Heat shield film and method of forming heat shield film

US2016201555A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016201555-A1
Application numberUS-201414912261-A
CountryUS
Kind codeA1
Filing dateAug 18, 2014
Priority dateAug 22, 2013
Publication dateJul 14, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A heat shield film ( 100 ) that is formed on a wall surface of an aluminum-based member (W) includes: a matrix layer ( 10 ) diffusion-bonded to the wall surface (diffusion bonding layer ( 10 ′)), having a coefficient of linear expansion of 15×10 −6 /K to 25×10 −6 /K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles ( 20 ) dispersed in the matrix layer ( 10 ).

First claim

Opening claim text (preview).

1 . A heat shield film comprising: a matrix layer having a coefficient of linear expansion of 15×10 −6 /K to 25×10 −6 /K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles dispersed in the matrix layer, wherein the heat shield film is formed on a wall surface of an aluminum-based member, and the heat shield film is diffusion-bonded to the wall surface. 2 . The heat shield film according to claim 1 , wherein a glass transition temperature of the porcelain enamel material is lower than or equal to 400° C., and a heat-resistant temperature of the porcelain enamel material is higher than or equal to 450° C. 3 . The heat shield film according to claim 1 , wherein the porcelain enamel material contains silica, each of the hollow particles has a silica-based outer shell, and a surface of each silica-based outer shell is modified with a hydrophilic group. 4 . The heat shield film according to claim 1 , wherein the heat shield film has a two-layer structure of an upper layer and a base layer adjacent to the wall surface, and the base layer contains no hollow particles or contains the hollow particles in an amount smaller than that of the upper layer. 5 . A method of forming a heat shield film, comprising: a first step of manufacturing an intermediate product formed of an aluminum-based plate and the heat shield film on a surface of the plate by applying a mixed material of hollow particles, a glass frit and a glaze onto the surface of the plate, melting the glass frit by heating, and forming the heat shield film, formed of a matrix layer and the hollow particles dispersed in the matrix layer, on the surface of the plate, the matrix layer having a coefficient of linear expansion of 15×10 −6 /K to 25×10 −6 /K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and a second step of forming the heat shield film on a wall surface of an aluminum-based member formed of a molten metal hardened portion and the plate integrated with the hardened portion by accommodating the intermediate product in a die and casting aluminum-based molten metal on the plate of the intermediate product. 6 . The method according to claim 5 , wherein a thickness of a plate ranges from 1 mm to 2 mm.

Assignees

Inventors

Classifications

  • by wet methods · CPC title

  • with low melting point, e.g. Al 659 degrees C, Mg 650 degrees C · CPC title

  • F02B77/11Primary

    Thermal or acoustic insulation · CPC title

  • for building-up linings or coverings, e.g. of anti-frictional metal · CPC title

  • C03C8/14Primary

    Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016201555A1 cover?
A heat shield film ( 100 ) that is formed on a wall surface of an aluminum-based member (W) includes: a matrix layer ( 10 ) diffusion-bonded to the wall surface (diffusion bonding layer ( 10 ′)), having a coefficient of linear expansion of 15×10 −6 /K to 25×10 −6 /K in a temperature range of ordinary temperature to 200° C. and made of a porcelain enamel material; and hollow particles ( 20 ) dis…
Who is the assignee on this patent?
Toyota Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification F02B77/11. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Jul 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).