Imprint apparatus, imprint method, and method of manufacturing article

US2016288404A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016288404-A1
Application numberUS-201514674244-A
CountryUS
Kind codeA1
Filing dateMar 31, 2015
Priority dateMar 31, 2015
Publication dateOct 6, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides an imprint apparatus which forms a pattern on a substrate by molding an imprint material on the substrate using a mold, comprising a supply unit configured to supply droplets of the imprint material onto the substrate; and a processing unit configured to acquire arrangement patterns of the droplets on the substrate, wherein based on the arrangement pattern corresponding to a first portion of the mold and the arrangement pattern corresponding to a second portion of the mold, the processing unit acquires the arrangement pattern corresponding to a boundary portion between the first portion and the second portion.

First claim

Opening claim text (preview).

What is claimed is: 1 . An imprint apparatus which forms a pattern on a substrate by molding an imprint material on the substrate using a mold, comprising: a supply unit configured to supply droplets of the imprint material onto the substrate; and a processing unit configured to acquire arrangement patterns of the droplets on the substrate, wherein based on the arrangement pattern corresponding to a first portion of the mold and the arrangement pattern corresponding to a second portion of the mold, the processing unit acquires the arrangement pattern corresponding to a boundary portion between the first portion and the second portion. 2 . The apparatus according to claim 1 , wherein the processing unit acquires the first portion, the arrangement pattern corresponding to the first portion, the second portion, and the arrangement pattern corresponding to the second portion based on information of a pattern of the mold. 3 . The apparatus according to claim 1 , wherein the processing unit acquires the boundary portion based on the first portion and the second portion. 4 . The apparatus according to claim 1 , wherein the processing unit acquires the arrangement pattern corresponding to the boundary portion by changing a magnification of the arrangement pattern corresponding to the first portion and a magnification of the arrangement pattern corresponding to the second portion, and combining the arrangement patterns. 5 . The apparatus according to claim 4 , wherein the processing unit acquires the arrangement pattern corresponding to the boundary portion so that a droplet density becomes equal to a target density. 6 . The apparatus according to claim 1 , wherein in the arrangement pattern, an interval between the droplets in a first direction is different from an interval between the droplets in a second direction perpendicular to the first direction. 7 . The apparatus according to claim 6 , wherein in the arrangement pattern, the interval in the first direction and the interval in the second direction are different from each other according to anisotropy of a pattern of the mold. 8 . The apparatus according to claim 1 , wherein the arrangement pattern is acquired based on a volume of concave portions of the mold and a residual film thickness of a pattern to be formed on the substrate. 9 . A method of manufacturing an article, the method comprising: forming a pattern on a substrate using an imprint method; and processing the substrate, on which the pattern has been formed, to manufacture the article, wherein the imprint apparatus forms the pattern on the substrate by molding an imprint material on the substrate using a mold, and includes: a supply unit configured to supply droplets of the imprint material onto the substrate; and a processing unit configured to acquire arrangement patterns of the droplets on the substrate, wherein based on the arrangement pattern corresponding to a first portion of the mold and the arrangement pattern corresponding to a second portion of the mold, the processing unit acquires the arrangement pattern corresponding to a boundary portion between the first portion and the second portion. 10 . An imprint method of forming a pattern on a substrate by molding an imprint material on the substrate using a mold, comprising: acquiring arrangement patterns of droplets of the imprint material on the substrate; and supplying the droplets onto the substrate based on the arrangement patterns, wherein in the acquiring, based on the arrangement pattern corresponding to a first portion of the mold and the arrangement pattern corresponding to a second portion of the mold, the arrangement pattern corresponding to a boundary portion between the first portion and the second portion is acquired.

Assignees

Inventors

Classifications

  • G03F7/0017Primary

    for the production of embossing, cutting or similar devices; for the production of casting means · CPC title

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • Layered products · CPC title

  • B29C59/026Primary

    of layered or coated substantially flat surfaces · CPC title

  • Alignment marks and their environment (marks specific to masks G03F1/42; marks specific to molds or stamps G03F7/0002; overlay marks G03F7/70633; marks applied to semiconductor devices H10W46/00) · CPC title

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What does patent US2016288404A1 cover?
The present invention provides an imprint apparatus which forms a pattern on a substrate by molding an imprint material on the substrate using a mold, comprising a supply unit configured to supply droplets of the imprint material onto the substrate; and a processing unit configured to acquire arrangement patterns of the droplets on the substrate, wherein based on the arrangement pattern corresp…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification G03F7/0017. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Oct 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).