Electronic control unit

Patent metadata

Field	Value
Publication number	US-2016295683-A1
Application number	US-201615090231-A
Country	US
Kind code	A1
Filing date	Apr 4, 2016
Priority date	Apr 6, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

Heating elements are mounted on a substrate. A heat sink is provided to be capable of releasing heat of the heating elements. Each radiating component is provided between a corresponding one of the heating elements and the heat sink, and is provided in a corresponding one of radiating regions. Each radiating region includes a corresponding one of mounting portions of the heating elements. A gap part is formed in an area surrounded by the radiating components each of which is provided at a corresponding one of the radiating regions. Each heating element is located in a corresponding one of the radiating regions. There is not any one of the radiating components disposed at the gap part.

First claim

What is claimed is:

1 . An electronic control unit comprising:
a substrate; three or more heating elements that are mounted on the substrate; a heat sink that is provided to be capable of releasing heat of the three or more heating elements; three or more radiating components each of which is provided between a corresponding one of the three or more heating elements and the heat sink and is provided in a corresponding one of three or more radiating regions, wherein each of the three or more radiating regions includes a corresponding one of mounting portions of the three or more heating elements; and a gap part that is formed in an area surrounded by the three or more radiating components each of which is provided at a corresponding one of the three or more radiating regions, wherein: each of the three or more heating elements is located in a corresponding one of the three or more radiating regions; and there is not any one of the three or more radiating components disposed at the gap part.

2 . The electronic control unit according to claim 1 , wherein:
the heat sink includes a seat part that projects toward the substrate at an area serving as the gap part and that is in contact with a surface of the substrate on the heat sink-side; and in a state where the seat part and the substrate are in contact with each other, the three or more heating elements and the heat sink are separate from each other.

3 . The electronic control unit according to claim 2 , wherein:
the heat sink includes a positioning pin that projects toward the substrate at the area serving as the gap part; and the substrate includes a positioning hole through which the positioning pin is inserted.

4 . The electronic control unit according to claim 3 , wherein the positioning pin is formed to project from the seat part.

5 . The electronic control unit according to claim 1 , wherein the three or more heating elements are mounted on a surface of the substrate on the heat sink-side.

Assignees

• Denso Corp

Inventors

• Uchida Takayuki

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/10522

  Adjacent components · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/1056

  Metal over component, i.e. metal plate over component mounted on or embedded in PCB · CPC title