Slot sealing compound, slot seal, and method for producing a slot seal

Patent metadata

Field	Value
Publication number	US-2016285338-A1
Application number	US-201415036653-A
Country	US
Kind code	A1
Filing date	Nov 6, 2014
Priority date	Nov 14, 2013
Publication date	Sep 29, 2016
Grant date	—

Abstract

The invention relates to a slot sealing compound ( 7 ) for an electrical machine that comprises at least one slot ( 2 ) with a slot opening ( 5 ) for receiving an electrical conductor arrangement ( 3 ). Said slot sealing compound ( 7 ) contains a magnetic filler material, particularly a soft-magnetic filler material, and a reactive resin mixture that comprises at least one resin component. In the interests of improving storage stability for said slot sealing compound ( 7 ), the components thereof are selected to be suitable for cationic polymerisation. A catalyst, provided to accelerate the cationic polymerisation of said reactive resin mixture, is also added to said slot sealing compound ( 7 ).

First claim

What is claimed is:

1 .- 15 . (canceled)

16 . A slot sealing compound for an electric machine, comprising:
a reactive resin mixture containing at least one resin component; a catalyst configured to accelerate a cationic polymerization of the reactive resin mixture; and a magnetic filler material configured to bind or inhibit the catalyst at an ambient temperature.

17 . The slot sealing compound of claim 16 , wherein the magnetic filler material is a soft-magnetic filler material.

18 . The slot sealing compound of claim 16 , wherein the catalyst is at least one substance selected from the group consisting of organic ammonium salt, sulphonium salt, phosphonium salt, and imidazolium salt.

19 . The slot sealing compound of claim 16 , wherein the catalyst has a percentage by weight of at most 5% by weight.

20 . The slot sealing compound of claim 16 , wherein the catalyst has a percentage by weight of at most 1% by weight of the reactive resin mixture.

21 . The slot sealing compound of claim 16 , wherein the resin component is an epoxy resin.

22 . The slot sealing compound of claim 16 , further comprising an additive configured to bind or inhibit the catalyst at an ambient temperature.

23 . The slot sealing compound of claim 16 , further comprising organic and/or inorganic nanoparticles.

24 . The slot sealing compound of claim 16 , having a glass transition temperature of at least 180° C.

25 . The slot sealing compound of claim 16 , wherein the magnetic filler material has a percentage by weight, which amounts to at least 85% by weight.

26 . The slot sealing compound of claim 16 , wherein the magnetic filler material is present in the form of bimodal to multimodal particle size distributions.

27 . The slot sealing compound of claim 16 , having a storage stability of several days at a temperature of up to 45° and/or an air humidity of more than 50%.

28 . A slot seal, comprising a slot sealing compound which includes a reactive resin mixture containing at least one resin component, a catalyst configured to accelerate a cationic polymerization of the reactive resin mixture, and a magnetic filler material configured to bind or inhibit the catalyst at an ambient temperature.

29 . A method, comprising mixing a reactive resin mixture, comprising at least one resin component, a magnetic filler material and a catalyst with one another to form a slot sealing compound as a slot seal for an electric machine.

30 . The method of claim 29 , wherein the magnetic filler material is a soft-magnetic filler material.

31 . The method of claim 29 , further comprising:
introducing a conductor arrangement in a slot of the electric machine; placing the slot sealing compound to seal a seal opening of the slot; and subjecting the slot sealing compound to a heat treatment to initiate a cationic polymerization of the slot sealing compound.

32 . The method of claim 29 , further comprising hardening initially only a surface of the slot sealing compound through heat treatment to realize a superficial hardening.

33 . The method of claim 29 , further comprising hardening initially only a surface of the slot sealing compound through UV treatment to realize a superficial hardening.

34 . The method of claim 29 , wherein the polymerization of the slot sealing compound takes place at a hardening temperature from approx. 70° C.

Assignees

• Siemens Ag

Inventors

• Huber Jürgen
• Klaussner Bernhard
• Schirm Dieter

Classifications

• H02K15/13

  Applying slot closure means in the cores; Manufacture of slot closure means · CPC title

• H02K15/0018

  Electricity · mapped topic

• H02K3/30

  Windings characterised by the insulating material · CPC title

• B29C35/0805

  using electromagnetic radiation · CPC title

• H02K3/493 Primary

  magnetic · CPC title