Conductive structure and device with the conductive structure as electrode

Patent metadata

Field	Value
Publication number	US-2015016070-A1
Application number	US-201314135590-A
Country	US
Kind code	A1
Filing date	Dec 20, 2013
Priority date	Jul 10, 2013
Publication date	Jan 15, 2015
Grant date	—

Abstract

Provided is a conductive structure and a device with the conductive structure as an electrode. The conductive structure includes a reduced metal layer and an overlapping structure formed by nano metal wires. The overlapping structure has at least one connecting portion, and the reduced metal layer covers the nano metal wires at the connecting portions.

First claim

What is claimed is:

1 . A conductive structure, comprising:
an overlapping structure formed by nano metal wires, wherein the overlapping structure has at least one connecting portion; and a reduced metal layer covering the nano metal wires at the connecting portions.

2 . The conductive structure of claim 1 , wherein the reduced metal layer is a metal formed by a reduction reaction.

3 . The conductive structure of claim 1 , wherein a cross-sectional width of the connecting portions is at least 1.5 times greater than a cross-sectional height thereof.

4 . The conductive structure of claim 1 , wherein the reduced metal layer further covers the nano metal wires not at the connecting portions.

5 . The conductive structure of claim 4 , wherein a cross-sectional width of the nano metal wires covered by the reduced metal layer is at least 1.5 times greater than a cross-sectional height thereof.

6 . The conductive structure of claim 1 , wherein the overlapping structure is a layered or network structure.

7 . The conductive structure of claim 1 , wherein a material of each of the reduced metal layer and the nano metal wires is the same or different.

8 . The conductive structure of claim 1 , wherein a material of the nano metal wires comprises silver, copper, nickel, or an alloy thereof.

9 . The conductive structure of claim 1 , wherein the nano metal wires comprise a covering structure formed by a combination of a plurality of metal layers.

10 . The conductive structure of claim 1 , wherein a material of the reduced metal layer comprises silver, copper, nickel, titanium, or an alloy thereof

11 . The conductive structure of claim 1 , wherein a variation of a sheet resistance of the conductive structure after being bent 200 times with a radius of curvature of 0.5 cm is less than 20%.

12 . The conductive structure of claim 1 , wherein a variation of a sheet resistance of the conductive structure after being bent 4 times with a radius of curvature of 0.5 mm is less than 50%.

13 . A device, comprising a plurality of electrode structures, wherein at least one of the electrode structures is the conductive structure of claim 1 .

14 . The device of claim 13 , wherein the device comprises an organic light-emitting diode (OLED), an organic solar cell (OPV), or a touch panel (TP).

Assignees

• Ind Tech Res Inst

Inventors

• Chang Yi-Ming

Classifications

• G06F3/044

  by capacitive means · CPC title

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• H01B5/002 Primary

  Auxiliary arrangements · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• G06F2203/04111

  Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title