lead-free solder material electrically connecting the connection element to a portion of the electrically conductive structure,
wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon, wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and wherein the contact surface has no corners.

12. A method comprising: using a pane with an electrical connection element as a windshield, rear window, side window, and/or glass roof in vehicles,
wherein the pane comprises:
a glass substrate having a first coefficient of thermal expansion;
an electrically conductive structure having a layer thickness of 5 μm to 40 μm on a region of the glass substrate;
a connection element having a second coefficient of thermal expansion, wherein the difference between the first coefficient of thermal expansion and the second coefficient of thermal expansion is higher than 5×10 −6 /° C.;
a layer of a lead-free solder material electrically connecting the connection element to a portion of the electrically conductive structure,
wherein the connection element contains at least 55 wt.-% to 70 wt.-% iron, 30 wt.-% to 45 wt.-% nickel, 0 wt.-% to 5 wt.-% cobalt, 0 wt.-% to 1 wt.-% magnesium, 0 wt.-% to 1 wt.-% silicon, or 0 wt.-% to 1 wt.-% carbon, wherein the connection element is connected to the portion of the electrically conductive structure via a contact surface over an entire surface of the connection element, and wherein the contact surface has no corners.

Assignees

• Cholewa Harald
• Schlarb Andreas
• Lesmeister Lothar
• Rateiczak Mitja
• Reul Bernhard
• Schmidt Lothar
• Saint Gobain

Inventors

• Cholewa Harald
• Schlarb Andreas
• Lesmeister Lothar
• Rateiczak Mitja
• Reul Bernhard
• Schmidt Lothar

Classifications

• B23K35/262 Primary

  Sn as the principal constituent · CPC title

• B23K35/36

  Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title

• H01R4/02

  Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} · CPC title

• B23K1/002

  Soldering by means of induction heating · CPC title

• H05B2203/016

  Heaters using particular connecting means · CPC title