Slot sealing material, slot seal and method for producing a slot seal

US10050488B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10050488-B2
Application numberUS-201415025070-A
CountryUS
Kind codeB2
Filing dateSep 15, 2014
Priority dateSep 27, 2013
Publication dateAug 14, 2018
Grant dateAug 14, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a slot sealing material (7) for an electric machine, which for accommodating an electric conductor arrangement (3) comprises at least one slot (2) having a slot opening (5). Said slot sealing material contains a magnetic filler, especially a soft-magnetic filler, and a reaction resin mixture comprising at least one resin component and a curing agent component. To improve the temperature resistance and mechanical strength of the slot sealing material, a dianhydride is used as curing agent component.

First claim

Opening claim text (preview).

What is claimed is: 1. A slot sealing material for a slot of an electric machine to accommodate an electric conductor arrangement, said slot sealing material comprising: a magnetic filler; a reaction resin mixture comprising at least a resin component and a curing agent component, said curing agent component containing a dianhydride; and a zeolith as a desiccant. 2. The slot sealing material of claim 1 , wherein the magnetic filler is a soft-magnetic filler. 3. The slot sealing material of claim 1 , wherein the dianhydride is at least one composition selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (CAS 2421-28-5), pyromellitic dianhydride (CAS 89-32-7), and 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (CAS 2420-87-3). 4. The slot sealing material of claim 1 , wherein the curing agent component is an epoxy resin. 5. The slot sealing material of claim 1 , further comprising organic and/or inorganic nanoparticles in order to improve a flow behavior of the reaction resin mixture and an impact resistance. 6. The slot sealing material of claim 1 , having a glass transition temperature equal to or greater than 200° C. 7. The slot sealing material of claim 1 , wherein the magnetic filler is contained at a proportion of at least 85% by weight. 8. The slot sealing material of claim 1 , wherein the magnetic filler is present in the form of bimodal to multimodal particle size distributions. 9. The slot sealing material of claim 1 , further comprising fibrous fillers having a fiber length of between 50 μm and 10000 μm. 10. The slot sealing material of claim 1 , further comprising fibrous fillers having a fiber length of between 100 μm and 3000 μm. 11. A slot seal for sealing a slot in an electric machine, said slot seal comprising a slot sealing material comprising a magnetic filler, a reaction resin mixture comprising at least a resin component and a curing agent component, said curing agent component containing a dianhydride, and a zeolith as a desiccant. 12. The slot seal of claim 11 , wherein the magnetic filler is a soft-magnetic filler. 13. The slot seal of claim 11 , wherein the dianhydride is at least one composition selected from the group consisting of 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (CAS 2421-28-5), pyromellitic dianhydride (CAS 89-32-7), and 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (CAS 2420-87-3). 14. The slot seal of claim 11 , wherein the curing agent component is an epoxy resin. 15. The slot seal of claim 11 , wherein the slot sealing material comprises organic and/or inorganic nanoparticles in order to improve a flow behavior of the reaction resin mixture and an impact resistance. 16. The slot seal of claim 11 , having a glass transition temperature equal to or greater than 200° C. 17. The slot seal of claim 11 , wherein the magnetic filler is contained at a proportion of at least 85% by weight. 18. The slot seal of claim 11 , wherein the magnetic filler is present in the form of bimodal to multimodal particle size distributions. 19. The slot seal of claim 11 , wherein the slot sealing material comprises fibrous fillers having a fiber length of between 50 μm and 10000 μm. 20. The slot seal of claim 11 , wherein the slot sealing material comprises fibrous fillers having a fiber length of between 100 μm and 3000 μm. 21. A method, comprising: mixing at least one resin component and a curing agent component containing a dianhydride to form a reaction resin mixture; combining the reaction resin mixture with a magnetic filler, and a zeolith as a desiccant to produce a slot sealing material; placing an electric conductor arrangement in a slot of an electric machine; and sealing a slot opening of the slot by placing the slot sealing material into the slot. 22. The method of claim 21 , further comprising heat-treating the slot sealing material, after being placed into the slot, at a temperature of 70° C. to 250° C. 23. The method of claim 21 , wherein the magnetic filler is a soft magnetic filler. 24. The method of claim 21 , further comprising heat-treating the slot sealing material, after being placed into the slot, at a temperature of 120° C. to 160° C.

Assignees

Inventors

Classifications

  • H02K3/493Primary

    magnetic · CPC title

  • Silicon-containing compounds · CPC title

  • Fibres or whiskers · CPC title

  • Metals · CPC title

  • Windings characterised by the insulating material · CPC title

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Frequently asked questions

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What does patent US10050488B2 cover?
The invention relates to a slot sealing material (7) for an electric machine, which for accommodating an electric conductor arrangement (3) comprises at least one slot (2) having a slot opening (5). Said slot sealing material contains a magnetic filler, especially a soft-magnetic filler, and a reaction resin mixture comprising at least one resin component and a curing agent component. To improv…
Who is the assignee on this patent?
Siemens Ag
What technology area does this patent fall under?
Primary CPC classification H02K3/493. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).