Waveguide, Wave Beam Adjusting Device, Wave Beam Adjusting Method and Manufacturing Method
US-2024387973-A1 · Nov 21, 2024 · US
US2016226121A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016226121-A1 |
| Application number | US-201615097538-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 13, 2016 |
| Priority date | Sep 25, 2008 |
| Publication date | Aug 4, 2016 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A millimeter wave transmission device, the millimeter wave transmission device having (a) a first signal processing board for processing a millimeter wave signal; (b) a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal; and (c) a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The member constitutes a dielectric transmission path via which the millimeter wave signal is transmitted between the first signal processing board and the signal processing board.
Opening claim text (preview).
What is claimed is: 1 . A member via which an electromagnetic wave of a millimeter wave band can be transmitted to a signal processor, the member having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. 2 . The member of claim 1 , wherein the member has a relative dielectric constant of about 3 to about 6. 3 . The member of claim 2 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 4 . The member of claim 1 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 5 . The member of claim 1 , wherein the member comprises an acrylic resin-based material, urethane a resin-based material, an epoxy resin-based material, a silicon-based material, a polyimide-based dielectric material, or any combination of these materials. 6 . The member of claim 5 , wherein the member has a relative dielectric constant of about 3 to about 6. 7 . The member of claim 6 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 8 . The member of claim 5 , wherein the member has a dielectric dissipation factor of about 0.0001 to about 0.001. 9 . The member of claim 1 , wherein the member is made of an acrylic resin-based dielectric material and has a relative dielectric constant of 2.5 to 4.5, both inclusive, and a dielectric dissipation factor of 0.001 to 0.05, both inclusive. 10 . The member of claim 1 , wherein the member is made of an urethane resin-based dielectric material and has a relative dielectric constant of 2.8 to 4, both inclusive, and a dielectric dissipation factor of 0.001 to 0.05, both inclusive. 11 . The member of claim 1 , wherein the member is made of an epoxy resin-based dielectric material and has a relative dielectric constant of 4 to 6, both inclusive, and a dielectric dissipation factor of 0.001 to 0.01, both inclusive. 12 . The member of claim 1 , wherein the member is made of a silicon-based dielectric material and has a relative dielectric constant of 3 to 6, both inclusive, and a dielectric dissipation factor of 0.0001 to 0.001, both inclusive. 13 . The member of claim 1 , wherein the member is made of a polyimide-based dielectric material and has a relative dielectric constant of 3 to 4, both inclusive, and a dielectric dissipation factor of 0.001 to 0.01, both inclusive. 14 . The member of claim 1 , wherein the member is made of a viscoelastic material.
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title
Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title
Receivers · CPC title
Sensor installation details · CPC title
Dielectric waveguides, i.e. without a longitudinal conductor · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.