Method for forming photosensitive resin layer, method for producing photoresist pattern, and method for producing plated molded article

Patent metadata

Field	Value
Publication number	US-2016274459-A1
Application number	US-201615066767-A
Country	US
Kind code	A1
Filing date	Mar 10, 2016
Priority date	Mar 18, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

A method of forming a photosensitive resin layer including laminating a photosensitive resin layer including a chemically amplified positive-type photosensitive resin composition which includes an acid generator which generates an acid upon light exposure and generates an acid by heating on a metal surface having catalytic activity, a resin whose solubility in alkali increases under the action of an acid, and an organic solvent, on an catalytic activity-containing metal surface of a substrate; and heating the photosensitive resin layer, so that the solubility in alkali of the photosensitive resin layer increases as the layer becomes closer to an interface with the substrate.

First claim

What is claimed is:

1 . A method for forming a photosensitive resin layer, comprising:
laminating a photosensitive resin layer comprising a chemically amplified positive-type photosensitive resin composition that includes an acid generator (A) which contains an acid generator (A1) which generates an acid upon light exposure and generates an acid by heating on a metal surface having catalytic activity, a resin (B) whose solubility in alkali increases under the action of an acid, and an organic solvent (S), on a catalytic activity-containing metal surface of a substrate; and heating the photosensitive resin layer, so that the solubility in alkali of the photosensitive resin layer increases as the layer becomes closer to an interface with the substrate.

2 . The method for forming a photosensitive resin layer according to claim 1 , wherein the metal surface is copper or an alloy containing copper.

3 . The method for forming a photosensitive resin layer according to claim 1 , wherein the heating is performed at a temperature of 60° C. to 150° C.

4 . A method for producing a photoresist pattern, comprising:
regioselectively exposing the photosensitive resin layer formed by the method according to claim 1 to light; and developing the exposed photosensitive resin layer to form a photoresist pattern, wherein, in a cross-sectional shape of a non-resist section in a cross section perpendicular to the substrate and traversing a resist section and the non-resist section in the photoresist pattern, a relationship between the width L1 at an interface with the substrate and the width L2 of the surface on the opposite side of the substrate is represented by L2≦L1.

5 . The method for producing a photoresist pattern according to claim 4 , wherein, in a cross-sectional shape of a non-resist section in the cross section perpendicular to the substrate and traversing a resist section and the non-resist section in the photoresist pattern, the width of the cross section of the non-resist section is greater as the section becomes closer to the interface with the substrate.

6 . The method for producing a photoresist pattern according to claim 4 , wherein a cross-sectional shape of a resist section in a cross section perpendicular to the substrate and traversing the resist section and a non-resist section in the photoresist pattern forms an undercut shape at an interface with the substrate.

7 . A method for producing a plated molded article, comprising plating the non-resist section in the photoresist pattern formed by the method for producing a photoresist pattern according to claim 4 .

8 . A method for producing a photoresist pattern, comprising:
laminating a photosensitive resin layer comprising a chemically amplified positive-type photosensitive resin composition that includes an acid generator (A) which contains an acid generator (A1) which generates an acid upon light exposure and generates an acid by heating on a metal surface having catalytic activity, a resin (B) whose solubility in alkali increases under the action of an acid, and an organic solvent (S), on the metal surface of a substrate having catalytic activity; heating the photosensitive resin layer; regioselectively exposing the photosensitive resin layer to light; and developing the exposed photosensitive resin layer to form a photoresist pattern whose shape is controlled by an acid generated on the metal surface.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Shimura Eiichi
• Kumada Shinji
• Momozawa Aya

Classifications

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/168

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/09

  characterised by structural details, e.g. supports, auxiliary layers (supports for printing plates in general B41N) · CPC title