Resistive grid elements having a thermosetting polymer

Patent metadata

Field	Value
Publication number	US-2016180990-A1
Application number	US-201414577688-A
Country	US
Kind code	A1
Filing date	Dec 19, 2014
Priority date	Dec 19, 2014
Publication date	Jun 23, 2016
Grant date	—

Abstract

A resistor grid system includes a resistor strip including multiple pins. The resistor grid system also includes an insulation board coupled to the resistor strip through the multiple pins and configured to provide a structural support. The insulation board is made of a composite material. The composite material includes a nitrogen-containing aromatic thermosetting polymeric resin and a filler.

First claim

1 . A resistor grid system comprising:
a resistor strip comprising multiple pins; and an insulation board coupled to the resistor strip through the multiple pins and configured to provide a structural support, wherein the insulation board is made of a composite material, the composite material comprising a nitrogen-containing aromatic thermosetting polymeric resin and a filler.

2 . The resistor grid system of claim 1 , wherein the insulation board does not include a metal supporting structure.

3 . The resistor grid system of claim 1 , wherein the thermosetting polymeric resin comprises a thermosetting bismaleimide resin.

4 . The resistor grid system of claim 3 , wherein the thermosetting bismaleimide resin is formed from an amorphous resin formed from one or more bismaleimide monomers.

5 . The resistor grid system of claim 3 , wherein the thermosetting bismaleimide resin is formed from a eutectic mixture of two or more bismaleimide monomers.

6 . The resistor grid system of claim 3 , wherein the thermosetting bismaleimide resin is formed by adding a co-curing agent, a toughening agent, a diluent, an additive, or an inhibitor, or any combination thereof.

7 . The resistor grid system of claim 1 , wherein the thermosetting polymeric resin comprises a thermosetting polyimide resin.

8 . The resistor grid system of claim 7 , wherein the thermosetting polyimide resin comprises a condensation product of an aromatic carboxylic acid dianhydride monomer, an aromatic diamine monomer, and a reactive chainstopper.

9 . The resistor grid system of claim 1 , wherein the thermosetting polymeric resin comprises a thermosetting phthalonitrile resin.

10 . The resistor grid system of claim 1 , wherein the filler comprises a granular filler, a fibrous filler, or a combination thereof.

11 . The resistor grid system of claim 1 , wherein the filler comprises a granular filler present in the composite material in an amount of approximately 1 to 80 weight percent based on a weight of the composite material.

12 . The resistor grid system of claim 1 , wherein the filler comprises a fibrous filler present in the composite material in an amount of approximately 2 to 80 weight percent based on a weight of the composite material.

13 . The resistor grid system of claim 1 , wherein the composite material comprises an adhesion promoter.

14 . A method for manufacturing an insulation board of a resistor grid, the method comprising:
adding a filler to a thermosetting polymeric resin to form a molding compound; and thermosetting the molding compound in a mold to produce a composite, wherein thermosetting the molding compound comprises heating the molding compound above 200° C., wherein the insulation board is made of the composite and does not include a metal supporting structure.

15 . The method of claim 14 , wherein adding the filler to the thermosetting polymeric resin comprises adding the filler to a thermosetting bismaleimide resin, a thermosetting polyimide resin, or a thermosetting phthalonitrile resin, or any combination thereof.

16 . The method of claim 14 , wherein adding the filler to the thermosetting polymeric resin comprises adding a granular filler, a fibrous filler, or a combination thereof, to the thermosetting polymeric resin.

17 . The method of claim 14 , comprising adding an adhesion promoter to the compound.

18 . An insulation board for a resistor grid, the insulation board comprising:
a substantially planar element made of a composite material, wherein the composite material comprises a nitrogen-containing aromatic thermosetting polymeric resin and a filler disposed within the nitrogen-containing aromatic thermosetting polymeric resin; and one or more rows of transverse pin holes disposed along a length of the substantially planar element and configured to engage pins of one or more resistive elements of the resistor grid, wherein the insulation board does not include a metal supporting structure.

19 . The insulation board of claim 18 , wherein the thermosetting polymeric resin comprises a thermosetting bismaleimide resin, a thermosetting polyimide resin, or a thermosetting phthalonitrile resin, or any combination thereof.

20 . The insulation board of claim 18 , wherein the filler comprises a granular filler, a fibrous filler, or a combination thereof.

Assignees

• Gen Electric

Inventors

• Yeager Gary William
• Karmarkar Uday Prakash
• Krahn John Raymond
• Cooper Laura Susanne

Classifications

• C08G73/1067

  Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

• B32B3/266

  characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12 · CPC title

• B32B5/00

  Layered products characterised by the non- homogeneity or physical structure {, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts} · CPC title

• B32B2307/702

  Amorphous · CPC title

• Y10T428/24273

  including aperture · CPC title