Capacitive microphone with insulated conductive plate

Patent metadata

Field	Value
Publication number	US-2016192086-A1
Application number	US-201414582223-A
Country	US
Kind code	A1
Filing date	Dec 24, 2014
Priority date	Dec 24, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A capacitive microphone may include a housing, a membrane, and a first backplate, wherein a first insulating layer may be disposed on a first side of the first backplate facing the membrane and a second insulating layer may be disposed on a second side of the first backplate opposite to the first side of the first backplate. A further insulating layer may be disposed on a side wall of at least one of a plurality of perforation holes in the first backplate. Each conductive surface of the first backplate may be covered with insulating material.

First claim

What is claimed is:

1 . A capacitive microphone comprising:
a housing; a membrane; and a first backplate, wherein a first insulating layer is disposed on a first side of the first backplate facing the membrane and a second insulating layer is disposed on a second side of the first backplate opposite to the first side of the first backplate.

2 . The capacitive microphone of claim 1 , wherein the first backplate is located on an opposite side of the membrane from a sound port formed in the housing.

3 . The capacitive microphone of claim 1 , wherein the first backplate is located on the same side of the membrane as a sound port formed in the housing.

4 . The capacitive microphone of claim 1 , wherein the first backplate is perforated.

5 . The capacitive microphone of claim 4 , wherein further insulating layers are disposed on each conductive surface of the first backplate.

6 . The capacitive microphone of claim 5 , wherein each conductive surface of the first backplate is completely covered with insulating material.

7 . The capacitive microphone of claim 1 , wherein a further insulating layer is disposed on a side wall of at least one of a plurality of perforation holes in the first backplate.

8 . The capacitive microphone of claim 7 , wherein each of the side walls of at least one of the plurality of perforation holes in the first backplate is covered with insulating material.

9 . The capacitive microphone of claim 1 , further comprising a circuit configured to provide a bias voltage to the membrane and first backplate.

10 . A capacitive microphone comprising:
a membrane; and a first perforated backplate, wherein an insulating layer is disposed on an outer wall of one of a plurality of perforation holes in the first perforated backplate.

11 . The capacitive microphone of claim 10 , wherein the first perforated backplate is located on an opposite side of the membrane from a sound port formed in a housing provided around the membrane and first perforated backplate.

12 . The capacitive microphone of claim 1 , wherein the first perforated backplate is located on the same side of the membrane as a sound port formed in a housing provided around the membrane and first perforated backplate.

13 . The capacitive microphone of claim 10 , wherein further insulating layers are disposed on each outer wall of at least one of the plurality of perforation holes in the first perforated backplate.

14 . The capacitive microphone of claim 13 , wherein each conductive surface of the first backplate is completely covered with insulating material.

15 . The capacitive microphone of claim 14 , further comprising a first insulating layer disposed on a first side of the first perforated backplate facing the membrane.

16 . The capacitive microphone of claim 15 , further comprising a second insulating layer disposed on a second side of the first perforated backplate opposite to the first side of the first perforated backplate.

17 . The capacitive microphone of claim 15 , wherein each conductive surface of the first perforated backplate is completely covered with insulating material.

18 . The capacitive microphone of claim 10 , further comprising a second perforated backplate located on an opposite side of the membrane from the first perforated backplate.

19 . The capacitive microphone of claim 18 , wherein an outer wall of one of a plurality of perforation holes in the second perforated backplate is covered with insulating material.

20 . A capacitive pressure sensor comprising:
a conductive substrate; and a membrane, wherein a first insulating layer is disposed on a first side of the membrane facing the conductive substrate and a second insulating layer is disposed on a second side of the membrane opposite to the first side of the membrane.

21 . The capacitive pressure sensor of claim 20 , wherein a further insulating layer is disposed on a side wall of at least one of a plurality of perforation holes in the membrane.

22 . The capacitive pressure sensor of claim 21 , wherein each of the side walls of one of the plurality of perforation holes in the membrane is covered by insulating material.

23 . The capacitive pressure sensor of claim 22 , wherein further insulating layers are disposed on each conductive surface of the membrane.

24 . The capacitive pressure sensor of claim 23 , wherein each conductive surface of the membrane is completely covered by insulating material.

Assignees

• Infineon Technologies Ag

Inventors

• Barzen Stefan
• Brockmeier Andre
• Fueldner Marc
• Pindl Stephan
• Friza Wolfgang

Classifications

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R2410/00

  Microphones · CPC title

• H04R19/016 Primary

  for microphones · CPC title

• H04R23/00 Primary

  Transducers other than those covered by groups H04R9/00 - H04R21/00 {(diaphragms for transducers of the distributed-mode type H04R7/045)} · CPC title