Electronic device cabinet and a dissipation board

Patent metadata

Field	Value
Publication number	US-2016192541-A1
Application number	US-201514864108-A
Country	US
Kind code	A1
Filing date	Sep 24, 2015
Priority date	Dec 26, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

An electronic device cabinet comprising a housing and a printed-circuit board positioned in an internal area of the housing and defining a dissipation chamber. The dissipation chamber is formed between a first surface of the printed-circuit board and a first dissipating surface of a dissipation board. The dissipation board is fitted into the housing. The printed-circuit board comprises at least one electronic component positioned in the dissipation chamber. The dissipation chamber further includes a filler in direct contact with a perimeter of the electronic component, with parts of the first surface of the printed-circuit board, with the tracks of the printed-circuit board, and with parts of the first dissipating surface of the dissipation board. The cabinet is configured so that a second dissipating surface of the dissipation board, opposite the first dissipating surface, is in direct contact with the external environment surrounding the cabinet.

First claim

1 . An electronic device cabinet ( 1 ) comprising a housing ( 2 ) and a printed-circuit board ( 3 ) with tracks, the printed-circuit board ( 3 ) being positioned in an internal area of the housing ( 2 ) and defining a dissipation chamber ( 4 ′);
the dissipation chamber ( 4 ′) being formed between a first surface ( 9 ) of the printed-circuit board ( 3 ) and a first dissipating surface ( 11 ) of a dissipation board ( 10 ),
the printed-circuit board ( 3 ) comprising at least one electronic component ( 5 a ) positioned in the dissipation chamber ( 4 ′),
the dissipation chamber ( 4 ′) keeping direct contact with a perimeter of the electronic component ( 5 a ), with parts of the first surface ( 9 ) of the printed-circuit board ( 3 ) with tracks of the printed-circuit board ( 3 ) and with parts of the first dissipating surface ( 11 ) of the dissipation board ( 10 ),
wherein a second dissipating surface ( 12 ) of the dissipation board ( 10 ), opposite to the first dissipating surface ( 11 ), is in direct contact with the external environment of the electronic device cabinet ( 1 ).

2 . The electronic device cabinet ( 1 ) according to claim 1 , wherein the dissipation board ( 10 ) is constituted by a metallic material.

3 . The electronic device cabinet ( 1 ) according to claim 2 , wherein the first dissipating surface ( 11 ) of the dissipation board ( 10 ) faces the printed-circuit board ( 3 ), and the second dissipating surface ( 12 ) faces the external environment surrounding the electronic device ( 1 ).

4 . The electronic device cabinet ( 1 ) according to claim 3 , wherein the dissipation board ( 10 ) is associated to the housing ( 2 ) by fitting.

5 . The electronic device cabinet ( 1 ) according to claim 4 , wherein the dissipation board ( 10 ) in conjunction with the printed-circuit board ( 3 ) delimits the internal area of the dissipation chamber ( 4 ′).

6 . The electronic device cabinet ( 1 ) according to claim 1 , wherein the filler ( 7 ) is directly in contact with terminals of the electronic component ( 5 a ).

7 . The electronic device cabinet ( 1 ) according to claim 1 , wherein the filler ( 7 ) comprises an electrically insulating paste.

8 . The electronic device cabinet ( 1 ) according to claim 1 , wherein the filler ( 7 ) comprises an electrically insulating elastomer.

9 . The electronic device cabinet ( 1 ) according to claim 6 , wherein the filler ( 7 ) comprises an additive or a charge of a thermally conductive material.

10 . The electronic device cabinet ( 1 ) according to claim 7 , wherein the filler ( 7 ) comprises an additive or a charge of a thermally conductive material.

11 . The electronic device cabinet ( 1 ) according to claim 8 , wherein the filler ( 7 ) comprises an additive or a charge of a thermally conductive material.

12 . A dissipation board ( 10 ) of an electronic device cabinet ( 1 ), the electronic device cabinet ( 1 ) comprising a housing ( 2 ) provided with a printed-circuit board ( 3 ) with tracks and a filler ( 7 ),
the dissipation board ( 10 ) arranged in a dissipation chamber ( 4 ′) formed between a first surface ( 9 ) of the printed-circuit board ( 3 ) with tracks, and a first dissipating surface ( 11 ) of the dissipation board ( 10 ), the printed-circuit board ( 3 ) further comprising at least one electronic component ( 5 a ) positioned in the dissipation chamber ( 4 ′), parts of the first dissipating surface ( 11 ) of the dissipation board ( 10 ) in contact with the filler ( 7 ), the filler in direct contact with a perimeter of the electronic component ( 5 a ), with parts of the first surface ( 9 ) of the printed-circuit board ( 3 ) and with the tracks of the printed-circuit board ( 3 ), wherein a second dissipating surface ( 12 ) of the dissipation board ( 10 ), opposite to the first dissipating surface ( 11 ), is in direct contact with the external environment surrounding the electronic device cabinet ( 1 ).

13 . The dissipation board ( 10 ) according to claim 10 , wherein said dissipation board is constituted by a metallic material.

14 . The dissipation board ( 10 ) according to claim 11 , wherein the first dissipating surface ( 11 ) faces the printed circuit ( 3 ), and the second dissipating surface ( 12 ) faces the external environment surrounding the electronic device cabinet ( 1 ).

15 . The dissipation board ( 10 ) according to claim 12 , wherein the latter is associated to the housing ( 2 ) by fitting.

Assignees

• Whirlpool Sa

Inventors

• Rech Rafael Burg
• Caldeira Ede Carlos James
• Cunico Lucas Mondardo

Classifications

• H05K7/20463 Primary

  Filling compound, e.g. potted resin · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H05K7/1418

  Card guides, e.g. grooves (H05K7/1425 takes precedence) · CPC title