Semiconductor manufacturing apparatus and semiconductor manufacturing method

Patent metadata

Field	Value
Publication number	US-2016196995-A1
Application number	US-201514643753-A
Country	US
Kind code	A1
Filing date	Mar 10, 2015
Priority date	Jan 5, 2015
Publication date	Jul 7, 2016
Grant date	—

Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a wafer setting module on which a wafer is to be set. The apparatus further includes a cover module configured to cover a portion of the wafer set on the wafer setting module. The apparatus further includes a position controller configured to detect a position of the wafer set on the wafer setting module and control a position of the cover module based on the detected position of the wafer.

First claim

1 . A semiconductor manufacturing apparatus comprising:
a wafer setting module on which a wafer is to be set; a cover module configured to cover a portion of the wafer set on the wafer setting module; and a position controller configured to detect a position of the wafer set on the wafer setting module and control a position of the cover module based on the detected position of the wafer.

2 . The apparatus of claim 1 , wherein
the position controller comprises a plurality of weight detectors provided on the wafer setting module, the wafer being to be set on the wafer setting module via the weight detectors, and the position controller detects a position of a gravity center of the wafer based on weights of the wafer detected by the weight detectors.

3 . The apparatus of claim 1 , wherein the position controller comprises an optical detector configured to optically detect the position of the wafer.

4 . The apparatus of claim 3 , wherein the optical detector detects the position of the wafer by emitting light to a plurality of places on a lower face of the wafer.

5 . The apparatus of claim 1 , wherein the position controller controls the position of the cover module by pushing the cover module with a plurality of pressing members.

6 . The apparatus of claim 1 , wherein the cover module has a ring shape to cover an end portion of the wafer.

7 . The apparatus of claim 1 , further comprising a film forming module configured to form a film on the wafer in a state where the portion of the wafer is covered with the cover module.

8 . The apparatus of claim 1 , wherein the cover module covers the wafer so as to expose a film formed at an end portion of the wafer.

9 . The apparatus of claim 1 , further comprising a film removing module configured to remove a film formed on the wafer in a state where the portion of the wafer is covered with the cover module.

10 . The apparatus of claim 1 , comprising:
a film forming chamber configured to form a film on the wafer; a film removing chamber configured to remove the film formed on the wafer; and a conveyance module provided in a conveyance room which is communicated with the film forming chamber and the film removing chamber, and configured to convey the wafer to the film forming chamber and the film removing chamber, wherein the wafer setting module and the cover module are provided in the film removing chamber.

11 . A semiconductor manufacturing method comprising;
setting a wafer on a wafer setting module; covering a portion of the wafer set on the wafer setting module with a cover module; and detecting a position of the wafer set on the wafer setting module, and controlling a position of the cover module based on the detected position of the wafer.

12 . The method of claim 11 , wherein the wafer is set on the wafer setting module via a plurality of weight detectors,
the method further comprising detecting a position of a gravity center of the wafer based on weights of the wafer detected by the weight detectors, and controlling the position of the cover module based on the detected position of the gravity center of the wafer.

13 . The method of claim 11 , wherein the position of the wafer is optically detected.

14 . The method of claim 13 , wherein the position of the wafer is detected by emitting light to a plurality of places on a lower face of the wafer.

15 . The method of claim 11 , wherein the position of the cover module is controlled by pushing the cover module with a plurality of pressing members.

16 . The method of claim 11 , wherein the cover module has a ring shape to cover an end portion of the wafer.

17 . The method of claim 11 , further comprising forming a film on the wafer in a state where the portion of the wafer is covered with the cover module.

18 . The method of claim 11 , wherein the cover module covers the wafer so as to expose a film formed at an end portion of the wafer.

19 . The method of claim 11 , further comprising removing a film formed on the wafer in a state where the portion of the wafer is covered with the cover module.

20 . The method of claim 11 , further comprising:
conveying the wafer from a conveyance room into a film forming chamber which is communicated with the conveyance room; forming a film on the wafer in the film forming chamber; conveying the wafer from the film forming chamber into a film removing chamber which is communicated with the conveyance room; and removing the film formed on the wafer in the film removing chamber, wherein the wafer setting module and the cover module are provided in the film removing chamber.

Assignees

• Toshiba Kk

Inventors

• Onishi Takahiro

Classifications

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0606 Primary

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P14/6902

  composed of carbon, e.g. alpha-C, diamond or hydrogen doped carbon · CPC title

• H10P14/61

  using masks · CPC title