Heat dissipation structure for wearable mobile device

Patent metadata

Field	Value
Publication number	US-9367105-B1
Application number	US-201414555706-A
Country	US
Kind code	B1
Filing date	Nov 28, 2014
Priority date	Nov 28, 2014
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A heat dissipation structure for a wearable mobile device comprises a wearable mobile device and a flexible belt. The wearable mobile device has a receiving space which receives a plurality of electronic components having at least one heat source. The flexible belt is made of rubber or silicone and has a cavity which has at least one wick structure and a working liquid. A wall of the cavity protrudes to form a supporting portion. The flexible belt defines a heat absorbing portion and at least one heat dissipating portion. Two ends of the heat absorbing portion form the heat dissipating portion. The heat absorbing portion contacts the electronic components or the heat source to conduct heat. The present invention provides a heat dissipation structure using a vapor-liquid circulating chamber and structure disposed in a flexible belt for a wearable mobile device to enhance the whole heat dissipation efficiency.

First claim

What is claimed is:

1. A heat dissipation structure for a wearable mobile device, comprising:
a wearable mobile device having a receiving space which receives a plurality of electronic components, wherein the electronic components have at least one heat source; and
a flexible belt made of rubber or silicone, wherein the flexible belt has a cavity which is filled with a working liquid and protrudes to form a supporting portion, wherein a wall of the cavity has at least one wick structure, wherein the flexible belt defines a heat absorbing portion and at least one heat dissipating portion, wherein two ends of the heat absorbing portion form the heat dissipating portion, wherein the heat absorbing portion contacts the electronic components or the heat source to conduct heat.

2. The heat dissipation structure according to claim 1 , wherein the wick structure is selected to be one of mesh, fiber, metal wire braid, and sintered powder.

3. The heat dissipation structure according to claim 1 , wherein the electronic components are selected to be one of PCBs, transistors, CPUs, MCUs, GPUs, RAMs, displays, touch panels, and batteries.

4. The heat dissipation structure according to claim 1 , wherein the wall of the cavity has a coating layer.

5. The heat dissipation structure according to claim 1 , wherein a heat conductor is embedded in the heat absorbing portion, wherein one side of the heat conductor is attached to the electronic components or the heat source, wherein the other side of the heat conductor corresponds to the cavity of the flexible belt, wherein the wick structure is disposed around the heat conductor.

6. The heat dissipation structure according to claim 1 , wherein the heat absorbing portion of the flexible belt is thinner than the other portion of the flexible belt, wherein part of the heat absorbing portion contacts the heat transfer unit.

7. The heat dissipation structure according to claim 1 , further comprising at least one heat transfer unit which is selected to be one of a heat pipe, a vapor chamber, and a graphite sheet, wherein the heat transfer unit is disposed between the electronic components and the flexible belt.

8. The heat dissipation structure according to claim 1 , wherein the supporting portion has a plurality of ribs which are disposed in parallel, wherein at least one channel is disposed among the ribs.

9. The heat dissipation structure according to claim 1 , wherein the supporting portion has a plurality of protrusions which are spaced to each other, wherein at least one channel is disposed transverse to or longitudinal to the protrusions.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Shen Ching-Hang

Classifications

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/163

  Wearable computers, e.g. on a belt · CPC title