Method And System For Hybrid Integration Of Optical Communication Systems

Patent metadata

Field	Value
Publication number	US-2016246018-A1
Application number	US-201615144611-A
Country	US
Kind code	A1
Filing date	May 2, 2016
Priority date	Sep 4, 2009
Publication date	Aug 25, 2016
Grant date	—

Abstract

Methods and systems for hybrid integration of optical communication systems may comprise in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects: receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die; modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects; receiving modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die; generating electrical signals in said silicon photonics die based on said received modulated optical signals; and communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.

First claim

1 - 20 . (canceled)

21 . A method for communication, the method comprising:
in an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects:
receiving one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
modulating said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects;
receiving modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generating electrical signals in said silicon photonics die based on said received modulated optical signals; and
communicating said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.

22 . The method according to claim 21 , wherein said metal interconnects comprise copper pillars.

23 . The method according to claim 21 , comprising receiving said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

24 . The method according to claim 21 , comprising receiving said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

25 . The method according to claim 21 , comprising modulating said one or more received CW non-modulated optical signals utilizing one or more optical modulators integrated in said silicon photonics die.

26 . The method according to claim 25 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

27 . The method according to claim 21 , comprising generating said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

28 . The method according to claim 21 , comprising communicating optical signals into and/or out of said silicon photonics die utilizing grating couplers.

29 . The method according to claim 21 , wherein said optical source comprises one or more semiconductor lasers.

30 . The method according to claim 21 , wherein said hybrid integration optical communication system comprises a plurality of transceivers.

31 . A system for communication, the system comprising:
an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal interconnects, said optical communication system being operable to:
receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
modulate said one or more received CW non-modulated optical signals in said silicon photonics die using electrical signals received from said one or more electronics die via said metal interconnects;
receive modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generate electrical signals in said silicon photonics die based on said received modulated optical signals; and
communicate said generated electrical signals to at least one of said one or more electronics die via said metal interconnects.

32 . The system according to claim 31 , wherein said metal interconnects comprise copper pillars.

33 . The system according to claim 31 , wherein said optical communication system is operable to receive said one or more CW non-modulated optical signals from an optical source assembly coupled to said silicon photonics die.

34 . The system according to claim 31 , wherein said optical communication system is operable to receive said one or more CW non-modulated optical signals from one or more optical fibers coupled to said silicon photonics die.

35 . The system according to claim 31 , wherein said optical communication system is operable to modulate said one or more received CW non-modulated optical signals utilizing one or more optical modulators integrated in said silicon photonics die.

36 . The system according to claim 35 , wherein said one or more optical modulators comprise Mach-Zehnder interferometer modulators.

37 . The system according to claim 31 , wherein said optical communication system is operable to generate said electrical signals in said silicon photonics die utilizing one or more photodetectors integrated in said silicon photonics die.

38 . The system according to claim 31 , wherein said optical communication system is operable to communicate optical signals into and/or out of said silicon photonics die utilizing grating couplers.

39 . The system according to claim 31 , wherein said optical source comprises one or more semiconductor lasers.

40 . A system for communication, the system comprising:
an optical communication system comprising a silicon photonics die and one or more electronics die bonded to said silicon photonics die utilizing metal pillars, said optical communication system being operable to:
receive one or more continuous wave (CW) non-modulated optical signals in said silicon photonics die from an optical source external to said silicon photonics die;
modulate said one or more received CW non-modulated optical signals based on electrical signals received from said one or more electronics die via said metal pillars;
receive modulated optical signals in said silicon photonics die from one or more optical fibers coupled to said silicon photonics die;
generate electrical signals utilizing photodetectors in said silicon photonics die based on said received modulated optical signals; and
communicate said generated electrical signals to said one or more electronics die via said metal interconnects.

Assignees

• Luxtera Inc

Inventors

• Pinguet Thierry
• Abdalla Sherif
• Peterson Mark
• Masini Gianlorenzo

Classifications

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10D88/00

  Three-dimensional [3D] integrated devices · CPC title

• H10D86/201

  the substrates comprising an insulating layer on a semiconductor body, e.g. SOI (H10D86/40 take precedence) · CPC title