Heat-resistant SAN resin, method of producing the same and heat-resistant SAN resin composition comprising the same

US9777088B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9777088-B2
Application numberUS-201515106785-A
CountryUS
Kind codeB2
Filing dateDec 14, 2015
Priority dateApr 27, 2015
Publication dateOct 3, 2017
Grant dateOct 3, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are a heat-resistant SAN resin, a method of producing the same and a heat-resistant SAN resin composition comprising the same. More specifically, disclosed are a heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, a method of producing the same and a heat-resistant SAN resin composition comprising the same. Advantageously, provided are a heat-resistant SAN resin with maintained heat resistance, improved polymerization conversion rate and increased weight average molecular weight, a method of producing the same, and a heat-resistant SAN resin composition containing the same with excellent chemical resistance, superior mechanical properties and good balance between properties.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, wherein the heat-resistant SAN resin has a weight average molecular weight of 79,000 g/mol or more. 2. The heat-resistant SAN resin according to claim 1 , wherein the vinyl cyanide compound comprises one or more selected from the group consisting of acrylonitrile, methacrylonitrile and ethacrylonitrile. 3. The heat-resistant SAN resin according to claim 1 , wherein the hydroxyalkyl (meth)acrylate comprises one or more selected from the group consisting of hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, 3-hydroxypentyl acrylate, 6-hydroxynonyl acrylate, hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 2-hydroxypentyl methacrylate, 5-hydroxypentyl methacrylate, 7-hydroxyheptyl methacrylate and 5-hydroxydecyl methacrylate. 4. The heat-resistant SAN resin according to claim 1 , wherein the heat-resistant SAN resin has an oligomer content of 0.1 to 0.8% by weight. 5. A method of producing a heat-resistant SAN resin comprising a step for bulk polymerizing ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, wherein the bulk polymerization has a polymerization conversion rate of 63 to 76%. 6. The method according to claim 5 , wherein the bulk polymerization is continuous polymerization. 7. The method according to claim 5 , wherein the bulk polymerization is carried out at 105 to 120° C. 8. A heat-resistant SAN resin composition comprising: a heat-resistant SAN resin polymerized using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, wherein the heat-resistant SAN resin has a weight average molecular weight of 79,000 g/mol or more; and an ABS resin. 9. The heat-resistant SAN resin composition according to claim 8 , wherein the heat-resistant SAN resin is present in an amount of 60 to 90% by weight and the ABS resin is present in an amount of 10 to 40% by weight. 10. The heat-resistant SAN resin composition according to claim 8 , wherein the heat-resistant SAN resin composition has a tensile elongation of 23% or higher. 11. The heat-resistant SAN resin composition according to claim 8 , wherein the heat-resistant SAN resin composition has an impact strength of 19 J/m or higher. 12. The heat-resistant SAN resin composition according to claim 8 , wherein the heat-resistant SAN resin composition has an environmental stress cracking resistance (ESCR) of 28 seconds or longer, wherein the ESCR is a crack generation time measured after applying a thinner to the center of a specimen using a 1% strain jig. 13. An article produced from the heat-resistant SAN resin composition according to claim 8 . 14. The heat-resistant SAN resin composition of claim 8 , wherein the heat-resistant SAN resin has an oligomer content of 0.1 to 0.8% by weight.

Assignees

Inventors

Classifications

  • with unsaturated nitriles · CPC title

  • C08F279/04Primary

    Vinyl aromatic monomers and nitriles as the only monomers · CPC title

  • C08F212/10Primary

    with nitriles · CPC title

  • Homopolymers or copolymers of alkyl-substituted styrenes · CPC title

  • Monomers containing a branched unsaturated aliphatic radical or a ring substituted by an alkyl radical · CPC title

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What does patent US9777088B2 cover?
Disclosed are a heat-resistant SAN resin, a method of producing the same and a heat-resistant SAN resin composition comprising the same. More specifically, disclosed are a heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, a method of prod…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification C08F279/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).