Charged particle beam processing using process gas and cooled surface

Patent metadata

Field	Value
Publication number	US-2016293380-A1
Application number	US-201514674558-A
Country	US
Kind code	A1
Filing date	Mar 31, 2015
Priority date	Mar 31, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A cold trap is provided to reduce contamination gases that react with the beam during operations that use a process gas. The cold trap is set to a temperature that condenses the contamination gas but does not condense the process gas. Cold traps may be used in the sample chamber and in the gas line.

First claim

1 . A method of charged particle beam processing of a work piece in a processing chamber, comprising:
providing a process gas, defined as a gas used with a charged particle beam to image or alter a work piece, at the work piece surface; directing a charged particle beam toward the work piece surface; providing a cooled surface within the processing chamber, the temperature of the cooled surface being sufficiently cold to remove contaminants from the processing chamber but insufficiently cold to condense the process gas.

2 . The method of claim 1 in which providing a cooled surface within the processing chamber includes providing a surface having a temperature that is less than 30 degree Celsius greater than the condensation temperature of the process gas.

3 . The method of claim 1 in which providing a cooled surface within the processing chamber includes providing a cooled surface that is thermally isolated from the sample.

4 . The method of claim 1 in which providing a process gas includes providing a process gas that does not etch the work piece in the presence of the charged particle beam.

5 . The method of claim 4 in which providing a process gas includes providing an imaging gas that does not react with the work piece surface in the presence of the charged particle beam but that is sufficiently ionizable to be used in gas cascade amplification imaging.

6 - 7 . (canceled)

8 . The method of claim 1 in which the process gas comprises O 2 , N 2 O, H 2 , NH 3 , Cl 2 , HCl, NF 3 , Ar, He, Ne, Kr, Xe, or N 2 .

9 . (canceled)

10 . The method of claim 1 in which providing a cooled surface within the processing chamber comprises controlling the temperature of the cooled surface by controlling a flow of liquid nitrogen in thermal contact with the cooled surface.

11 . The method of claim 1 in which providing a process gas at the work piece surface comprises directing a jet of process gas at the work piece surface, the background pressure in the process chamber being between 10 −7 Pascals and 10 −2 Pascals.

12 . The method of claim 1 in which directing a charged particle beam toward the work piece surface comprises directing a charged particle beam through a charged particle beam optical column and in which providing a process gas at the work piece surface comprises maintaining the work piece in a process chamber maintained at a pressure of between 10 −1 Pascals and 10 4 Pascals, the chamber including a pressure limiting aperture to restrict gas flow from the process chamber to the charged particle beam optical column.

13 . The method of claim 1 in which providing a process gas at the work piece surface comprises maintaining the work piece in a process chamber comprising an environmental cell maintained at a pressure of between 10 −1 Pascals and 10 4 Pascals, the environmental cell positioned within a sample chamber of a charged particle beam system and separated from the sample chamber by a pressure limiting aperture.

14 . The method of claim 1 in which providing a process gas at the work piece surface includes providing a process gas from a gas source through a gas line and further comprising providing a second cooled surface within the gas line, the second cooled surface being sufficiently cold to remove contaminants from the gas line, but insufficiently cold to condense the process gas.

15 . (canceled)

16 . The method of claim 1 further comprising forming an image of the work piece using gas cascade amplification.

17 . The method of claim 1 in which providing a process gas at the work piece surface includes providing a gas composed of molecules that, upon reaction with electrons, decomposes to deposit a material onto the work piece surface or etch a material from the work piece surface.

18 . A charged particle beam apparatus for processing a sample, comprising:
a source of charged particles; a focusing column for focusing the charged particles; a processing chamber for containing a sample in a gaseous environment; a gas source for providing a process gas, defined as a gas used with a charged particle beam to image or alter a work piece, to the processing chamber; at least one pressure limiting aperture between the processing chamber and the focusing column to maintain a lower pressure in the focusing column than in the processing chamber; and a cooler for cooling a cryotrap surface in the processing chamber, the cooled cryotrap surface condensing contaminants from the processing chamber environment to prevent the contaminants from adsorbing to the sample surface.

19 . The apparatus of claim 18 in which the charged particle beam apparatus includes a sample vacuum chamber in which the processing chamber comprises an environmental cell positioned within the sample chamber, with at least one pressure limiting aperture positioned between the environmental cell and the sample chamber.

20 . The apparatus of claim 18 in which the charged particle beam apparatus includes a sample vacuum chamber that is vacuum isolatable from the focusing column and in which the processing chamber comprises the sample chamber.

21 . The apparatus of claim 20 in which the sample chamber contains a scintillator photomultiplier detector, a solid state detector, a detector used to generate electron backscatter diffraction patterns, or an x-ray detector.

22 - 24 . (canceled)

25 . The apparatus of claim 20 in which the sample chamber is an environmental scanning electron microscope sample vacuum chamber containing a gas cascade amplification detector.

26 . The apparatus of claim 18 in which the cooler comprises a source of liquid nitrogen or a thermoelectric cooler.

27 . (canceled)

28 . The apparatus of claim 18 in which the gas source comprises a source of an imaging gas that does not etch carbon in the presence of the charged particle beam.

29 . The apparatus of claim 18 in which the gas source comprises a source of O 2 , N 2 O, H 2 , NH 3 , Cl 2 , HCl, NF 3 , Ar, He, Ne, Kr, Xe, or N 2 .

30 . The apparatus of claim 18 in further comprising:
a gas line between the gas source and the processing chamber;
a second cryotrap surface positioned in the gas line.

31 . The apparatus of claim 30 further comprising a second cooler for cooling the second cryotrap surface.

32 . A charged particle beam apparatus for processing a sample, comprising:
a source of charged particles; a focusing column for focusing the charged particles; a processing chamber for containing a sample in a gaseous environment; a gas source for directing a process gas, defined as a gas used with a charged particle beam to image or alter a work piece, toward the work piece; and a cooler for cooling a cryotrap surface in the processing chamber; a controller for controlling the charged particle beam apparatus, the controller configured to direct the process gas toward the work piece while simultaneously cooling the cryotrap, the cooled cryotrap surface condensing contaminants from the processing chamber environment to prevent the contaminants from adsorbing to the sample surface.

Assignees

• Fei Co

Inventors

• Martin Aiden
• Mccredie Geoff
• Toth Milos

Classifications

• H01J2237/002

  Cooling arrangements · CPC title

• H01J2237/022

  Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube · CPC title

• H01J37/261

  Details · CPC title

• H01J37/3178

  for applying thin layers on objects · CPC title

• H01J37/18

  Vacuum locks {; Means for obtaining or maintaining the desired pressure within the vessel} · CPC title