Power semiconductor module and composite module

Patent metadata

Field	Value
Publication number	US-2016254255-A1
Application number	US-201615150938-A
Country	US
Kind code	A1
Filing date	May 10, 2016
Priority date	May 15, 2014
Publication date	Sep 1, 2016
Grant date	—

Abstract

A power semiconductor module includes a wiring member that electrically connects a front surface electrode of a semiconductor element and a circuit board of an insulating substrate in a housing. A resin provided in the housing covers the wiring member, and has a height in the vicinity of the wiring member. A cover covering the periphery of external terminals is provided between the resin and a first lid in the housing. A second lid is provided further outside the first lid in an aperture portion of the housing, and the space between the second lid and the first lid is filled with another resin.

First claim

What is claimed is:

1 . A power semiconductor module, comprising:
a housing having an aperture portion; a circuit board housed in an interior of the housing; a semiconductor element having an electrode on a front surface, a back surface being fixed to the circuit board; a wiring member electrically connecting the electrode of the semiconductor element and the circuit board; a first lid fixed in the aperture portion of the housing; a second lid fixed in the aperture portion of the housing and provided further outside the first lid; a first resin disposed between the first lid and the second lid; a second resin covering the wiring member and having an exposed surface, the exposed surface being located closer to the wiring member than the first lid; an external terminal having one end electrically and mechanically connected to the circuit board, and another end protruding further outside the second lid; and a cover covering the external terminal, and disposed between the exposed surface of the second resin and the first lid.

2 . The power semiconductor module according to claim 1 , wherein the external terminal is sealed with the first resin between the first lid and the second lid.

3 . The power semiconductor module according to claim 1 , wherein the wiring member includes
a conductive plate provided to face the semiconductor element and the circuit board, and a conductive post having one end electrically and mechanically connected to a second electrode of the semiconductor element or the circuit board, and another end electrically and mechanically connected to the conductive plate.

4 . The power semiconductor module according to claim 1 , wherein the housing has irregularities on an external side surface thereof.

5 . The power semiconductor module according to claim 1 , wherein the second lid has a projection between a plurality of external terminals protruding to an exterior.

6 . The power semiconductor module according to claim 1 , wherein the first resin and the second resin are thermosetting resins.

7 . The power semiconductor module according to claim 1 , wherein the cover is provided separately from an internal side surface of the housing.

8 . The power semiconductor module according to claim 1 , wherein the semiconductor element is a vertical semiconductor element having an another electrode on the back surface, and the another electrode and the circuit board are electrically and mechanically connected.

9 . The power semiconductor module according to claim 1 , wherein the housing includes a frame body and a base plate.

10 . The power semiconductor module according to claim 9 , wherein the circuit board is one portion of an insulating substrate, and the insulating substrate is fixed to the base plate.

11 . The power semiconductor module according to claim 1 , wherein the wiring member and the exposed surface are spaced by approximately 1 mm.

12 . A composite module comprising a plurality of power semiconductor modules according to claim 1 , and a bus bar unit electrically connecting the external terminals of the power semiconductor modules to each other.

13 . The composite module according to claim 12 , wherein the bus bar unit is formed of a plurality of bus bars partially overlapping with a gap therebetween.

14 . The composite module according to claim 13 , wherein a gap between the plurality of bus bars in the bus bar unit is 1 mm or less.

Assignees

• Fuji Electric Co Ltd

Inventors

• Hori Motohito
• Ikeda Yoshinari

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title