Circuit board and circuit board assembly

Patent metadata

Field	Value
Publication number	US-2016309575-A1
Application number	US-201615198110-A
Country	US
Kind code	A1
Filing date	Jun 30, 2016
Priority date	Jun 23, 2014
Publication date	Oct 20, 2016
Grant date	—

Abstract

A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.

First claim

What is claimed is:

1 . A circuit board comprising:
an insulating part comprising insulating layers; metal layers disposed on the insulating layers; vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure comprising a thermally conductive material, at least a part of the first thermally conductive structure being inserted into the insulating part; a first via having one surface contacting the first thermally conductive structure; a first metal pattern contacting another surface of the first via; a first bonding member connected to the first metal pattern; and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part among the metal layers, the pads comprising at least one pad in a first region of the circuit board having a first temperature while the first electronic component is operating and at least one pad in a second region of the circuit board having a second temperature higher than the first temperature while the first electronic component is operating.

2 . The circuit board of claim 1 , wherein the first bonding member is also connected to the first electronic component.

3 . The circuit board of claim 2 , wherein at least a part of the first thermally conductive structure is positioned below the first electronic component.

4 . The circuit board of claim 3 , further comprising a second electronic component mounted in the insulating part;
wherein at least a part of the second electronic component is positioned below the first electronic component.

5 . The circuit board of claim 2 , wherein a distance from the second region to the first bonding member is less than a distance from the first region to the first bonding member.

6 . The circuit board of claim 1 , wherein the pads comprise:
a first pad through which heat passes while the first electronic component is operating; and a second pad through which a signal passes while the first electronic component is operating; and the first bonding member is connected to the first pad.

7 . The circuit board of claim 6 , wherein the metal layer disposed on the outermost surface of the insulating part comprises a metal pattern connected to the second pad but not connected to the first thermally conductive structure.

8 . The circuit board of claim 1 , further comprising an adhesion improving part disposed on a surface of the first thermally conductive structure to increase adhesion between the first thermally conductive structure and the insulating part.

9 . The circuit board of claim 1 , wherein the first thermally conductive structure comprises a multi-coated layered structure, or at least one side surface of the first thermally conductive structure has a concave shape.

10 . The circuit board of claim 1 , further comprising at least one via and at least one metal pattern between the first metal pattern and the first bonding member so that the first bonding member is connected to the first metal pattern through the at least one via and the at least one metal pattern.

11 . The circuit board of claim 1 , wherein an upper surface and a lower surface of the first thermally conductive structure each have a hexahedron shape, and more than one via contacts a same one of the upper surface and the lower surface of the first thermally conductive structure.

12 . The circuit board of claim 1 , further comprising:
a second via having one surface contacting a lower surface of the first thermally conductive structure; a second metal pattern contacting another surface of the second via; and a second bonding member connected to the second metal pattern; wherein an upper surface and the lower surface of the first thermally conductive structure have a hexahedron shape, and one surface of the first via contacts the upper surface of the first thermally conductive structure.

13 . The circuit board of claim 12 , wherein the second bonding member is also connected to an additional board.

14 . The circuit board of claim 13 , wherein a distance from the second region to the first bonding member is less than a distance from the first region to the first bonding member.

15 . The circuit board of claim 13 , wherein the additional board comprises a heat dissipating part comprising a thermally conductive material and extending through the additional board so that an upper surface and a lower surface of the heat dissipating part are exposed at an upper surface and a lower surface of the additional board; and
the second bonding member comprises a thermally conductive material, has a cylindrical shape or a polygonal shape, and contacts the heat dissipating part.

16 . A circuit board comprising;
an insulating part; a first thermally conductive structure comprising a thermally conductive material, at least a part of the first thermally conductive structure being inserted into the insulating part; and an adhesion improving part is disposed on a surface of the first thermally conductive structure to increase adhesion between the first thermally conductive structure and the insulating part.

17 . The circuit board of claim 16 , wherein the adhesion improving part comprises silane.

18 . The circuit board of claim 17 , wherein the silane is acrylic silane.

19 . The circuit board of claim 16 , wherein the insulating part comprises:
a core part comprising a second thermally conductive structure comprising a thermally conductive material; and at least one insulating layer disposed on a surface of the core part.

Assignees

• Samsung Electro Mech

Inventors

• Min Tae Hong
• Kang Myung Sam
• Lee Jung Han
• Ko Young Gwan

Classifications

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title

• H05K3/4608

  comprising an electrically conductive base or core · CPC title

• H05K2201/0323

  Carbon · CPC title