What is claimed is:
1 . An actinic ray-sensitive or radiation-sensitive resin composition comprising:
an alkali-soluble resin; and a crosslinking agent, wherein the crosslinking agent is represented by the following General Formula (I),
wherein in General Formula (I),
each of R 1 and R 6 independently represents a hydrogen atom, or a hydrocarbon group having 5 or less carbon atoms,
each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group,
each of R 3 and R 4 independently represents a hydrogen atom, or an organic group having 2 or more carbon atoms, and
R 3 and R 4 may be bonded to each other to form a ring.
2 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein R 3 and R 4 in General Formula (I) are bonded to each other to form a ring.
3 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 , wherein R 3 and R 4 in General Formula (I) are bonded to each other to form a ring represented by the following General Formula (I-a),
wherein in General Formula (I-a),
each of R 7 and R 8 independently represents a substituent,
each of n1 and n2 independently represents an integer of 0 to 4, and
* indicates a connecting site to the phenolic nucleus.
4 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the alkali-soluble resin is a resin having a repeating unit represented by the following General Formula (1),
wherein in General Formula (1),
R represents a hydrogen atom or a methyl group,
X represents a group having a non-acid-decomposable hydrocarbon group,
Ar represents an aromatic ring, and
L represents a divalent linking group.
5 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a compound capable of generating an acid upon irradiation with actinic rays or radiation.
6 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , wherein the compound capable of generating an acid upon irradiation with actinic rays or radiation is an onium salt.
7 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , wherein the compound capable of generating an acid upon irradiation with actinic rays or radiation is a compound capable of generating an acid represented by the following General Formula (IIIB) or (IVB),
wherein in General Formula (IIIB),
each Xf independently represents a fluorine atom, or an alkyl group substituted with at least one fluorine atom,
each of R 1 and R 2 independently represents a hydrogen atom, or an alkyl group,
each L independently represents a divalent linking group,
Cy represents a cyclic organic group, and
x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10, and
in General Formula (IVB),
each Xf independently represents a fluorine atom, or an alkyl group substituted with at least one fluorine atom,
each of R 1 and R 2 independently represents a hydrogen atom, or an alkyl group,
each L independently represents a divalent linking group,
Cy represents a cyclic organic group,
Rf represents a group containing a fluorine atom, and
x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10.
8 . An actinic ray-sensitive or radiation-sensitive film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .
9 . A mask blank provided with the actinic ray-sensitive or radiation-sensitive film according to claim 8 .
10 . A photomask produced by a method including exposing the actinic ray-sensitive or radiation-sensitive film provided in the mask blank according to claim 9 , and developing the exposed actinic ray-sensitive or radiation-sensitive film.
11 . A pattern forming method, comprising:
forming an actinic ray-sensitive or radiation-sensitive film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ; exposing the film; and developing the exposed film using a developer to form a pattern.
12 . The pattern forming method according to claim 11 , wherein the exposure is carried out using X-rays, an electron beam, or EUV.
13 . A method for manufacturing an electronic device, comprising the pattern forming method according to claim 11 .
14 . A compound represented by the following General Formula (I-b),
wherein in General Formula (I-b),
each of R 1b and R 6b independently represents an alkyl group having 5 or less carbon atoms,
each of R 2b and R 5b independently represents an alkyl group having 6 or less carbon atoms or a cycloalkyl group having 3 to 12 carbon atoms, and
Z represents an atomic group necessary for forming a ring together with the carbon atom in General Formula (I-b).
15 . A method for producing a compound represented by the following General Formula (I), comprising using a compound represented by the following General Formula (I-c) as a raw material,
wherein in General Formula (I),
each of R 1 and R 6 independently represents a hydrogen atom, or a hydrocarbon group having 5 or less carbon atoms,
each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group,
each of R 3 and R 4 independently represents a hydrogen atom, or an organic group having 2 or more carbon atoms, and
R 3 and R 4 may be bonded to each other to form a ring, and
in General Formula (I-c),
R 1 , R 3 , R 4 , and R 6 have the same definitions as R 1 , R 3 , R 4 , and R 6 in General Formula (I), respectively.