Method for connecting at least two components of an endoscope, components of an endorscope and endoscope

Patent metadata

Field	Value
Publication number	US-2016287052-A1
Application number	US-201615088414-A
Country	US
Kind code	A1
Filing date	Apr 1, 2016
Priority date	Apr 1, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement ( 1, 22 ) comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope.

First claim

What is claimed is:

1 . Method for connecting at least two components of an endoscope or medical instrument, wherein at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, which at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder.

2 . The method according to claim 1 , wherein, for forming the at least one brazing gap, the at least two components are held against one another with interlocking, frictional or material-bonding engagement.

3 . The method according to claim 1 , wherein the at least two components have a plurality of joining locations that are formed by joining regions assigned to one another and to which at least one brazing solder reservoir is respectively assigned.

4 . The method according to claim 1 , wherein more than two components are connected to one another, at least two joining locations that are formed by joining regions assigned to one another being provided.

5 . The method according to claim 1 , wherein the high-temperature brazing solder is a nickel-based solder or an iron-based solder.

6 . The method according to claim 1 , wherein the brazing preform is produced from a brazing mat.

7 . The method according to claim 1 , wherein the at least one brazing preform is fixed in the at least one brazing solder reservoir.

8 . The method according to claim 7 , wherein the at least one brazing preform is fixed in the at least one brazing solder reservoir, by adhesion or with interlocking engagement.

9 . The method according to claim 1 , wherein the at least one brazing solder reservoir and the at least one brazing preform are at least dimensioned in such a way that the brazing solder reservoir is substantially filled by the brazing preform and the brazing gap is substantially filled completely with brazing solder.

10 . A component of an endoscope that is designed for connecting to at least one further component of the endoscope by means of high-temperature brazing and for this purpose has a joining region, wherein the component has a brazing solder reservoir assigned to the joining region.

11 . An endoscope with an endoscope head, which has a housing and at least one built-in part and/or at least one built-on part, wherein the at least one built-in part and/or the at least one built-on part and/or the housing is designed according to claim 10 .

Assignees

• Storz Karl Gmbh & Co Kg

Inventors

• Bruesehaber Steffen
• Deutschendorf Andreas
• Hoefig Siegfried
• Krause Bernd

Classifications

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• B23K35/3033

  Ni as the principal constituent · CPC title

• B23K3/06

  Solder feeding devices; Solder melting pans · CPC title

• B23K1/18

  circumferential seams, e.g. of shells · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title