Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Ultrasonic cleaning method
US2016236242A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016236242-A1 |
| Application number | US-201615137004-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 25, 2016 |
| Priority date | Jan 27, 2012 |
| Publication date | Aug 18, 2016 |
| Grant date | — |
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Abstract
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A cleaning method for cleaning an object involves disposing the object in a first cleaning liquid held in a first cleaning tank; ultrasonically vibrating the first cleaning liquid via a first intermediate medium in contact with the first cleaning tank; disposing the object in a second cleaning liquid held in a second cleaning tank; and ultrasonically vibrating the second cleaning liquid via a second intermediate medium in contact with the second cleaning tank, wherein the first cleaning liquid and the first intermediate medium allow sonic velocities, respectively, having a first difference from each other, wherein the second cleaning liquid and the second intermediate medium allow sonic velocities, respectively, having a second difference from each other, and wherein the first and second differences are different from each other.
First claim
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1 . A cleaning method for cleaning an object, the method comprising: disposing the object in a first cleaning liquid held in a first cleaning tank; ultrasonically vibrating the first cleaning liquid via a first intermediate medium in contact with the first cleaning tank; disposing the object in a second cleaning liquid held in a second cleaning tank; and ultrasonically vibrating the second cleaning liquid via a second intermediate medium in contact with the second cleaning tank, wherein the first cleaning liquid and the first intermediate medium allow sonic velocities, respectively, having a first difference from each other, wherein the second cleaning liquid and the second intermediate medium allow sonic velocities, respectively, having a second difference from each other, and wherein the first and second differences are different from each other. 2 . The method of claim 1 , further comprising: adjusting a temperature of at least one of the first intermediate medium and the second intermediate medium so as to set the first difference and the second difference differently. 3 . The method of claim 2 , wherein the adjusting the temperature includes: using a heating member. 4 . The method of claim 2 , wherein the adjusting the temperature includes: modifying a retention time of the first intermediate medium being in contact with the first cleaning tank. 5 . The method of claim 2 , wherein the first intermediate medium is degassed water, and wherein the adjusting the temperature includes modifying a retention time of the first intermediate medium being in contact with the first cleaning tank. 6 . The method claim 1 , wherein the first intermediate medium and the second intermediate medium have mutually different compositions. 7 . The method of claim 1 , wherein the first intermediate medium is degassed water.
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- What does patent US2016236242A1 cover?
- A cleaning method for cleaning an object involves disposing the object in a first cleaning liquid held in a first cleaning tank; ultrasonically vibrating the first cleaning liquid via a first intermediate medium in contact with the first cleaning tank; disposing the object in a second cleaning liquid held in a second cleaning tank; and ultrasonically vibrating the second cleaning liquid via a s…
- Who is the assignee on this patent?
- Siltronic Ag
- What technology area does this patent fall under?
- Primary CPC classification H10P50/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 18 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).