Sealing resin, semiconductor device, and photocoupler

Patent metadata

Field	Value
Publication number	US-2016197224-A1
Application number	US-201615071260-A
Country	US
Kind code	A1
Filing date	Mar 16, 2016
Priority date	Sep 13, 2013
Publication date	Jul 7, 2016
Grant date	—

Abstract

A semiconductor device includes: a sealing resin and a semiconductor element. The sealing resin includes a base resin and a curing agent. The base resin includes isocyanuric acid having an epoxy group. The curing agent includes an acid anhydride having an acid anhydride group. A mole ratio of the acid anhydride group to the epoxy group is not less than 0.67 and not more than 0.8. A semiconductor element is covered with the sealing resin.

First claim

What is claimed is:

1 . A photocoupler, comprising:
an inner resin including a base resin and a curing agent, the base resin including isocyanuric acid having an epoxy group, the curing agent including an acid anhydride having an acid anhydride group, a mole ratio of the acid anhydride group to the epoxy group being not less than 0.67 and not more than 0.8, the inner resin containing an internal lubricant wax having high polarity and a fatty acid, and a second external lubricant wax having low polarity; a light emitting element provided in the inner resin; a light receiving element provided in the inner resin; and an outer resin provided around the inner resin, the outer resin containing a first external lubricant wax having low polarity.

2 . The photocoupler according to claim 1 , wherein the isocyanuric acid includes 1,3,5-tris(2,3-epoxypropyl)isocyanuric acid, and the acid anhydride includes isomethyltetrahydrophthalic anhydride.

3 . The photocoupler according to claim 1 , wherein
a first inorganic filler is contained in the inner resin in a first content ratio of not less than 60 weight % and not more than 85 weight %, a second inorganic filler is contained in the outer resin in a second content ratio of not less than 60 weight % and not more than 85 weight %, and difference between the first content ratio and the second content ratio is not less than 5 weight % and not more than 12 weight %.

4 . The photocoupler according to claim 3 , wherein the first inorganic filler includes one selected from fused silica, crystalline silica, alumina, silicon nitride, and aluminum nitride, and the second inorganic filler includes one selected from fused silica, crystalline silica, alumina, silicon nitride, and aluminum nitride.

5 . The photocoupler according to claim 3 , wherein the first inorganic filler is one selected from filament-shaped and spherical, and the second inorganic filler is one selected from filament-shaped and spherical.

6 . A photocoupler, comprising:
a inner resin including a base resin and a curing agent, the base resin including isocyanuric acid having an epoxy group, the curing agent including an acid anhydride having an acid anhydride group, a mole ratio of the acid anhydride group to the epoxy group being not less than 0.67 and not more than 0.8, the inner resin containing an internal lubricant wax having high polarity and including a fatty acid, and a second external lubricant wax having low polarity; a light emitting element encapsulated with a potting resin, the potting resin being covered with the inner resin; a light receiving element provided in the inner resin; and an outer resin provided around the inner resin, the outer resin containing a first external lubricant wax having low polarity.

7 . The photocoupler according to claim 6 , wherein the isocyanuric acid includes 1,3,5-tris(2,3-epoxypropyl)isocyanuric acid, and the acid anhydride includes isomethyltetrahydrophthalic anhydride.

8 . The photocoupler according to claim 6 , wherein the first external lubricant wax includes a fatty acid ester, and the second external lubricant wax includes a fatty acid ester, and the internal lubricant wax includes a fatty acid.

Assignees

• Toshiba Kk

Inventors

• Muranaka Tetsuya
• Inoue Kayo
• Ikedo Yuichi

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• C09J179/04 Primary

  Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title