Coil substrate, method of manufacturing coil substrate and inductor

Patent metadata

Field	Value
Publication number	US-2016284458-A1
Application number	US-201615180421-A
Country	US
Kind code	A1
Filing date	Jun 13, 2016
Priority date	Oct 11, 2013
Publication date	Sep 29, 2016
Grant date	—

Abstract

A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.

First claim

What is claimed is:

1 . A coil substrate comprising:
a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.

2 . The coil substrate according to claim 1 , wherein each of the structures further includes a second insulating layer formed on the first insulating layer such as to cover the wiring.

3 . The coil substrate according to claim 1 ,
wherein a part of an end surface of the wiring of each of the structures is exposed at an outer wall surface of the stacked structure, and wherein the end surface of the wiring of each of the structures exposed at the outer wall surface is covered by the insulating film.

4 . The coil substrate according to claim 1 ,
wherein the stacked structure is provided with a through hole that penetrates the stacked structure such that a part of an end surface of the wiring of each of the structures is exposed at an inner wall surface of the through hole, and wherein the end surface of the wiring of each of the structures exposed at the inner wall surface is covered by the insulating film.

5 . The coil substrate according to claim 1 , wherein the wiring of each of the structures is less than or equal to one roll of the spiral-shaped coil.

6 . The coil substrate according to claim 1 ,
wherein in at least one of the structures, a connecting portion is provided at an end portion of the respective wiring that is integrally formed with the wiring, and wherein a part of the connecting portion is exposed from the insulating film.

7 . The coil substrate according to claim 1 , further comprising a plurality of a combination of the stacked structure and the insulating film, the combinations being aligned while being connected with each other through a linking portion.

8 . The coil substrate according to claim 1 , wherein the first insulating layer is made of insulating resin.

9 . The coil substrate according to claim 1 , wherein the insulating film is made of insulating resin.

10 . The coil substrate according to claim 2 , wherein the second insulating layer is made of insulating resin.

11 . An inductor comprising:
the coil substrate according to claim 6 ; a resin including a magnetic material that covers the coil substrate while exposing the part of the connecting portion; and an electrode formed on the resin and electrically connected to the part of the connecting portion.

12 . The inductor according to claim 11 , wherein the resin is filled in a through hole that penetrates the coil substrate.

13 . The inductor according to claim 11 , wherein the magnetic material is magnetic filler.

14 . An inductor comprising:
the coil substrate according to claim 6 provided with a through hole that penetrates the coil substrate; and a magnetic material filled in the through hole.

Assignees

• Shinko Electric Ind Co

Inventors

• Nakamura Atsushi
• Nakanishi Tsukasa
• Sasada Yoichi

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F17/04

  with magnetic core · CPC title

• H01F41/043

  by thick film techniques · CPC title