Coil electronic component

Patent metadata

Field	Value
Publication number	US-2016307689-A1
Application number	US-201615088653-A
Country	US
Kind code	A1
Filing date	Apr 1, 2016
Priority date	Apr 16, 2015
Publication date	Oct 20, 2016
Grant date	—

Abstract

A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.

First claim

What is claimed is:

1 . A coil electronic component comprising:
a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via, wherein upper surfaces of the first and second via pads have rounded corners.

2 . The coil electronic component of claim 1 , wherein the upper surfaces of the first and second via pads have a shape corresponding to overlapping regions of a rounded shape and a square having a side whose length is smaller than a longer axis of the rounded shape.

3 . The coil electronic component of claim 2 , wherein one side of the square corresponds to an extending line of an outer coil line of one end of each of the first and second coils conductors.

4 . The coil electronic component of claim 2 , wherein a difference between the longer axis of the rounded shape and the length of the side of the virtual square is 30 μm or less.

5 . The coil electronic component of claim 1 , wherein the upper surfaces of the first and second via pads have corner portions configured as circular arcs and a straight line linking the corner portions.

6 . The coil electronic component of claim 5 , wherein a plurality of corner portions formed in the first via pad or the second via pad have the same radius of curvature.

7 . The coil electronic component of claim 1 , wherein a through hole is formed in a central portion of the insulating substrate and filled with a magnetic material to form a core part.

8 . The coil electronic component of claim 7 , wherein the first and second via pads protrude toward the core part.

9 . The coil electronic component of claim 1 , wherein the first and second coils and the first and second via pads are plated via pads.

10 . The coil electronic component of claim 1 , further comprising a magnetic body in which the first and second coils are embedded,
wherein the magnetic body includes magnetic metal powder.

11 . A coil electronic component comprising:
a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via, wherein upper surfaces of the first and second via pads have a quadrangular shape in which corner portions are curved.

12 . The coil electronic component of claim 11 , wherein a plurality of corner portions formed in the first via pad or the second via pad have the same radius of curvature.

13 . The coil electronic component of claim 11 , wherein the upper surfaces of the first and second via pads have corner portions configured as circular arcs and linear portions linking the corner portions.

14 . The coil electronic component of claim 11 , wherein a through hole is provided in a central portion of the insulating substrate and filled with a magnetic material to form a core part.

15 . The coil electronic component of claim 14 , wherein the first and second via pads protrude toward the core part.

16 . The coil electronic component of claim 11 , wherein the first and second coils and the first and second via pads are plated via pads.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Dong Jin
• Lee Kyung Seop

Classifications

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F2017/002

  Details of via holes for interconnecting the layers · CPC title

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F17/04 Primary

  with magnetic core · CPC title