Wave dielectric transmission device, manufacturing method thereof, and in-millimeter wave dielectric transmission method

US2016226121A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016226121-A1
Application numberUS-201615097538-A
CountryUS
Kind codeA1
Filing dateApr 13, 2016
Priority dateSep 25, 2008
Publication dateAug 4, 2016
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.

First claim

Opening claim text (preview).

What is claimed is: 1 . A member via which an electromagnetic wave of a millimeter wave band can be transmitted to a signal processor, the member having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. 2 . The member of claim 1 , wherein the member has a relative dielectric constant of about 3 to about 6. 3 . The member of claim 2 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 4 . The member of claim 1 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 5 . The member of claim 1 , wherein the member comprises an acrylic resin-based material, urethane a resin-based material, an epoxy resin-based material, a silicon-based material, a polyimide-based dielectric material, or any combination of these materials. 6 . The member of claim 5 , wherein the member has a relative dielectric constant of about 3 to about 6. 7 . The member of claim 6 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 8 . The member of claim 5 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 9 . The member of claim 1 , wherein the member is made of an acrylic resin-based dielectric material and has a relative dielectric constant of 2.5 to 4.5, both inclusive, and a dielectric dissipation factor of 0.001 to 0.05, both inclusive. 10 . The member of claim 1 , wherein the member is made of an urethane resin-based dielectric material and has a relative dielectric constant of 2.8 to 4, both inclusive, and a dielectric dissipation factor of 0.001 to 0.05, both inclusive. 11 . The member of claim 1 , wherein the member is made of an epoxy resin-based dielectric material and has a relative dielectric constant of 4 to 6, both inclusive, and a dielectric dissipation factor of 0.001 to 0.01, both inclusive. 12 . The member of claim 1 , wherein the member is made of a silicon-based dielectric material and has a relative dielectric constant of 3 to 6, both inclusive, and a dielectric dissipation factor of 0.0001 to 0.001, both inclusive. 13 . The member of claim 1 , wherein the member is made of a polyimide-based dielectric material and has a relative dielectric constant of 3 to 4, both inclusive, and a dielectric dissipation factor of 0.001 to 0.01, both inclusive. 14 . The member of claim 1 , wherein the member is made of a viscoelastic material.

Assignees

Inventors

Classifications

  • Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

  • Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

  • Receivers · CPC title

  • Sensor installation details · CPC title

  • H01P3/16Primary

    Dielectric waveguides, i.e. without a longitudinal conductor · CPC title

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What does patent US2016226121A1 cover?
A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member pro…
Who is the assignee on this patent?
Sony Corp
What technology area does this patent fall under?
Primary CPC classification H01P3/16. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Aug 04 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).