Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US2016274457A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016274457-A1 |
| Application number | US-201415031877-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 26, 2014 |
| Priority date | Nov 13, 2013 |
| Publication date | Sep 22, 2016 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A mask blank, including: a thin film for forming a transfer pattern; a resist underlying film made of a resist underlying composition and provided on the thin film; a resist film made of a chemically amplified resist and provided on the resist underlying film; and a mixture film provided so as to be interposed between the resist underlying film and the resist film, wherein the resist underlying film is configured so that a molecular weight is reduced from the thin film side to the resist film side in a thickness direction, and has a low molecular weight region in which the molecular weight is low on the resist film side surface, and the mixture film is formed by mixing a component of the low molecular weight region and a component of the chemically amplified resist.
Opening claim text (preview).
1 . A mask blank, comprising: a thin film for forming a transfer pattern; a resist underlying film made of a resist underlying composition and provided on the thin film; a resist film made of a chemically amplified resist and provided on the resist underlying film; and a mixture film provided so as to be interposed between the resist underlying film and the resist film, wherein the resist underlying film is configured so that a molecular weight is reduced from the thin film side to the resist film side in a thickness direction, and has a low molecular weight region in which the molecular weight is low on the resist film side surface, and the mixture film is formed by mixing a component of the low molecular weight region and a component of the chemically amplified resist. 2 . The mask blank according to claim 1 , wherein a thickness of the mixture film is 0.1 nm or more and 10 nm or less. 3 . The mask blank according to claim 1 , wherein the resist underlying composition contains at least one kind or more of an organic solvent having a boiling point of 100° C. or more. 4 . The mask blank according to claim 3 , wherein the resist underlying composition contains a crosslinking agent, and a crosslinking start temperature is lower than the boiling point of at least one kind of the organic solvent. 5 . The mask blank according to claim 1 , wherein the resist underlying composition contains a base polymer and a crosslinking catalyst, and contains 0.05 mass % or more and 10 mass % or less of the crosslinking catalyst based on 100 mass % of the base polymer. 6 . A transfer mask, wherein a transfer pattern is formed on the thin film of the mask blank of claim 1 .
Auxiliary processes, e.g. cleaning or inspecting · CPC title
Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof · CPC title
Liquid compositions therefor, e.g. developers · CPC title
having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title
Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.