Multilayer electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016293328-A1
Application number	US-201614990326-A
Country	US
Kind code	A1
Filing date	Jan 7, 2016
Priority date	Apr 1, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A method of manufacturing a multilayer electronic component comprises steps of: preparing first insulating sheets having internal electrode patterns formed thereon; moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto a lower mold; arranging a second insulating sheet to be disposed between an internal electrode pattern disposed in an uppermost position among the internal electrode patterns formed on the lower mold and an upper mold and pressing the first insulating sheets having the internal electrode patterns formed thereon by the upper mold to form a laminate; and sintering the laminate to form a multilayer body. In a cross section in a width-thickness direction of the internal electrode pattern included in the multilayer body, 0.45≦t 2 /t 2 ≦1.0, where t 1 is a thickness of one side of the internal electrode pattern in relation to a central line connecting both vertices of the internal electrode pattern in a width direction and t 2 is a thickness of the other side of the internal electrode pattern in relation to the central line and t 2 is larger than or equal to t 1 .

First claim

What is claimed is:

1 . A method of manufacturing a multilayer electronic component, comprising steps of:
preparing first insulating sheets having internal electrode patterns formed thereon; moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto a lower mold; arranging a second insulating sheet to be disposed between an internal electrode pattern disposed in an uppermost position among the internal electrode patterns formed on the lower mold and an upper mold and pressing the first insulating sheets having the internal electrode patterns formed thereon by the upper mold to form a laminate; and sintering the laminate to form a multilayer body, wherein, in a cross section in a width-thickness direction of the internal electrode pattern included in the multilayer body, 0.45≦t 1 /t 2 ≦1.0, where t 1 is a thickness of one side of the internal electrode pattern in relation to a central line connecting both vertices of the internal electrode pattern in a width direction and t 2 is a thickness of the other side of the internal electrode pattern in relation to the central line and t 2 is larger than or equal to t 1 .

2 . The method of claim 1 , wherein an elongation of the second insulating sheet is 10% to 50%.

3 . The method of claim 1 , wherein a rate of increase of a line width of the internal electrode pattern after being pressed is 16% or less.

4 . The method of claim 1 , wherein the step of arranging the second insulating sheet to be disposed between the internal electrode pattern disposed in the uppermost position among the internal electrode patterns formed on the lower mold and the upper mold and the pressing of the first insulating sheets having the internal electrode patterns formed thereon by the upper mold, the second insulating sheet is attached to a pressing surface of the upper mold, and the first insulating sheets having the internal electrode patterns formed thereon is pressed by the upper mold onto which the second insulating sheet is attached.

5 . The method of claim 1 , wherein the step of moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto the lower mold comprises the upper mold onto which the second insulating sheet is attached pressing the first insulating sheets having the internal electrode patterns formed thereon to thereby be moved onto the lower mold.

6 . The method of claim 1 , wherein the step of moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto the lower mold comprises peeling the first insulating sheets having the internal electrode patterns formed thereon from carrier films and then moving the first insulating sheets having the internal electrode patterns formed thereon onto the lower mold.

7 . The method of claim 1 , wherein the step of moving one or more of the first insulating sheets having the internal electrode patterns formed thereon onto the lower mold comprises positioning the first insulating sheets on the lower mold, and positioning the internal electrode patterns on the first insulating sheets.

8 . A multilayer electronic component comprising:
a multilayer body in which a plurality of insulating layers and internal electrode patterns are stacked, wherein in a cross section in a width-thickness direction of the internal electrode pattern included in the multilayer body, 0.45≦t 1 /t 2 ≦1.0, where t 1 is a thickness of one side of the internal electrode pattern in relation to a central line connecting both vertices of the internal electrode pattern in a width direction to each other and t 2 is a thickness of the other side of the internal electrode pattern in relation to the central line, and t 2 is larger than or equal to t 1 .

Assignees

• Samsung Electro Mech

Inventors

• Lee Seung Kye

Classifications

• H01F41/02 Primary

  for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H01F41/043 Primary

  by thick film techniques · CPC title