Optical imaging device with image defect determination

Patent metadata

Field	Value
Publication number	US-2016246182-A1
Application number	US-201614993076-A
Country	US
Kind code	A1
Filing date	Jan 11, 2016
Priority date	Jul 1, 2008
Publication date	Aug 25, 2016
Grant date	—

Abstract

An optical imaging device, including an imaging unit and a measuring device. The imaging unit includes a first optical element group having at least one first optical element, which contributes to the imaging. The measuring device determines an imaging error, which occurs during the imaging, using a capturing signal. The measuring device includes a measurement light source, a second optical element group and a capturing unit. The measurement light source emits at least one measurement light bundle, The second optical element group includes an optical reference element and a second optical element, which guide the measurement light bundle onto the capturing unit, to generate the capturing signal. Each second optical element has a defined spatial relationship with a respective one of the first optical elements, The second optical elements differ from the first optical elements. The measuring device determines the imaging error with the capturing signal.

First claim

1 .- 74 . (canceled)

75 . An optical imaging device, comprising
an imaging unit configured to image an object point onto an image point and a measuring device, wherein:
the measuring device is configured to determine at least one imaging error resulting from the object point being imaged onto the image point,
the measuring device comprises: at least one measurement light source, an optical element group having at least one optical element, and at least one capturing unit,
the measurement light source is configured to emit at least one measurement light bundle,
the optical element group is configured to direct the at least one measurement light bundle onto the at least one capturing unit, to generate at least one capturing signal, and
thermal shielding for the at least one optical element.

76 . The optical imaging device according to claim 75 , wherein the thermal shielding is configured to not interfere with a beam profile of the at least one measurement light bundle.

77 . The optical imaging device according to claim 76 , wherein the thermal shielding is configured with a passage cross section dimensioned no larger than sufficient to pass the at least one measurement light beam without interference by the thermal shielding.

78 . The optical imaging device according to claim 75 , further comprising an active temperature control device for the thermal shielding.

79 . The optical imaging device according to claim 75 , further comprising a passive temperature control device for the thermal shielding.

80 . The optical imaging device according to claim 75 , wherein the measurement light source is configured to emit a plurality of measurement light bundles.

81 . The optical imaging device according to claim 75 , configured as a scanner.

82 . The optical imaging device according to claim 75 , wherein
the imaging unit comprises an imaging optical element group with at least one imaging optical element, and the measuring device is configured to determine state changes of the at least one imaging optical element during transport of the optical imaging device and to register the determined state changes in a log.

83 . The optical imaging device according to claim 82 , wherein the measuring device is configured to determine changes in position and/or in orientation and/or in geometry of the at least one imaging optical element with respect to at least one reference.

84 . The optical imaging device according to claim 82 , further comprising:
a correction device, wherein
the correction device is configured to connect to the measuring device, and
the correction device is configured to modify the position and/or the orientation and/or the geometry of the at least one imaging optical element with respect to the at least one reference as a function of the log of the measuring device.

85 . The optical imaging device according to claim 75 , wherein
the imaging unit comprises an imaging optical element group with at least one imaging optical element, and the imaging unit is configured to image the object point onto the image point using extreme ultraviolet light, and the imaging unit comprises a support structure having at least one structural element, configured to support the at least one imaging optical element, and the at least one structural element comprises a material or material combination having a coefficient of thermal expansion of more than 0.6·10 −6 K −1 .

86 . The optical imaging device according to claim 85 , wherein the at least one structural element comprises a material or material combination having a coefficient of thermal expansion of more than 1.2·10 −6 K −1 .

87 . The optical imaging device according to claim 85 , wherein the imaging unit is configured to image the object point onto the image point using light having a wavelength in a 5 nm to 20 nm range.

88 . The optical imaging device according to claim 85 , further comprising:
a correction device, wherein
the correction device is configured to connect to the measuring device,
the measuring device is configured to output at least one signal representative of a position and/or an orientation and/or a geometry of the at least one imaging optical element with respect to at least one reference, and
the correction device is configured to modify the position and/or the orientation and/or the geometry of the at least one imaging optical element with respect to the at least one reference as a function of the at least one signal.

89 . The optical imaging device according to claim 85 , wherein the at least one structural element is made at least partially of an Invar material.

90 . The optical imaging device according to claim 75 , configured for executing a microlithography process.

91 . An optical imaging method comprising
imaging an object point onto an image point and determining at least one imaging error resulting from said imaging of the object point onto the image point, wherein said determining comprises:
emitting at least one measurement light bundle, and
directing the at least one measurement light bundle with an optical element group comprising at least one thermally shielded optical element onto at least one capturing unit, to generate at least one capturing signal.

92 . The optical imaging method according to claim 91 , wherein the thermal shielding of the at least one optical element comprises a temperature control.

93 . The optical imaging method according to claim 91 , wherein said determining further comprises:
imaging the object point onto the image point with an imaging optical element group of an optical imaging device, the imaging optical element group comprising at least one imaging optical element, and, during transport of the optical imaging device prior to imaging the object point onto the image point, determining changes in position and/or in orientation and/or in geometry of the at least one imaging optical element with respect to at least one reference and registering the changes in a log.

94 . The optical imaging method according to claim 93 , further comprising:
modifying the position and/or the orientation and/or the geometry of the at least one imaging optical element with respect to the at least one reference in accordance with the registered changes.

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Freimann Rolf
• Wegmann Ulrich

Classifications

• G01B9/02065

  using a second interferometer before or after measuring interferometer · CPC title

• G03F7/7085

  Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load · CPC title

• G01B11/002

  for measuring two or more coordinates · CPC title

• G01B9/02028

  Two or more reference or object arms in one interferometer · CPC title

• G01B9/02018

  Multipass interferometers, e.g. double-pass · CPC title