Carrier with heat dissipation structure

US2016201994A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016201994-A1
Application numberUS-201514594181-A
CountryUS
Kind codeA1
Filing dateJan 12, 2015
Priority dateJan 12, 2015
Publication dateJul 14, 2016
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A carrier with heat dissipation structure includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipation section extends from at least one end of the heat absorption section. The carrier of the present invention is flexible. The carrier has an internal chamber for vapor-liquid circulation and heat exchange of the working fluid. Accordingly, the heat dissipation efficiency of the intelligent mobile device correspondingly assembled with the carrier is greatly enhanced.

First claim

Opening claim text (preview).

What is claimed is: 1 . A carrier with heat dissipation structure comprising a main body, the main body being made of silicone or rubber material, the main body having a chamber having a capillary structure, a working fluid being contained in the chamber, a support section protruding from a wall face of the chamber, the main body having at least one heat absorption section and a heat dissipation section, the heat dissipation section extending from at least one end of the heat absorption section. 2 . The carrier with heat dissipation structure as claimed in claim 1 , wherein the capillary structure is selected from a group consisting of mesh body, fiber body and metal wire braided body. 3 . The carrier with heat dissipation structure as claimed in claim 1 , wherein the main body further has a rest section correspondingly assembled with the heat absorption section, the rest section having a receiving space, whereby at least one intelligent mobile device can be correspondingly connected and assembled in the receiving space. 4 . The carrier with heat dissipation structure as claimed in claim 1 , wherein the support section is composed of multiple ribs arranged at intervals. 5 . The carrier with heat dissipation structure as claimed in claim 1 , further comprising a heat conductor inlaid in the heat absorption section of the main body, the heat conductor having a first face and a second face, the first face being exposed to outer side of the main body, the second face facing the chamber of the main body, the capillary structure extending to a position adjacent to the second face of the heat conductor, the heat conductor being selected from a group consisting of a heat pipe, a vapor chamber and a graphite sheet. 6 . The carrier with heat dissipation structure as claimed in claim 1 , wherein the support section is composed of multiple raised bodies arranged at intervals. 7 . The carrier with heat dissipation structure as claimed in claim 1 , wherein the chamber of the main body further has a coating therein.

Assignees

Inventors

Classifications

  • F28D15/04Primary

    with tubes having a capillary structure · CPC title

  • especially adapted for evaporator or condenser surfaces (F28F13/187 takes precedence) · CPC title

  • the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

  • Wearable computers, e.g. on a belt · CPC title

  • Supports for telephone transmitters or receivers · CPC title

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Frequently asked questions

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What does patent US2016201994A1 cover?
A carrier with heat dissipation structure includes a main body. The main body is made of silicone or rubber material. The main body has a chamber having a capillary structure. A working fluid is contained in the chamber. At least one support section protrudes from a wall face of the chamber. The main body has at least one heat absorption section and a heat dissipation section. The heat dissipat…
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28D15/04. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Jul 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).