Display module and system applications

Patent metadata

Field	Value
Publication number	US-9367094-B2
Application number	US-201314109864-A
Country	US
Kind code	B2
Filing date	Dec 17, 2013
Priority date	Dec 17, 2013
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

First claim

What is claimed is:

1. A display module comprising:
a display substrate including a front surface, a back surface, and a display area on the front surface;
a plurality of interconnects extending through the display substrate from the front surface to the back surface directly behind the display area;
an array of light emitting diodes (LEDs) in the display area and electrically connected with the plurality of interconnects; and
one or more driver circuits on the front surface or the back surface of the display substrate.

2. The display module of claim 1 , wherein the one or more driver circuits are on the back surface of the display substrate.

3. The display module of claim 1 , wherein the plurality of interconnects are through vias extending through the display substrate from the front surface to the back surface.

4. The display module of claim 1 , further comprising a battery on the back surface of the display substrate.

5. The display module of claim 2 , wherein a flexible printed circuit does not connect the one or more driver circuits to the display substrate.

6. The display module of claim 1 , further comprising a ground via through the display substrate.

7. The display module of claim 2 , further comprising an array of micro chips on the front surface of the display substrate and within the display area.

8. The display module of claim 7 , wherein the array of micro chips are electrically connected with the plurality of interconnects and the array of LEDs.

9. The display module of claim 8 , wherein the array of micro chips overlaps the plurality of interconnects.

10. The display module of claim 8 , wherein the array of micro chips does not overlap the plurality of interconnects.

11. The display module of claim 8 , wherein the array of micro chips includes an array of ambient light sensors.

12. The display module of claim 8 , further comprising a uniform distribution of ambient light sensors in the array of micro chips.

13. The display module of claim 2 , wherein the display module is incorporated into a wearable electronic device.

14. The display module of claim 13 , wherein the wearable electronic device is a smartwatch.

15. The display module of claim 14 , wherein the display area of the display substrate spans a watch face and band of the smartwatch.

16. The display module of claim 2 , wherein the display substrate is secured to a spool.

17. The display module of claim 16 , wherein the spool comprises one or more driver circuits in electrical contact with the plurality of interconnects.

18. The display module of claim 17 , wherein the display module is incorporated into a television.

19. The display module of claim 1 , wherein the array of LEDs comprises semiconductor-based vertical micro LEDs each having a maximum with of 1 to 100 μm.

20. The display module of claim 19 , further comprising an array of micro chips on the front surface of the display substrate and within the display area.

21. The display module of claim 20 , wherein each micro chip is to switch and drive a corresponding group of the semiconductor-based vertical micro LEDs.

22. The display module of claim 21 , wherein the one or more driver circuits comprises one or more scan driver chips and one or more data driver chips.

23. The display module of claim 22 , wherein each micro chip is electrically connected to a scan driver chip and a data driver chip.

24. The display module of claim 22 , wherein the plurality of interconnects electrically connect the array of micro chips to the one or more scan driver chips and the one or more data driver chips.

Assignees

• Luxvue Technology Corp
• Apple Inc

Inventors

• Bibl Andreas
• Sakariya Kapil V
• Pavate Vikram

Classifications

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title