Method for polishing semiconductor wafers by means of simultaneous double-side polishing
US-9221149-B2 · Dec 29, 2015 · US
US2016199964A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016199964-A1 |
| Application number | US-201614994202-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 13, 2016 |
| Priority date | Jan 14, 2015 |
| Publication date | Jul 14, 2016 |
| Grant date | — |
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A method dresses one polishing cloth or two polishing pads simultaneously, in which a polishing cloth has been applied to a polishing plate, with at least one dresser ( 4 ), which is equipped with at least one dressing element ( 8 ), this at least one dressing element ( 8 ) being in contact with the at least one polishing cloth ( 11, 12 ) to be dressed, wherein the at least one polishing plate ( 21, 22 ) is rotated with a relative rotational speed and the at least one dresser ( 4 ) is rotated with a relative rotational speed and at least two different combinations of directions of rotation of the two pairs of polishing plates ( 21, 22 ) and pin wheels ( 31, 32 ) are executed during the simultaneous dressing of two polishing pads ( 11, 12 ) or during the dressing of one polishing cloth ( 11 ) of the polishing plate ( 21 ) and of the at least one dresser ( 4 ).
Opening claim text (preview).
1 . A method for dressing one polishing cloth or simultaneously dressing two polishing pads, each including a polishing cloth applied to a polishing plate, using at least one dresser including a dressing element, the dressing element being in contact with the polishing cloth to be dressed, the method comprising: rotating the at least one polishing plate with a first relative rotational speed; rotating the at least one dresser with a second relative rotational speed; and executing at least two different combinations of directions of rotation of (i) the polishing plates and pin wheels during a simultaneous dressing of the two polishing pads or, (ii) during the dressing of the one polishing cloth of the polishing plate, and the at least one dresser. 2 . The method of claim 1 , further comprising, when simultaneously dressing two polishing pads: rotating the at least one dresser using a rolling device including an inner gear wheel and an outer gear wheel. 3 . The method of claim 2 , further comprising: respectively rotating the polishing plates in opposite directions of rotation, and/or respectively rotating the pin wheels in opposite directions of rotation. 4 . The method of claim 3 , wherein the directions of rotation of at least one of the polishing plates and/or at least one of the pin wheels, are reversed at least once during the dressing. 5 . The method of claim 3 , wherein the directions of rotation of only one of the polishing plates and/or only one of the pin wheels) are reversed at the same time during the dressing. 6 . The method of claim 1 , further comprising dressing only the one polishing cloth, and reversing at least a direction of rotation of the polishing plate or a direction of rotation of the dresser once. 7 . The method of claim 1 , further comprising dressing only the one polishing cloth, and reversing at least a direction of rotation of the polishing plate and a direction of rotation of the dresser once. 8 . The method of claim 1 , wherein disks or rings covered with one or more dressing elements are used as dressers. 9 . The method of claim 1 , wherein the dressing elements include surfaces covered with diamonds. 10 . The method of claim 1 , wherein one to five dressers are used simultaneously. 11 . The method of claim 1 , wherein at least three dressers are used simultaneously. 12 . The method of claim 1 , wherein the polishing pads are foamed polishing pads. 13 . The method of claim 12 , wherein polishing pads foamed from polyurethane are used as the foamed polishing pads. 14 . The method of claim 2 , further comprising setting mutually facing faces of an upper polishing plate and a lower polishing plate plane-parallel to one another. 15 . The method of claim 2 , wherein the dressers have clearances, and in these clearances are included freely movable and/or fixed dressing elements. 16 . The method of claim 1 , further comprising: applying a dressing agent to the polishing pads during the dressing. 17 . The method of claim 1 , further comprising: applying a liquid dressing agent to the polishing pads during the dressing.
characterised by the composition or properties of the pad materials · CPC title
Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title
Dressing tools; Holders therefor · CPC title
taking regard of the presence of dressing tools · CPC title
using at least two conditioning tools · CPC title
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