Display module and system applications

Patent metadata

Field	Value
Publication number	US-2016259368-A1
Application number	US-201615157235-A
Country	US
Kind code	A1
Filing date	May 17, 2016
Priority date	Dec 17, 2013
Publication date	Sep 8, 2016
Grant date	—

Abstract

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

First claim

What is claimed is:

1 . A display module comprising:
a display substrate including a front side, a back side, and a display area on the front side; an array of light emitting diodes (LEDs) within the display area; and an array of micro chips within the display area, wherein each micro chip is to switch and drive a corresponding group of the LEDs; a plurality of interconnects extending through the display substrate from the front surface to the back surface directly behind the display area; and one or more integrated circuit (IC) chips on the back side of the display substrate, wherein the plurality of interconnects electrically connect the array of micro chips to the one or more IC chips.

2 . The display module of claim 1 , wherein the array of LEDs comprises semiconductor-based vertical micro LEDs each having a maximum with of 1 to 100 μm.

3 . The display module of claim 2 , wherein each micro chip has a maximum with of 1 to 300 μm.

4 . The display module of claim 3 , wherein the one or IC chips is selected from the group consisting of a scan driver chip, a data driver chip, power management IC chip, processor chip, memory chip, timing controller chip, touch sense IC chip, wireless controller chip, and communications IC chip.

5 . The display module of claim 4 , wherein the array of micro chips is electrically connected to a scan driver chip and a data driver chip on the back side of the display substrate.

6 . The display module of claim 1 , further comprising one or more ground vias through the display substrate.

7 . The display module of claim 6 , wherein the array of LEDs is electrically connected to the one or more ground vias.

8 . The display module of claim 7 , wherein the array of LEDs is electrically connected to the one or more ground vias with a transparent conductive material.

9 . The display module of claim 8 , wherein the transparent conductive material is selected from the group consisting of transparent conductive oxide and a transparent conductive polymer.

10 . The display module of claim 1 , wherein the array of LEDs and the array of micro chips are laterally surrounded by a passivation layer.

11 . The display module of claim 1 , wherein the passivation layer is formed of a material selected from the group consisting of epoxy, poly(methyl methacrylate), benzocyclobutene, polyimide, and polyester.

12 . The display module of claim 1 , wherein the display substrate comprises a flexible glass substrate.

13 . The display module of claim 1 , wherein the display substrate comprises silicon.

14 . The display module of claim 1 , wherein a portion of the array of micro chips includes ambient light sensors.

15 . The display module of claim 14 , wherein the one or IC chips includes a processor and sensor controller to manage ambient light correction.

16 . The display module of claim 1 , wherein the display module is incorporated into a wearable electronic device.

17 . The display module of claim 16 , wherein the display area of the display substrate spans a watch face of a smartwatch.

18 . The display module of claim 1 , wherein the display substrate is secured to a spool.

19 . The display module of claim 1 , wherein the display module is incorporated into a television.

Assignees

• Apple Inc

Inventors

• Bibl Andreas
• Sakariya Kapil V
• Pavate Vikram

Classifications

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title