Oled packaging method and structure

Patent metadata

Field	Value
Publication number	US-2016248043-A1
Application number	US-201414430200-A
Country	US
Kind code	A1
Filing date	Sep 11, 2014
Priority date	Aug 21, 2014
Publication date	Aug 25, 2016
Grant date	—

Abstract

The present invention provides an OLED packaging method and structure. The method includes the following steps: providing an OLED substrate ( 1 ) and a package cover ( 4 ) and forming an alignment mark on the package cover ( 4 ); forming a circle of patternized desiccant layer ( 3 ) on the package cover ( 4 ); coating a circle of frame resin ( 5 ) on the package cover ( 4 ) at an outer side of the desiccant layer ( 3 ); attaching the package cover ( 4 ) and the OLED substrate ( 1 ) to each other; and subjecting the frame resin ( 5 ) to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate ( 1 ) with he package cover ( 4 ).

First claim

What is claimed is:

1 . An organic light emitting diode (OLED) packaging method, comprising the following steps:
(1) providing an OLED substrate and a package cover and forming an alignment mark on the package cover; (2) forming a circle of patternized desiccant layer on the package cover; (3) coating a circle of frame resin on the package cover at an outer side of the desiccant layer; (4) attaching the package cover and the OLED substrate to each other; and (5) subjecting the frame resin to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate with the package cover.

2 . The OLED packaging method as claimed in claim 1 , wherein the package cover is a glass substrate or a metal board; and the OLED substrate comprises a thin-film transistor (TFT) array formed thereon.

3 . The OLED packaging method as claimed in claim 1 , wherein in step (2), the desiccant layer is formed on the package cover at an inner side of a resin application location where the frame resin is to be formed and in step (3), the frame resin is coated on the package cover at the resin application location where the frame resin is to be formed in such a way that the frame resin is immediately adjacent to the desiccant layer.

4 . The OLED packaging method as claimed in claim 3 , wherein in step (2), an operation for forming the patternized desiccant layer is to directly cut a desiccant sheet into a desired pattern, which is attached to the package cover immediately adjacent to the inner side of the resin application location, the desiccant layer having a width of 100um-2000um and a height of 1 um-100um.

5 . The OLED packaging method as claimed in claim 3 , wherein in step (2), an operation for forming the patternized desiccant layer is to first make a desiccant into a solution, which is coated, through application or screen printing, on the package cover at the inner side of the resin application location, the positioning the package cover in a high temperature over for baking for hours at 120° C.-350° C. to remove a solvent from the desiccant solution so as to allow the desiccant to solidify and form the desiccant layer, the desiccant layer having a width of 100 um-2000 um and a height of 1 um-100 um.

6 . The OLED packaging method as claimed in claim 3 , wherein in step (2), the desiccant layer comprises a molecular sieve film, the molecular sieve being silicates or aluminosilicates in a crystallized form.

7 . The OLED packaging method as claimed in claim 6 , wherein in step (2), an operation for forming the patternized desiccant layer is to first grind 4A molecular sieve into powder, the powder particle size being 1 um-100 um, and to add water to make a paste, the molecular sieve being coated, through screen printing, on the package cover at the inner side of the resin application location, and then to position the package cover in a high temperature oven for baking for hours at 120° C.-350° C. to remove water and form the molecular sieve film, the molecular sieve film having a width of 100 um-2000 um and a height of 1 um-100 um.

8 . The OLED packaging method as claimed in claim 1 , wherein in step (3), the frame resin ( 5 ) comprises a ultraviolet (UV) resin and the frame resin has a height corresponding to that of the desiccant layer.

9 . An organic light emitting diode (OLED) packaging method, comprising the following steps:
(1) providing an OLED substrate and a package cover and forming an alignment mark on the package cover; (2) forming a circle of patternized desiccant layer on the package cover; (3) coating a circle of frame resin on the package cover at an outer side of the desiccant layer; (4) attaching the package cover and the OLED substrate to each other; and (5) subjecting the frame resin to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate with the package cover; wherein the package cover is a glass substrate or a metal board; and the OLED substrate comprises a thin-film transistor (TFT) array formed thereon; wherein in step (2), the desiccant layer is formed on the package cover at an inner side of a resin application location where the frame resin is to be formed and in step (3), the frame resin is coated on the package cover at the resin application location where the frame resin is to be formed in such a way that the frame resin is immediately adjacent to the desiccant layer; wherein in step (2), an operation for forming the patternized desiccant layer is to directly cut a desiccant sheet into a desired pattern, which is attached to the package cover immediately adjacent to the inner side of the resin application location, the desiccant layer having a width of 100 um-2000 um and a height of 1 um-100 um; and wherein in step (3), the frame resin comprises a ultraviolet (UV) resin and the frame resin has a height corresponding to that of the desiccant layer.

10 . An organic light emitting diode (OLED) packaging structure, comprising an OLED substrate, a package cover arranged above the OLED substrate, a frame resin arranged between the OLED substrate and the package cover, and a desiccant layer arranged between the OLED substrate and the package cover and located at an inner side of the frame resin.

11 . The OLED packaging structure as claimed in claim 10 , wherein the package cover comprises a glass substrate or a metal board, the OLED substrate comprising a thin-film transistor (TFT) array formed thereon, the frame resin being set immediately adjacent to the desiccant layer, the desiccant layer having a width of 100 um-2000 um and a height of 1 um-100 um, the desiccant layer comprising a molecular sieve film, the molecular sieve comprising silicates or aluminosilicates in a crystallized form, the frame resin comprising a ultraviolet (UV) resin, the frame resin having a height corresponding to that of the desiccant layer.

Assignees

• Shenzhen China Star Optoelect

Inventors

• Liu Yawei
• Wang Yifan
• Lo Changcheng

Classifications

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/874

  including getter material or desiccant · CPC title