Double insulated heat spreader

Patent metadata

Field	Value
Publication number	US-9480185-B2
Application number	US-201514591355-A
Country	US
Kind code	B2
Filing date	Jan 7, 2015
Priority date	Jan 8, 2014
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.

First claim

The invention claimed is:

1. An apparatus for thermal management for an electric device, comprising:
a primary heat spreader, comprising a first portion and a second portion, disposed within an enclosure that contains a printed circuit board (PCB) populated with at least two electrical components, wherein the primary heat spreader is thermally conductive and wherein the enclosure is entirely formed of an electrically insulating material; and
a first portion of a thermal interface and a second portion of the thermal interface, wherein the first and the second portions of the thermal interfaces are thermally conductive and electrically insulating, and wherein:
(i) a first electrical component of the at least two electrical components is thermally coupled through the PCB to the first portion of the thermal interface; the first portion of the thermal interface is disposed between the PCB and the first portion of the primary heat spreader; and the first portion of the primary heat spreader is disposed between the first portion of the thermal interface and an interior of a first face of the enclosure; and
(ii) a second electrical component of the at least two electrical components is thermally coupled through the PCB to the second portion of the thermal interface; the second portion of the thermal interface is disposed between the PCB and the second portion of the primary heat spreader; and the second portion of the primary heat spreader is disposed between the second portion of the thermal interface and the interior of the first face of the enclosure, wherein the first portion of the primary heat spreader is galvanically isolated from the second portion of the primary heat spreader.

2. The apparatus of claim 1 , further comprising a secondary heat spreader coupled to an exterior of the first face of the enclosure, wherein the secondary heat spreader is thermally conductive.

3. The apparatus of claim 1 , wherein the enclosure is formed from a polymer.

4. The apparatus of claim 1 , wherein the enclosure is at least partially filled with an electrically insulating encapsulating material.

5. The apparatus of claim 1 , wherein the first portion of the thermal interface is coupled to each of the PCB and the first portion of the primary heat spreader by a thermal adhesive, and the second portion of the thermal interface is coupled to each of the PCB and the second portion of the primary heat spreader by the thermal adhesive.

6. The apparatus of claim 1 , wherein the PCB is mechanically coupled to the first and the second portions of the primary heat spreader by at least one insulating mechanical fastener.

7. The apparatus of claim 1 , wherein the PCB is separated into a first PCB portion and a second PCB portion, and wherein the first electrical component is coupled to the first PCB portion and the second electrical component is coupled to the second PCB portion.

8. The apparatus of claim 1 , wherein the enclosure is part of an LED light fixture.

9. A power conversion apparatus with thermal management, comprising:
a power converter comprising:
a power converter enclosure containing a printed circuit board (PCB) populated with at least two electrical components;
a primary heat spreader, comprising a first portion and a second portion, disposed within the power converter enclosure, wherein the primary heat spreader is thermally conductive and wherein the power converter enclosure is entirely formed of an electrically insulating material; and
a first portion of a thermal interface and a second portion of the thermal interface wherein the first and the second portions of the thermal interfaces are thermally conductive and electrically insulating, and wherein:
(i) a first electrical component of the at least two electrical components is thermally coupled through the PCB to the first portion of the thermal interface; the first portion of the thermal interface is disposed between the PCB and the first portion of the primary heat spreader; and the first portion of the primary heat spreader is disposed between the first portion of the thermal interface and an interior of a first face of the power converter enclosure; and
(ii) a second electrical component of the at least two electrical components is thermally coupled through the PCB to the second portion of the thermal interface; the second portion of the thermal interface is disposed between the PCB and the second portion of the primary heat spreader; and the second portion of the primary heat spreader is disposed between the second portion of the thermal interface and the interior of the first face of the power converter enclosure, wherein the first portion of the primary heat spreader is galvanically isolated from the second portion of the primary heat spreader.

10. The power conversion apparatus of claim 9 , further comprising a secondary heat spreader coupled to an exterior of the first face of the power converter enclosure, wherein the secondary heat spreader is thermally conductive.

11. The power conversion apparatus of claim 10 , further comprising a photovoltaic (PV) module mechanically mounted to the power converter by a mounting portion of the secondary heat spreader.

12. The power conversion apparatus of claim 9 , wherein the power converter enclosure is formed from a polymer.

13. The power conversion apparatus of claim 12 , wherein the power converter has double insulated rating.

14. The power conversion apparatus of claim 9 , wherein the power converter enclosure is at least partially filled with an electrically insulating encapsulating material.

15. The power conversion apparatus of claim 9 , wherein the first portion of the thermal interface is coupled to each of the PCB and the first portion of the primary heat spreader by a thermal adhesive, and the second portion of the thermal interface is coupled to each of the PCB and the second portion of the primary heat spreader by the thermal adhesive.

16. The power conversion apparatus of claim 9 , wherein the PCB is mechanically coupled to the first and the second portions of the primary heat spreader by at least one insulating mechanical fastener.

17. The power conversion apparatus of claim 9 , wherein the PCB is separated into a first PCB portion and a second PCB portion, and wherein the first electrical component is coupled to the first PCB portion and the second electrical component is coupled to the second PCB portion.

18. The power conversion apparatus of claim 9 , wherein the power converter is a DC-AC inverter, the first electrical component is at least a portion of a DC stage of the DC-AC inverter, and the second electrical component is at least a portion of an AC stage of the DC-AC inverter, and wherein the first portion of the primary heat spreader is coupled to the DC stage of the DC-AC inverter and the second portion of the primary heat spreader is coupled to the AC stage of the DC-AC inverter.

19. The power conversion apparatus of claim 9 , further comprising a renewable energy source coupled to the power converter for providing DC input power.

20. The power conversion apparatus of claim 19 , wherein the renewable energy source is a photovoltaic (PV) module.

Assignees

• Enphase Energy Inc

Inventors

• Linderman Ryan

Classifications

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/8506

  Containers · CPC title

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title