Acoustic wave filter, duplexer, and module

Patent metadata

Field	Value
Publication number	US-2016294358-A1
Application number	US-201615058847-A
Country	US
Kind code	A1
Filing date	Mar 2, 2016
Priority date	Mar 31, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A filter including: a substrate; an input pad; an output pad; a ground pad; a plurality of first acoustic wave resonators formed on the substrate, and connected in series between the input pad and the output pad; a plurality of second acoustic wave resonators, each comprising: a piezoelectric film on the substrate; a lower electrode between the substrate and the piezoelectric film, connected to the ground pad; and a upper electrode on the piezoelectric film, and connected between an adjacent pair of the first acoustic wave resonators or between one of the plurality of first acoustic wave resonators and one of the input and the output pad.

First claim

What is claimed is:

1 . A filter comprising:
a substrate; an input pad; an output pad; a ground pad; a plurality of first acoustic wave resonators formed on the substrate, and connected in series between the input pad and the output pad; a plurality of second acoustic wave resonators, each comprising:
a piezoelectric film on the substrate;
a lower electrode between the substrate and the piezoelectric film, connected to the ground pad; and
an upper electrode on the piezoelectric film, and connected between an adjacent pair of the first acoustic wave resonators or between one of the plurality of first acoustic wave resonators and one of the input and the output pad.

2 . The filter according to claim 1 , wherein at least two of the second acoustic wave resonators share a common piezoelectric film.

3 . The filter according to claim 1 , wherein the ground pad is directly in contact with the substrate.

4 . The filter according to claim 1 , further comprising:
a first wiring formed on the piezoelectric film, and connects between the second electrode and input pad or output pad, wherein the input pad and output pad are formed on the piezoelectric film.

5 . The filter according to claim 1 , further comprising:
a second wiring that connects between the ground pad and the second electrode, wherein the second wiring is passing through the piezoelectric film in at least part of region.

6 . The filter according to claim 1 , wherein a space is located below the lower electrode.

7 . The filter according to claim 6 , wherein the substrate has a concave portion located below the lower electrode, forming an air gap therebetween.

8 . The filter according to claim 1 , further comprising:
an acoustic mirror located below the at least one of the plurality of first acoustic wave resonator or the plurality of second acoustic wave resonator, the acoustic mirror is structured by at least two layers having different acoustic characteristic each other.

9 . A duplexer comprising:
a first filter; a second filter, the second filter including:
a substrate;
an input pad;
an output pad;
a ground pad;
a plurality of first acoustic wave resonators formed on the substrate, and connected in series between the input pad and the output pad;
a plurality of second acoustic wave resonators, each comprising:
a piezoelectric film on the substrate;
a lower electrode between the substrate and the piezoelectric film, connected to the ground pad; and
an upper electrode on the piezoelectric film, and connected between an adjacent pair of the first acoustic wave resonators or between one of the plurality of first acoustic wave resonators and one of the input and the output pad,
wherein the first filter and the second filter have different passbands.

10 . A communication module comprising:
a duplexer having a transmit filter and a receive filter, at least one of the transmit filter and receive filter including:
a substrate;
an input pad;
an output pad;
a ground pad;
a plurality of first acoustic wave resonators formed on the substrate, and connected in series between the input pad and the output pad;
a plurality of second acoustic wave resonators, each comprising:
a piezoelectric film on the substrate;
a lower electrode between the substrate and the piezoelectric film, connected to the ground pad; and
an upper electrode on the piezoelectric film, and connected between an adjacent pair of the first acoustic wave resonators or between one of the plurality of first acoustic wave resonators and one of the input and the output pad,
wherein the transmit filter and the receive filter have different passbands.

Assignees

• Taiyo Yuden Kk

Inventors

• Ono Satoru

Classifications

• H03H9/547 Primary

  Notch filters, e.g. notch BAW or thin film resonator filters · CPC title

• H03H9/706 Primary

  Duplexers · CPC title

• H03H9/564

  implemented with thin-film techniques · CPC title

• H03H9/568

  consisting of a ladder configuration · CPC title

• H03H9/0571

  including bulk acoustic wave [BAW] devices · CPC title