Method for manufacturing nanometric objects using the rupture of a layer deformed by wrinkles

Patent metadata

Field	Value
Publication number	US-2016257597-A1
Application number	US-201415028836-A
Country	US
Kind code	A1
Filing date	Oct 16, 2014
Priority date	Oct 17, 2013
Publication date	Sep 8, 2016
Grant date	—

Abstract

A method for manufacturing a nanoscale object from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method reiterating: melting the foundation for a duration higher than or equal to 50 ns, thickness of the foundation being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting generating a simultaneous deformation of the elastic layer and of the foundation and a localized contact between the elastic layer and the rigid substrate insulating the regions from the foundation; solidifying the foundation to bring the foundation back to the solid state; until the foundation reaches yield point of the elastic layer.

First claim

1 - 10 . (canceled)

11 : A method for manufacturing a nanoscale object from a structure including a strained elastic layer on a foundation in a solid state present at a surface of a rigid substrate, the method comprising:
melting the foundation to bring the foundation to a liquid state for a duration higher than or equal to 50 ns, thickness of the foundation being at least 20 nm and lower than a predetermined thickness corresponding to a theoretical peak-to-peak amplitude of wrinkles, the melting resulting in a stress relaxation of the elastic layer which generates a simultaneous deformation, by formation of wrinkles, of the elastic layer and of the foundation, the formation of the wrinkles being accompanied by a localized contact between the elastic layer and the rigid substrate separating regions of the foundation; solidifying the foundation to bring the foundation back to a solid state, the solidification forming a solid structure having wrinkles at the surface; the melting and solidification being reiterated to increase an interval between separated regions of the foundation until the foundation reaches a yield point of the elastic layer.

12 : The method according to claim 1 , wherein the melting is made by a selective energy supply according to which the energy is absorbed by the foundation rather than by the strained elastic layer with a ratio of 100/1.

13 : The method according to claim 11 , wherein the melting is made by a selective energy supply according to which the energy is absorbed by the foundation rather than by the strained elastic layer with a ratio of 1000/1.

14 : The method according to claim 11 , wherein a duration of each of the melting and solidification is lower than 1 second.

15 : The method according to claim 11 , wherein a duration of each of the melting and solidification is lower than 1 microsecond.

16 : The method according to claim 11 , wherein a thermally insulating layer is inserted between the foundation and the rigid substrate.

17 : The method according to claim 11 , wherein, the foundation is electrically conducting and inserted between electrically insulating materials, and the melting of the at least part of the foundation is made by a thermal energy supply making use of Joule effect.

18 : The method according to claim 11 , wherein the foundation is inserted between electrically conducting materials and has a resistivity higher than that of the electrically conducting materials, and the melting of the at least part of the foundation is made by a thermal energy supply making use of a resistive heating.

19 : The method according to claim 11 , wherein rupture of the elastic layer is accompanied by an eruption of nanoscale balls, and further comprising collecting the nanoscale balls.

20 : The method according to claim 11 , wherein the strained elastic layer initially has a stress having a discontinuity in the plane of the layer.

21 : The method according to claim 20 , further comprising creating patterns at a surface of the strained elastic layer and/or of the foundation to induce the discontinuity.

22 : A nanoscale object obtained by the method according to claim 11 following rupture of the elastic layer.

Assignees

• Commissariat à l'énergie atomique et aux énergies alternatives
• Commissariat Energie Atomique

Inventors

• Benaissa Lamine
• Moulet Jean-Sebastien

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• B82B3/0033 Primary

  Manufacture or treatment of substrate-free structures, i.e. not connected to any support · CPC title

• C03B23/02 Primary

  Re-forming glass sheets · CPC title

• B29C61/00 Primary

  Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor (for surface shaping B29C59/18; for lining articles B29C63/38; for joining preformed parts B29C65/66 {; for packaging B65B53/00; connecting arrangements or other fittings for plastics pipes using shrink-down material F16L47/22, electrical connections insulated using heat shrinking insulating sleeves H01R4/72; cable junctions protected by sleeves H02G15/18}) · CPC title