Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank provided with actinic ray-sensitive or radiation-sensitive film, photomask, pattern forming method, method for manufacturing electronic device, electronic device, compound, and method for producing compound

US2016280621A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016280621-A1
Application numberUS-201615176762-A
CountryUS
Kind codeA1
Filing dateJun 8, 2016
Priority dateFeb 5, 2014
Publication dateSep 29, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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The composition contains an alkali-soluble resin and a crosslinking agent that is represented by the following General Formula (I). In the formula, each of R 1 and R 6 independently represents a hydrogen atom or a hydrocarbon group having 5 or less carbon atoms; each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group; and each of R 3 and R 4 independently represents a hydrogen atom or an organic group having 2 or more carbon atoms, and R 3 and R 4 may be bonded to each other to form a ring.

First claim

Opening claim text (preview).

What is claimed is: 1 . An actinic ray-sensitive or radiation-sensitive resin composition comprising: an alkali-soluble resin; and a crosslinking agent, wherein the crosslinking agent is represented by the following General Formula (I), wherein in General Formula (I), each of R 1 and R 6 independently represents a hydrogen atom, or a hydrocarbon group having 5 or less carbon atoms, each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group, each of R 3 and R 4 independently represents a hydrogen atom, or an organic group having 2 or more carbon atoms, and R 3 and R 4 may be bonded to each other to form a ring. 2 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein R 3 and R 4 in General Formula (I) are bonded to each other to form a ring. 3 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 , wherein R 3 and R 4 in General Formula (I) are bonded to each other to form a ring represented by the following General Formula (I-a), wherein in General Formula (I-a), each of R 7 and R 8 independently represents a substituent, each of n1 and n2 independently represents an integer of 0 to 4, and * indicates a connecting site to the phenolic nucleus. 4 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the alkali-soluble resin is a resin having a repeating unit represented by the following General Formula (1), wherein in General Formula (1), R represents a hydrogen atom or a methyl group, X represents a group having a non-acid-decomposable hydrocarbon group, Ar represents an aromatic ring, and L represents a divalent linking group. 5 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a compound capable of generating an acid upon irradiation with actinic rays or radiation. 6 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , wherein the compound capable of generating an acid upon irradiation with actinic rays or radiation is an onium salt. 7 . The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , wherein the compound capable of generating an acid upon irradiation with actinic rays or radiation is a compound capable of generating an acid represented by the following General Formula (IIIB) or (IVB), wherein in General Formula (IIIB), each Xf independently represents a fluorine atom, or an alkyl group substituted with at least one fluorine atom, each of R 1 and R 2 independently represents a hydrogen atom, or an alkyl group, each L independently represents a divalent linking group, Cy represents a cyclic organic group, and x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10, and in General Formula (IVB), each Xf independently represents a fluorine atom, or an alkyl group substituted with at least one fluorine atom, each of R 1 and R 2 independently represents a hydrogen atom, or an alkyl group, each L independently represents a divalent linking group, Cy represents a cyclic organic group, Rf represents a group containing a fluorine atom, and x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10. 8 . An actinic ray-sensitive or radiation-sensitive film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 . 9 . A mask blank provided with the actinic ray-sensitive or radiation-sensitive film according to claim 8 . 10 . A photomask produced by a method including exposing the actinic ray-sensitive or radiation-sensitive film provided in the mask blank according to claim 9 , and developing the exposed actinic ray-sensitive or radiation-sensitive film. 11 . A pattern forming method, comprising: forming an actinic ray-sensitive or radiation-sensitive film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ; exposing the film; and developing the exposed film using a developer to form a pattern. 12 . The pattern forming method according to claim 11 , wherein the exposure is carried out using X-rays, an electron beam, or EUV. 13 . A method for manufacturing an electronic device, comprising the pattern forming method according to claim 11 . 14 . A compound represented by the following General Formula (I-b), wherein in General Formula (I-b), each of R 1b and R 6b independently represents an alkyl group having 5 or less carbon atoms, each of R 2b and R 5b independently represents an alkyl group having 6 or less carbon atoms or a cycloalkyl group having 3 to 12 carbon atoms, and Z represents an atomic group necessary for forming a ring together with the carbon atom in General Formula (I-b). 15 . A method for producing a compound represented by the following General Formula (I), comprising using a compound represented by the following General Formula (I-c) as a raw material, wherein in General Formula (I), each of R 1 and R 6 independently represents a hydrogen atom, or a hydrocarbon group having 5 or less carbon atoms, each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group, each of R 3 and R 4 independently represents a hydrogen atom, or an organic group having 2 or more carbon atoms, and R 3 and R 4 may be bonded to each other to form a ring, and in General Formula (I-c), R 1 , R 3 , R 4 , and R 6 have the same definitions as R 1 , R 3 , R 4 , and R 6 in General Formula (I), respectively.

Assignees

Inventors

Classifications

  • G03F7/038Primary

    Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

  • comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation · CPC title

  • by introduction of halogens; by substitution of halogen atoms by other halogen atoms · CPC title

  • G03F7/004Primary

    Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title

  • using a scanning corpuscular radiation beam, e.g. an electron beam · CPC title

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What does patent US2016280621A1 cover?
The composition contains an alkali-soluble resin and a crosslinking agent that is represented by the following General Formula (I). In the formula, each of R 1 and R 6 independently represents a hydrogen atom or a hydrocarbon group having 5 or less carbon atoms; each of R 2 and R 5 independently represents an alkyl group, a cycloalkyl group, an aryl group, or an acyl group; and each of R 3 …
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification G03F7/038. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Sep 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).