Probe pin and method for producing a probe pin

Patent metadata

Field	Value
Publication number	US-2016252547-A1
Application number	US-201315034918-A
Country	US
Kind code	A1
Filing date	Nov 7, 2013
Priority date	Nov 7, 2013
Publication date	Sep 1, 2016
Grant date	—

Abstract

A probe pin ( 100, 100 ′) for electronic testing of semi-conductor elements is provided. The pin contains an electrically conductive core element ( 200 ) made up of a metallic alloy, and an electrically insulating jacket element ( 300 ) which surrounds the core element ( 200 ) over regions thereof. The core element ( 200 ) contains a distal contact section ( 210 ) for electrical contacting to a semi-conductor element. The metallic alloy of the core element contains at least 67% by weight rhodium, 0.1% by weight to 1% by weight zirconium, up to 1% by weight yttrium, and up to 1% by weight cerium. A method for producing a probe pin is also described.

First claim

1 .- 15 . (canceled)

16 . A probe pin for electronic testing of semi-conductor elements, comprising an electrically conductive core element comprising a metallic alloy, and an electrically insulating jacket element, wherein the jacket element surrounds the core element over regions thereof, wherein the core element comprises a distal contact section for electrical contact with a semi-conductor element, and wherein the metallic alloy of the core element comprises at least 67% by weight rhodium; 0.1% by weight to 1% by weight zirconium; up to 1% by weight yttrium; and up to 1% by weight cerium.

17 . The probe pin according to claim 16 , wherein the metallic alloy comprises at least 97% by weight rhodium.

18 . The probe pin according to claim 16 , wherein the metallic alloy comprises 0.1% by weight to 0.6% by weight zirconium.

19 . The probe pin according to claim 16 , wherein the metallic alloy comprises 0.01% by weight to 0.5% by weight yttrium and/or 0.01% by weight to 0.5% by weight cerium.

20 . The probe pin according to claim 16 , wherein the metallic alloy comprises a grain refinement and a higher extensibility compared to at least 99.999% pure rhodium.

21 . The probe pin according to claim 16 , wherein the hardness of the metallic alloy in hard-drawn condition ranges from 500 HV to 750 HV and/or the hardness in a heat-treated condition ranges from 400 HV to 650 HV.

22 . The probe pin according to claim 16 , wherein the jacket element fully surrounds the core element in a circumferential direction and partly surrounds the core element in a longitudinal direction.

23 . The probe pin according to claim 16 , further comprising an electrically conductive layer-like encompassing element fully surrounding the electrically insulating jacket element in a circumferential direction and at least partly in a longitudinal direction, and wherein the electrically conductive element counteracts cross-talk between probe pins arranged next to each other.

24 . The probe pin according to claim 16 , wherein the distal contact section is conical in shape.

25 . The probe pin according to claim 16 , wherein the core element comprises a proximal contact section for electrical contacting with a probe card.

26 . A method for producing a probe pin for electronic testing of semi-conductor elements, wherein the probe pin comprises an electrically conductive core element comprising a metallic alloy and an electrically insulating jacket element, wherein the jacket element surrounds the core element over regions thereof and the core element comprises a distal contact section for electrical contacting the probe pin with a semi-conductor element, the method comprising the steps of:
a. providing a cylinder-like pre-mold comprising the metallic alloy forming the core element, wherein the metallic alloy comprises at least 67% by weight rhodium; 0.1% by weight to 1% by weight zirconium; up to 1% by weight yttrium; and up to 1% by weight cerium; b. drawing the pre-mold into a wire; c. subdividing the wire into wire-sections to provide the electrically conductive core element of the probe pin; d. applying the electrically insulating jacket element onto the core element; and e. providing a cone-like distal contact section of the core element.

27 . The method according to claim 26 , further comprising hardening the metallic alloy through a temperature treatment to adjust the hardness.

28 . The method according to claim 27 , wherein the temperature treatment is performed at a temperature between 150° C. and 600° C. and for a period of at least 10 minutes.

29 . The method according to claim 26 , wherein step e. comprises etching to produce the cone-like distal contact section of the core element.

30 . A probe pin for electronic testing of semi-conductor elements manufactured according to claim 26 .

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Soerensen Per
• Staudt Nicole
• Weiland Reinhold
• Prunzel Ingo
• Lupton David Francis

Classifications

• G01R1/06788

  Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments (end pieces terminating in a probe H01R11/18) · CPC title

• G01R1/06755 Primary

  Material aspects · CPC title

• G01R3/00

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

• H01R43/20

  for assembling or disassembling contact members with insulating base, case or sleeve · CPC title