Light emitting device and light emitting apparatus having the same

Patent metadata

Field	Value
Publication number	US-9397261-B2
Application number	US-201213677566-A
Country	US
Kind code	B2
Filing date	Nov 15, 2012
Priority date	Nov 16, 2011
Publication date	Jul 19, 2016
Grant date	Jul 19, 2016

Abstract

A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

First claim

What is claimed is:

1. A light emitting device comprising:
a transmissive substrate;
a first pattern portion disposed on a top surface of the transmissive substrate and including a plurality of protrusions that protrude from the top surface;
a second pattern portion disposed on the top surface of the transmissive substrate and including a plurality of concaves each of which has a width smaller than a width of each of the plurality of protrusions;
a phosphor layer on the transmissive substrate;
a light emitting structure disposed under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first conductive semiconductor layer and the second conductive semiconductor layer, wherein the phosphor layer is on the top surface of the transmissive substrate, the phosphor layer directly contacts a lateral side of the second conductive semiconductor layer, the phosphor layer directly contacts a lateral side of the active layer, and the phosphor layer directly contacts a lateral side of the first conductive semiconductor layer;
a first electrode under the first conductive semiconductor layer;
a reflective electrode layer under the second conductive semiconductor layer, wherein a width of the reflective electrode layer is less than a width of the second conductive semiconductor layer;
a second electrode under the reflective electrode layer;
a first connection electrode under the first electrode;
a second connection electrode under the second electrode;
an insulating support member disposed around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent;
an insulating layer between the insulating support member and the reflective electrode layer; and
a transmissive resin layer between the transmissive substrate and the phosphor layer, the transmissive resin layer includes a resin material having a refractive index lower than the transmissive substrate, the transmissive resin layer contacting the protrusions and disposed in the concaves,
wherein the first connection electrode and the second connection electrode are overlapped with the first conductive semiconductor layer in a vertical direction,
wherein a thickness of the insulating support member is greater than a thickness of the insulating layer in the vertical direction,
wherein the insulating support member contacts a lateral surface of the first electrode, a lateral surface of the second electrode, a lateral surface of the first connection electrode and a lateral surface of the second connection electrode,
wherein a bottom surface of the insulating support member is aligned on a same horizontal plane with a bottom surface of the first connection electrode and a bottom surface of the second connection electrode,
wherein the first connection electrode has a first height, the second connection electrode has a second height, and the first height is greater than the second height,
wherein a width of the first electrode is equal to a width of the first connection electrode, and a width of the second electrode is equal to a width of the second connection electrode,
wherein the lateral surface of the second electrode contacts both the insulating support member and the insulating layer, and
wherein the insulating support member includes a first support member around a perimeter of the first connection electrode and a second support member around the perimeter of the second connection electrode, wherein the first support member is spaced apart from the second support member by a division slot filled with an insulating material.

2. The light emitting device of claim 1 , wherein the plurality of concaves are disposed on the protrusions, respectively.

3. The light emitting device of claim 1 , wherein the plurality of protrusions have a hemispheric shape.

4. The light emitting device of claim 1 , wherein the plurality of protrusions are aligned at a regular interval and the concaves are aligned at an irregular interval.

5. The light emitting device of claim 1 , wherein each of the plurality of concaves has a width corresponding to 50% or less based on the width of each of the plurality of protrusions.

6. The light emitting device of claim 5 , wherein the width of each of the plurality of protrusions is in a range of 0.1 μm to 10 μm.

7. The light emitting device of claim 1 ,
wherein a top surface of the phosphor layer includes roughness.

8. The light emitting device of claim 1 , wherein the ceramic-based thermal diffusion agent comprises at least one of oxide, nitride, fluoride and sulfide including at least one of Al, Cr, Si, Ti, Zn and Zr.

9. The light emitting device of claim 1 , wherein the reflective electrode layer comprises:
a contact layer that contacts the light emitting structure;
a reflective layer under the contact layer; and
a first diffusion barrier layer under the reflective layer,
wherein the first electrode comprises:
a first adhesive layer bonded under the first diffusion barrier layer;
a second diffusion barrier layer under the first adhesive layer; and
a first bonding layer under the second diffusion barrier layer.

10. The light emitting device of claim 1 , further comprising:
a first electrode bonding layer bonded between the first electrode and the first connection electrode; and
a second electrode bonding layer bonded between the second electrode and the second connection electrode.

11. The light emitting device of claim 10 , wherein the first electrode bonding layer comprises:
a first bonding electrode bonded to the first electrode; and
a second bonding electrode bonded between the first connection electrode and the first bonding electrode, and
the second electrode bonding layer comprises:
a third bonding electrode bonded to the second electrode; and
a fourth bonding electrode bonded between the second connection electrode and the third bonding electrode.

12. The light emitting device of claim 1 , wherein the first support member is not overlapped with the active layer in the vertical direction.

13. The light emitting device of claim 1 , wherein the first pattern portion and the second pattern portion are between the transmissive substrate and the phosphor layer.

14. The light emitting device of claim 1 , further comprising a first semiconductor layer between the transmissive substrate and the first conductive semiconductor layer.

15. The light emitting device of claim 14 , wherein the first semiconductor layer is a buffer layer.

16. The light emitting device of claim 1 , wherein a top surface of the phosphor layer includes a light extracting structure.

17. A light emitting apparatus comprising:
a light emitting device including a support member formed at a lower portion of the light emitting device and a first connection electrode and a second connection electrode exposed to a bottom surface of the support member;
a plurality of lead frames on which the first connection electrode and the second connection electrode of the light emitting device are mounted; and
a body on which the lead frames are installed,
wherein the light emitting device comprises:
a transmissive substrate;
a first pattern portion disposed on a top surface of the transmissive substrate and including a plurality of protrusions that protrude from the top surface;
a second pattern portion disposed on the top surface of the transmissive substrate and including a plurality of concaves each

Assignees

• Lg Innotek Co Ltd

Inventors

• Kang Pil Geun
• Choi Hee Seok
• Choi Seok Beom
• Lee Ju Won
• Hwang Deok Ki
• Han Young Ju

Classifications

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10H20/8581

  characterised by their material · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title