Electrical connector and socket for electrical component

Patent metadata

Field	Value
Publication number	US-2016285186-A1
Application number	US-201414778573-A
Country	US
Kind code	A1
Filing date	Mar 13, 2014
Priority date	Mar 21, 2013
Publication date	Sep 29, 2016
Grant date	—

Abstract

Contact pins are provided in a socket main body into which an IC package is accommodated and brought into electrical contact with connection terminals of the IC package. Each contact pin is formed of layers obtained by laminating an underlying layer containing Ni and a surface layer successively on a conductive base material. The surface layer includes a first layer on an underlying layer side, and a second layer in contact with the connection terminals. The first layer is formed of a plating layer of which a principal ingredient is a Pd—Ni alloy which is a material lower in diffusion speed of Sn than that of Pd, among materials into which Sn dissolves and diffuses by applying heat. The second layer is formed of a plating layer of which a principal ingredient is Ag which is a material lower in diffusion speed of Sn than that of the first layer.

First claim

1 . An electrical connector formed by laminating a plurality of layers on a base material, the plurality of layers comprising:
a first layer made of a material in which a diffusion speed of tin is lower than that of palladium, among materials into which tin dissolves and diffuses by applying heat; and a second layer made, on an opposite side of the first layer from the base material, of a material in which the diffusion speed of tin is lower than that in the first layer.

2 . The electrical connector according to claim 1 , wherein the first layer is made of a Pd—Ni alloy that includes palladium and nickel as principal ingredients.

3 . The electrical connector according to claim 1 , wherein the first layer is made of a Pd—Co alloy that includes palladium and cobalt as principal ingredients.

4 . The electrical connector according to claim 1 , wherein the second layer is made of silver.

5 . The electrical connector according to claim 1 , wherein the second layer is made of an Ag alloy that includes silver as a principal ingredient.

6 . The electrical connector according to claim 2 , wherein in the Pd—Ni alloy, a weight ratio of palladium is greater than a weight ratio of nickel.

7 . The electrical connector according to claim 6 , wherein the weight ratio of palladium is in a range of 60 to 90 weight % and the weight ratio of nickel is in a range of 10 to 40 weight %.

8 . The electrical connector according to claim 3 , wherein in the Pd—Co alloy, a weight ratio of palladium is greater than a weight ratio of cobalt.

9 . The electrical connector according to claim 5 , wherein nickel is added to the Ag alloy.

10 . The electrical connector according to claim 5 , wherein copper is added to the Ag alloy.

11 . The electrical connector according to claim 5 , wherein iron is added to the Ag alloy.

12 . The electrical connector according to claim 5 , wherein antimony is added to the Ag alloy.

13 . The electrical connector according to claim 1 , further comprising an underlying layer which is formed between the base material and the first layer and contains nickel, wherein
the first layer is formed of plating on the underlying layer, and the second layer is formed of plating on the first layer.

14 . A socket for electrical component, the socket comprising:
a socket main body into which an electrical component having connection terminals containing tin is accommodated; and the electrical connector according to claim 1 , which is provided in the socket main body and which is in contact with the connection terminals of the accommodated electrical component.

Assignees

• Enplas Corp

Inventors

• Oda Takahiro

Classifications

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H01R13/20

  Pins, blades, or sockets shaped, or provided with separate member, to retain co-operating parts together · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• H01R12/7076

  for connection between PCB and component, e.g. display · CPC title

• C22C5/04

  Alloys based on a platinum group metal · CPC title