Semiconductor light emitting device

Patent metadata

Field	Value
Publication number	US-2016276560-A1
Application number	US-201514842162-A
Country	US
Kind code	A1
Filing date	Sep 1, 2015
Priority date	Mar 16, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first metal pillar, a second metal pillar, and an insulating layer. The semiconductor layer includes a first surface, a second surface, and a light emitting layer. The first metal pillar is electrically connected to the second surface. The first metal pillar includes first and second metal layers. The first metal layer is provided between the second surface and at least a part of the second metal layer. The second metal pillar is arranged side by side with the first metal pillar, and electrically connected to the second surface. The second metal pillar includes third and fourth metal layers. The third metal layer is provided between the second surface and at least a part of the fourth metal layer. The insulating layer is provided between the first and second metal pillars.

First claim

What is claimed is:

1 . A semiconductor light emitting device comprising:
a semiconductor section including a first surface, a second surface and a light emitting layer, the second surface being on an opposite side to the first surface, the second surface being apart from the first surface in a first direction, the second surface including a first region and a second region, the first region overlapping the light emitting layer in the first direction, the second region not overlapping the light emitting layer in the first direction; a first metal pillar electrically connected with the second region, the first metal pillar including a first metal layer and a second metal layer, the first metal layer being provided between the second surface and at least a part of the second metal layer, a hardness of the second metal layer being higher than a hardness of the first metal layer; a second metal pillar arranged with the first metal pillar in a second direction intersecting the first direction, the second metal pillar being electrically connected with the first region, the second metal pillar including a third metal layer and a fourth metal layer, the third metal layer being provided between the second surface and at least a part of the fourth metal layer, a hardness of the fourth metal layer being higher than a hardness of the third metal layer; and an insulating layer provided between the first metal pillar and the second metal pillar.

2 . The device according to claim 1 , wherein
the first metal layer and the third metal layer include copper, and the second metal layer and the fourth metal layer include at least one metal selected from nickel and titanium.

3 . The device according to claim 2 , wherein
the second metal layer and the fourth metal layer further include zinc.

4 . The device according to claim 1 , wherein
the first metal layer further includes a first side surface parallel to the first direction, the third metal layer further includes a second side surface parallel to the first direction, the second metal layer is provided between the first side surface and the insulating layer, and the fourth metal layer is provided between the second side surface and the insulating layer.

5 . The device according to claim 4 , wherein
the first metal pillar further includes a fifth metal layer including gold, the second metal pillar further includes a sixth metal layer including gold, the second metal layer is provided between the first metal layer and the fifth metal layer, and the fourth metal layer is provided between the third metal layer and the sixth metal layer.

6 . The device according to claim 1 , wherein
a thickness of the first metal layer in the first direction is larger than a thickness of the second metal layer in the first direction, and a thickness of the third metal layer in the first direction is larger than a thickness of the fourth metal layer in the first direction.

7 . The device according to claim 1 , wherein
the first metal pillar further includes a fifth metal layer including gold, the second metal pillar further includes a sixth metal layer including gold, the second metal layer is provided between the first metal layer and the fifth metal layer, and the fourth metal layer is provided between the third metal layer and the sixth metal layer.

8 . The device according to claim 6 , wherein
the thickness of the first metal layer in the first direction is not less than 3 micrometers and not more than 100 micrometers, the thickness of the second metal layer in the first direction is not less than 2 micrometers and not more than 5 micrometers, the thickness of the third metal layer in the first direction is not less than 3 micrometers and not more than 100 micrometers, and the thickness of the fourth metal layer in the first direction is not less than 2 micrometers and not more than 5 micrometers.

9 . The device according to claim 7 , wherein
a thickness of the fifth metal layer is not less than 0.01 micrometer and not more than 0.1 micrometer, and a thickness of the sixth metal layer is not less than 0.01 micrometer and not more than 0.1 micrometer.

10 . The device according to claim 1 , further comprising:
a phosphor layer provided on the first surface.

11 . The device according to claim 1 , wherein
the insulating layer is provided in a periphery of the first metal pillar and a periphery of the second metal pillar.

12 . The device according to claim 1 , wherein
the insulating layer includes black resin including a pigment component.

13 . A semiconductor light emitting device comprising:
a semiconductor section including a first surface, a second surface and a light emitting layer, the second surface being on an opposite side to the first surface, the second surface being apart from the first surface in a first direction, the second surface including a first region and a second region, the first region overlapping the light emitting layer in the first direction, the second region not overlapping the light emitting layer in the first direction; a first metal pillar electrically connected with the second region, the first metal pillar including a first metal layer and a second metal layer, the first metal layer including a first side surface parallel to the first direction, a hardness of the second metal layer being higher than a hardness of the first metal layer; a second metal pillar arranged with the first metal pillar in a second direction intersecting the first direction, the second metal pillar being electrically connected with the first region, the second metal pillar including a third metal layer and a fourth metal layer, the third metal layer including a second side surface parallel to the first direction, a hardness of the fourth metal layer being higher than a hardness of the third metal layer; and an insulating layer provided between the first metal pillar and the second metal pillar, the second metal layer being provided between the first side surface and the insulating layer, and the fourth metal layer being provided between the second side surface and the insulating layer.

14 . The device according to claim 13 , wherein
the first metal layer and the third metal layer include copper, and the second metal layer and the fourth metal layer include at least one metal selected from nickel and titanium.

15 . The device according to claim 14 , wherein
the second metal layer and the fourth metal layer further include zinc.

Assignees

• Toshiba Kk

Inventors

• Obata Susumu
• Kojima Akihiro

Classifications

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title

• H10H20/819

  characterised by their shape, e.g. curved or truncated substrates · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0362

  of encapsulations · CPC title

• H10H20/032

  of electrodes · CPC title