Acoustic wave device and fabrication method of the same

Patent metadata

Field	Value
Publication number	US-9484883-B2
Application number	US-201213715037-A
Country	US
Kind code	B2
Filing date	Dec 14, 2012
Priority date	Jan 24, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.

First claim

What is claimed is:

1. An acoustic wave device comprising:
a substrate;
an input pad that is located on a first surface of the substrate, and to which a high-frequency signal is input;
a resonator that is connected to the input pad, and to which the high-frequency signal input to the input pad is input, the resonator including an electrode located in contact with the first surface of the substrate;
an input line pattern that is located on the first surface of the substrate and that connects the resonator to the input pad; and
an insulating layer that is located in an entire area under the input pad on the first surface of the substrate and in an entire area under the input line pattern on the first surface of the substrate, and that has a relative permittivity smaller than that of the substrate, the insulating layer being absent under the electrode included in the resonator on the first surface of the substrate and extending beyond edges of the input pad and the input line pattern.

2. The acoustic wave device according to claim 1 , further comprising:
a metal layer that is located on a second surface facing the first surface of the substrate.

3. The acoustic wave device according to claim 2 , wherein
the metal layer contacts the second surface.

4. The acoustic wave device according to claim 2 , wherein
the substrate is flip-chip mounted on a mounting substrate so that the first surface faces the mounting substrate, and
the metal layer seals the substrate.

5. The acoustic wave device according to claim 1 , wherein
the insulating layer includes silicon oxide or polyimide.

6. The acoustic wave device according to claim 1 , wherein
the substrate is a piezoelectric substrate including a piezoelectric substance, and
the resonator is an acoustic wave resonator including an IDT (InterDigital Transducer),
the insulating layer is absent between the IDT and the substrate.

7. The acoustic wave device according to claim 1 , further comprising:
an output pad that is located on the first surface, and from which a high-frequency signal output from the resonator is output;
a line pattern that is located on the first surface, and connects a plurality of the resonators; and
another insulating layer that is located between the output pad and the substrate and between the line pattern and the substrate.

8. The acoustic wave device according to claim 1 , wherein
the insulating layer does not extend to an edge of the first surface of the substrate.

9. The acoustic wave device according to claim 1 , further comprising
another pad and another line pattern that is located on the insulating layer and does not connect to the input pad and the input line pattern.

10. The acoustic wave device according to claim 1 , wherein
the electrode is a metal layer.

11. A fabrication method of an acoustic wave device comprising:
forming an insulating layer on a first surface of a substrate, the insulating layer having a relative permittivity smaller than that of the substrate and being absent on at least a portion of the first surface of the substrate;
forming an input pad, to which a high-frequency signal is input, on the insulating layer, the insulating layer extending beyond an edge of the input pad;
forming an input line pattern connecting the resonator to the input pad, on the insulating layer, the insulating layer extending beyond an edge of the input line pattern; and
forming a resonator, which is connected to the input pad and to which the high-frequency signal input to the input pad is input, on the at least portion of the first surface, the resonator including an electrode located in contact with the first surface of the substrate,
wherein an entirety of the input pad and an entirety of the input line are formed on the insulating layer.

12. The fabrication method of the acoustic wave device according to claim 11 , wherein
the forming the resonator includes forming an IDT on the first surface of the substrate where the insulating layer is absent, and
at least a part of the input pad and the IDT are formed simultaneously.

13. The fabrication method of the acoustic wave device according to claim 11 , wherein
the forming the resonator includes forming an IDT on the first surface of the substrate where the insulating layer is absent, and
the insulating layer is formed on the IDT.

14. An acoustic wave device comprising:
a substrate;
an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input;
a resonator that is connected to the input terminal, and to which the high-frequency signal input to the input terminal is input;
an insulating layer that is located between the input terminal and the substrate, and has a relative permittivity smaller than that of the substrate, the insulating layer being absent on at least a portion of the first surface of the substrate,
an output terminal on the first surface of the substrate, from which a high-frequency signal output from the resonator is output; and
a ground terminal on the first surface of the substrate to connect the resonator to a ground,
wherein the insulating layer is absent between the output terminal and the substrate and between the ground terminal and the substrate.

15. The acoustic wave device according to claim 14 , further comprising:
a line pattern on the first surface of the substrate connecting the resonator to the input terminal,
wherein the insulating layer is provided between the line pattern and the substrate.

Assignees

• Taiyo Yuden Kk

Inventors

• Nishizawa Toshio
• Saito Yasuyuki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• Y10T29/49171

  with encapsulating · CPC title

• Y10T29/42

  Piezoelectric device making · CPC title

• H03H9/64

  using surface acoustic waves · CPC title