Multilayer ceramic electronic component and method of manufacturing the same
US-2016087189-A1 · Mar 24, 2016 · US
Ceramic electronic component and method of manufacturing the same
US2016254094A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016254094-A1 |
| Application number | US-201514920753-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 22, 2015 |
| Priority date | Feb 26, 2015 |
| Publication date | Sep 1, 2016 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.
First claim
Opening claim text (preview).
What is claimed is: 1 . A ceramic electronic component comprising: a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes. 2 . The ceramic electronic component of claim 1 , wherein the external electrodes comprise a conductive resin. 3 . The ceramic electronic component of claim 2 , wherein the conductive resin contains a metal powder comprising at least one selected from the group consisting of nickel (Ni), aluminum (Al), copper (Cu), gold (Au), silver (Ag), tin (Sn), palladium (Pd), platinum (Pt), and an alloy thereof. 4 . The ceramic electronic component of claim 2 , wherein the tin plating layer and a metal powder contained in the conductive resin are made of the same material. 5 . The ceramic electronic component of claim 1 , further comprising metal layers disposed on the outer surfaces of the ceramic body on which the external electrodes are formed. 6 . The ceramic electronic component of claim 5 , wherein the metal layers are disposed on regions in which the external electrodes are formed. 7 . The ceramic electronic component of claim 5 , wherein the metal layers comprise at least one selected from the group consisting of nickel (Ni), aluminum (Al), copper (Cu), gold (Au), silver (Ag), tin (Sn), palladium (Pd), platinum (Pt), and an alloy thereof. 8 . The ceramic electronic component of claim 1 , wherein the internal electrodes include first and second internal electrodes that are alternately stacked, and the external electrodes include a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes. 9 . A method of manufacturing a ceramic electronic component, comprising steps of: forming internal electrodes on dielectric sheets; stacking a plurality of the dielectric sheets to form a ceramic body; forming external electrodes on outer surfaces of the ceramic body; and forming tin plating layers on the external electrodes. 10 . The method of claim 9 , further comprising, before the step of forming the external electrodes, a step of forming metal layers on the outer surfaces of the ceramic body. 11 . The method of claim 10 , wherein the step of forming metal layers includes dipping the ceramic body in a conductive paste and then drying the ceramic body. 12 . The method of claim 9 , wherein the step of forming the external electrodes includes mixing together a polymer resin and a metal powder to form a conductive resin paste for forming the external electrodes.
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2016254094A1 cover?
- A ceramic electronic component includes a ceramic body; internal electrodes disposed in the ceramic body; external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes; and tin plating layers disposed on the external electrodes.
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Sep 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).